A heat-conducting gasket containing a hot-melt heat-conducting film and its preparation device

Abstract

The invention relates to the technical field of heat conducting and heat dissipating devices and preparation methods and preparation devices thereof, and in particular relates to a holt-melting heat-conducting film, a heat-conducting liner including the hot-melting heat-conducting film and a preparation method and a preparation device thereof. The hot-melting heat-conducting film includes a heat conducting layer, wherein an adhesive layer is arranged on one surface of the heat conducting layer while a hot melt adhesive layer is arranged on the other surface of the heat conducting layer, a thin film layer is arranged on the adhesive layer, thus being simple in structure and good in heat conducting and heat dissipating effect; the heat conducting liner includes a hot-melting heat-conducting film and a support substrate, and contact point heat sources with a heat dissipating surface, thus improving heat dissipation efficiency; the preparation method comprises primarily forming, thermoforming, cooling for shaping and pulling and cutting to obtain finished products, so that the method is simple, production efficiency is improved, and production cost is reduced; the preparation device includes a control box, and a material rack, a primary forming mold, a thermoforming mold, a cooling shaping mold, an automatic puller, a counter and a cutting device sequentially arranged on an assembly line, one people can operated the whole assembly line, thus being saving in human and material resources.

Description

technical field [0001] The present invention relates to the technical field of heat conduction and heat dissipation devices and their preparation methods and preparation devices, in particular to a hot-melt heat conduction film, a heat conduction gasket containing a heat-melt heat conduction film, a preparation method and a preparation device thereof. Background technique [0002] With the improvement of the processing speed of electronic products, the size of electronic devices is getting smaller and smaller, and the functions are increasing. The excess heat generated will seriously affect the performance, reliability and service life of the entire system. [0003] At present, thermally conductive silica gel sheets are usually used as heat dissipation materials, and their thermal conductivity is within 5W / mk, and is limited by thickness specifications. There are technical constraints for thermal conductivity within 0.5mm or above 5mm, and silica gel is easy to age. Oxane, a...

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Problems solved by technology

Since the graphite layer is directly placed outside the foam layer, powder will be spilled during use, and the graphite flakes are brittle and easy to break during production. It is difficult to realize automatic production and large-scale industrial application

[0006] Chinese invention patent CN103826425A discloses "a high thermal conductivity foam and its preparation method and application", wherein a high thermal conductivity foam includes a PU main material and a composite layer, and the composite layer is arranged outside the PU main material; The composite layer includes PET film and graphite paper. Such a structure is difficult to realize automatic production and cannot realize large-scale industrial application

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