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4314results about How to "Avoid discharge" patented technology

Dual chamber mixing syringe and method for use

A mixing syringe and method for using the mixing syringe are provided. The mixing syringe comprises a housing having a first compartment for containing a first component, an outer plunger having a second compartment for containing a second component, and an inner plunger. Prior to use, a seal separates the first and second components. To prepare the mixture, the seal is pierced and the two components are mixed. The mixing syringe and its method of use are particularly suited to applications in which at least one of the mixture components is a relatively highly viscous material.
Owner:MDC INVESTMENT HLDG

Sputtering target as well as a joined type sputtering target assembly and a method of making such a joined type sputtering target assembly

InactiveUS20070251820A1Abnormal electric discharge be restrainIncrease joining strengthCellsVacuum evaporation coatingCorrosionDiffusion bonding
[Object] It is to provide a sputtering target which has an excellent adhesion to films made of Au, Cu or an alloy containing at least one of Au and Cu and also an excellent corrosion resistance and which can be used to form an Mo—Ti alloy film over a large-sized substrate.[SOLUTION] The present invention provides a sputtering target suitable for use in formation of an Mo—Ti alloy film on a substrate, characterized by that the sputtering target comprises Ti of higher than 50 atomic percentages but not exceeding 60 atomic percentages and the balance of Mo and inevitable impurities and that the relative density of the sputtering target is equal to or more than 98%. The present invention also provides a joined type sputtering target assembly formed by diffusion joining two of more of such sputtering targets, the length of the joined type sputtering target assembly being equal to or larger than 1,000 mm at least one side. The present invention further provides a method of making such a joined type sputtering target assembly.
Owner:ULVAC INC

Peeling apparatus and manufacturing apparatus of semiconductor device

ActiveUS20080113486A1Decrease of electrical resistivityElectrical discharge be preventFinal product manufactureLayered productsEngineeringSemiconductor components
An object is to eliminate electric discharge due to static electricity generated by peeling when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element. A substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers. The film is bent along a curved surface of the pressurization roller on a side of the pressurization rollers, where the film is collected, and accordingly, peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid such as pure water is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
Owner:SEMICON ENERGY LAB CO LTD
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