931 results about "Tetrafluoroborate" patented technology

The invention discloses an electrodeposition method, an electrodeposition solution and a method for preparation of a rare earth permanent magnetic material by electrodeposition. Being used for deposition of heavy rare earth elements on an R<2>-T-B type sintered mother alloy surface, the method comprises the steps of: 1. providing an electrodeposition solution, which comprises a heavy rare earth element containing main salt, an induction salt inducing heavy rare earth element deposition and an organic ionic liquid serving as the solvent, wherein the main salt is a tetrafluoroborate of heavy rare earth element; and 2. subjecting the R<2>-T-B type sintered mother alloy to electroplating in the electrodeposition solution, and controlling the temperature of the electroplating process at 0-200DEG C. According to the invention, heavy rare earth elements can deposit rapidly on the R<2>-T-B type sintered mother alloy surface, thus saving the electrodeposition process time and improving the production efficiency. The plating layer thickness is larger and can reach 10-40 micrometers.

A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

Tetrafluoroboric acid and an organic nitrogenous base, related compounds and compositions, as can be used in conjunction with various methods of cleaning and / or the treatment of substrate surfaces.