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186results about How to "High withstand voltage" patented technology

Lithium ion battery exterior material

A lithium ion battery exterior material, includes: a base material layer, and a sequentially laminated adhesive layer, aluminum foil layer provided with a corrosion prevention treated layer, and an adhesive resin layer on one surface of the base material layer; wherein, the adhesive resin layer contains an acid-modified polyolefin resin and a miscible elastomer dispersed in the acid-modified polyolefin at a dispersed phase size of 1 nm to less than 1 μm.
Owner:TOPPAN PRINTING CO LTD

Semiconductor device having super junction MOS transistor and method for manufacturing the same

A semiconductor device having a super junction MOS transistor includes: a semiconductor substrate; a first semiconductor layer on the substrate; a second semiconductor layer on the first semiconductor layer; a channel forming region on a first surface portion of the second semiconductor layer; a source region on a first surface portion of the channel forming region; a source contact region on a second surface portion of the channel forming region; a gate electrode on a third surface portion of the channel forming region; a source electrode on the source region and the source contact region; a drain electrode on a backside of the substrate; and an anode electrode on a second surface portion of the second semiconductor layer. The anode electrode provides a Schottky barrier diode.
Owner:DENSO CORP

Silicon carbide semiconductor device and method for manufacturing the same

A manufacturing method of a silicon carbide semiconductor device includes the steps of: preparing a semiconductor substrate including a silicon carbide substrate, a drift layer and a first semiconductor layer; forming a plurality of first trenches in a cell portion; forming a gate layer on an inner wall of each first trench by an epitaxial growth method; forming a first insulation film on the surface of the semiconductor substrate; forming a gate electrode on the first insulation film for connecting to the gate layer electrically; forming a source electrode on the first insulation film for connecting to the first semiconductor layer in the cell portion; and forming a drain electrode connected to the silicon carbide substrate electrically.
Owner:DENSO CORP +1

Press fit method for high-voltage-resistant PCB with thick copper plate

The invention discloses a press fit method for a high-voltage-resistant PCB with a thick copper plate. The method includes the following steps: S1, cutting, i.e., cutting an outer-layer copper foil, a polyimide medium, pure-glue prepreg and a polyimide copper-clad plate according to required dimensions; S2, inner-layer pattern making; and S3, conducting press fit after plate lamination, the press fit including the first heating stage at the temperature of 100-140 DEG C, the second heating stage at the temperature of 140-180 DEG C, the third heating stage at the temperature of 180-220 DEG C, a warm-keeping stage, the first cooling stage at the temperature of 220-150 DEG C and the second cooling stage at the temperature of 150-100 DEG C. Conventional FR-4 prepreg is replaced by a polyimide material that has higher glass transition temperature and exhibits higher resistance to voltage, so a PCB with a thick copper plate is made to have the excellent resistance to voltage, and polyimide having high glass transition temperature can effectively ensure that resin is fully filled among lines during press fit. Moreover, press fit parameters can be adjusted and the operating time of a high-temperature and high-voltage stage can be prolonged, thus helping polyimide materials to fully fill line gaps in a high-temperature and high-voltage condition.
Owner:SHENZHEN SUNTAK MULTILAYER PCB

Electrolyte for driving ultrahigh voltage large-sized aluminium electrolytic capacitor and solute thereof

The invention provides an electrolyte for driving an ultrahigh voltage large-sized aluminium electrolytic capacitor and a solute thereof. The solute of the electrolyte for driving the ultrahigh voltage large-sized aluminium electrolytic capacitor is a high-molecular solute, and the preparation process comprises the following steps of: uniformly mixing a polyalcohol polymer with hydroxyl at a tail end and a saturated or unsaturated binary or polybasic acid according to a certain proportion; adding a certain amount of catalyst; carrying out condensation and esterification reaction at certain temperature under the condition of decompression, cooling, and separating an ester, wherein the total number of carbon atoms positioned on a main chain of the ester is 15 or more than 15; and dissolving the ester into a solvent to prepare a solution with certain concentration, then introducing ammonia so that the pH of the solution reaches a certain range, and stopping introducing the ammonia so that the ester reacts with the ammonia to form ester ammonium salt, wherein the ester ammonium salt is the high-molecular solute used for the electrolyte. The aluminium electrolytic capacitor has very high voltage resistance, larger ripple current bearing and high reliability and finished product ratio when using the electrolyte prepared by the solute.
Owner:RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN +1

Multi-Layer Capacitor and Mold Capacitor

A mulitilayer A capacitor includes a plurality of dielectric substrates (2) which are layered; a pair of terminal electrodes formed on the plurality of dielectric substrates; a plurality of internal electrodes (3) arranged on each of the dielectric substrates and having outer edges (30) opposed apart by a predetermined interval, wherein at least one of the internal electrodes (3) is arranged apart from the adjacent internal electrode (3) by the maximum interval (5) at the center of the outer edges (30).
Owner:PANASONIC CORP

Production method of high specific energy super capacitor carbonaceous electrode material

The invention discloses a preparation method for the carbon electrode material of a high-energy-density super capacitor which is characterized by pre-carbonizing a refinery coke or other form bodies rich in carbon for 0.5 to 5 hours under the temperature of 400 to 900 DEG C; then carrying out ball milling on the refinery coke or other form bodies rich in carbon to 4 to 30 Mum; then carrying out dipping and mixing with KOH at a weight percentage ratio of 1: 3 to 1: 6 (or simultaneously adding the metal salt of 5 to 20wt percent); after physical dehydration, chemical dehydration and activating hole making by being cooperated with catalyzing are carried out on the matters respectively under the temperatures of 100 to 250 DEG C, 300 to 500 DEG C and 700 to 1000 DEG C, then surface chemical treatment in an H2 atmosphere is carried out on the matters under the temperature of 500 to 900 DEG C to manufacture the carbon electrode material. The invention adopts the pre-carbonizing or the combining technology of catalyzing chemical cooperated with activation to manufacture the carbon electrode material; the invention has higher energy density and power density compared with the existing carbon electrode material as the power storage principle of the invention is different from a double electric layer power storage principle.
Owner:EAST CHINA UNIV OF SCI & TECH

Bobbin bracket structure of transformer

The invention discloses a structure for transformer bobbin bracket, which takes a shape of a hollow pipe body. A plurality of separators are arranged on the transformer bobbin bracket and at least one trans-line groove is arranged on the separator and used for providing space for the coil to cross the separator; the trans-line groove is designed to be slantingly tangent with the separator so as to increase the laying distance of the coil, and the depth of the trans-line groove presents a slant shape or ladder shape which is higher at one side and lower at the other side to ensure that the line of the coil enters at a higher position and goes out at a lower position when the lines of the coil are laid so as to increase the relative distance between two neighboring groups of coils of the separator, thereby effectively increasing the withstanding voltage of the separator of the bobbin bracket and relatively shortening the thickness of the separator of the bobbin bracket so as to further shorten the size of the transformer.
Owner:TDK TAIWAN

Power supplying apparatus, method of operating the same, and solar power generation system including the same

There are provided a power supplying apparatus, a method of operating the same, and a solar power generation system including the same. The power supplying apparatus includes: a power supply unit generating a direct current (DC) input signal; a main circuit unit including a plurality of flyback converter circuits connected to the power supply unit to generate a DC output signal; and a control circuit unit controlling an operation of the main circuit unit, wherein the control circuit unit connects the plurality of flyback converter circuits to each other in series or in parallel according to a level of the DC input signal. Therefore, even in the case in which the level of the DC input signal is high, a circuit maybe configured using a circuit device having a low withstand voltage range and damage and deterioration of the circuit device may be prevented.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD +1

Method for manufacturing hybrid transparent electrode and hybrid transparent electrode

The present invention relates to a method for manufacturing a hybrid transparent electrode and a hybrid transparent electrode, the method comprising: an ink composition filling step for filling a conductive metal ink composition into a groove on a base material having the groove; a remaining ink composition filling step of forming an electrode pattern by filling the groove with the conductive metal ink composition remaining on the surface of the base material, as the conductive metal ink composition is filled in the groove; and a conductive layer forming step of forming a conductive layer comprising a conductive material on top of the electrode pattern.
Owner:INKTEC CO LTD

Trapezoidal evaporation metalizing polypropylene film capacitor

The invention relates to the technical field of capacitors, and discloses a trapezoidal evaporation metalizing polypropylene film capacitor, which comprises a casing, capacitor cores, a leading-out terminal and a leading-out electrode, wherein the capacitor core comprises a high temperature-resistant polypropylene film, the polypropylene film is evaporated with a metal aluminum layer as an electronic moving area under the high-vacuum environment, the moving area is of a trapezoidal structure, the edge of the moving area is thickened and evaporated with a pure zinc layer as a thickening area, the evaporation trapezoidal square resistance in the moving area is controlled to 30-50 ohms, the square resistance in the thickening area is controlled to 2-4 ohms, and two to three capacitor cores are parallelly connected in the capacitor. The capacitor has the advantages that the voltage resistant property is high, the loss is little, the effective current can be withstood, the impact capacity is high, the temperature rise is low, the self equivalent serial resistance of the capacitor is little, the anti-oxidizing capacity is high, the safety and reliability are high, the service life is long, the storage is easy, the heat radiating property is good, and the cost is low.
Owner:宁国市裕华电器有限公司

Method for preparing high voltage-resisting chip type ceramic capacitor

The invention provides a method for preparing a high voltage-resisting chip type ceramic capacitor and relates to the technical field of electronic information materials and elements. The method comprises the procedures of dispersing of ceramic slurry, curtain coating of ceramic membranes, printing of inner electrode, staggered lamination, uniform pressing, cutting, plastic removal, sintering, chamfering, end coating and silver electrode firing, wherein a solvent for the ceramic slurry adopts methylbenzene and ethanol, during printing of inner electrode, the inner electrode is made of a silver palladium alloy which is sintered at a low temperature, during end coating, the end electrode is made of silver (Ag), particularly, during dispersing of ceramic slurry, ceramic powder adopts Ba-Ti-Nd based ceramic powder, particle sizes of the Ba-Ti-Nd based ceramic powder are within a range of 0.22-0.95mu m of spherical or approximately spherical bodies, and the solvent for the ceramic slurry adopts a mixture of the methylbenzene and the ethanol in a proportion of (1-2.5):1. By the aid of the method for preparing the high voltage-resisting chip type ceramic capacitor, the high-frequency high voltage-resisting chip type ceramic capacitor can be manufactured effectively, and simultaneously, the manufacturing cost can be reduced effectively.
Owner:BEIJING YUANLIU HONGYUAN ELECTRONICS TECH

Insulated gate type semiconductor device

An insulating gate type semiconductor device being capable of easily depleting an outer periphery region is provided. The insulating gate type semiconductor device includes: first to fourth outer periphery trenches formed in a front surface of a semiconductor substrate; insulating layers located in the outer periphery trenches; fifth semiconductor regions being of a second conductive type and formed in ranges exposed to bottom surfaces of the outer periphery trenches; and a connection region connecting the fifth semiconductor region exposed to the bottom surface of the second outer periphery trench to the fifth semiconductor region exposed to the bottom surface of the third outer periphery trench. A clearance between the second and third outer periphery trenches is wider than each of a clearance between the first and second outer periphery trenches and a clearance between the third and fourth outer periphery trenches.
Owner:TOYOTA JIDOSHA KK

Machining method of metal packaging shell of large-scale and large-power integrated circuit

The invention relates to a machining method of a metal packaging shell of a large-scale and large-power integrated circuit. The shell comprises a base and an outer cover, wherein the base is composed of a base plate, a plurality of glass blanks and a plurality of terminal pins; a plurality of first through holes for holding the terminal pins and the glass blanks are formed on the base plate; and the terminal pins are arranged inside the first through holes on the base plate through the glass blanks. When the base and the outer cover are machined well, required elements such as integrated circuits and modules are installed on the base; and the outer cover is welded with the base; the integrated circuits, the modules and the like are fixed on the base of the metal shell, and are connected with external tested devices through leading-out terminals of the terminal pins, thereby accomplishing the output, input and detection and control functions of system signals. The outer cover is welded with the base; the integrated circuits and the modules are sealed inside the metal shell, so that both the functions of signal output, detection and control are achieved, and the internal circuit is prevented from being influenced by various external severe environments.
Owner:中国电子科技集团公司第四十研究所

High withstand voltage field effect semiconductor device with a field dispersion region

It is intended to provide a high withstand voltage field effect type semiconductor device that relaxes electric fields in a semiconductor substrate without thickening thickness of a drift region and achieves withstand-ability against high voltage without sacrificing ON-voltage, switch-OFF characteristics, and miniaturization. A field effective type semiconductor device comprises emitter regions 100, 104 and gate electrodes 106 and the like on a surface (upper surface in FIG. 2), a collector region 101 and the like on the other surface (lower surface in FIG. 2), wherein N− field dispersion regions 111 of low impurity concentration are arranged between P body regions 103 facing to gate electrodes 106 and an N drift region 102 below P body regions 103. Thereby, electric field between collector and emitter is relaxed and high withstand voltage field effect type semiconductor device is realized. Another field dispersion region can be arranged between the N drift region 102 and P+ collector region 101 below the N drift region 102.
Owner:TOYOTA JIDOSHA KK
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