122results about How to "Offset stress" patented technology

A steel structure including pre-stressing brackets for improving load-carrying capacity and serviceability comprises: a steel girder; a plurality of connecting brackets connected to the bottom surface of the steel girder spaced and apart from one; and a cover plate connected to the bottom surfaces of the connecting brackets. Since the cover plate is installed regardless of the connecting portion of the steel girder, pre-stressing section can be consecutively formed therefore pre-stress effect is improved. Moreover, since the connecting brackets space the cover plate a constant distance from the steel girder, the moment of inertia is increased so the span of a bridge might be increased.

The invention discloses a method for restraining warping of an asymmetric printed circuit board. According to the method for restraining the warping of the asymmetric printed circuit board, when the thicknesses of two core boards which are arranged on the corresponding positions of the two sides of a symmetrical mirror plane of the multi-layer printed circuit board are not equal, two prepregs with different thicknesses are arranged on the corresponding positions of the two sides of the symmetric mirror plane. When the thicknesses of the two core boards which are arranged on the corresponding positions of the two sides of the symmetrical mirror plane of the multi-layer printed circuit board are not equal, different kinds of thermal expansion will be generated, stress generated on one side of the symmetrical mirror plane and stress generated on the other side of the symmetrical mirror plane in the process of lamination and shrinking of resin are not equal, and therefore the warping of the printed circuit board is caused. The two prepregs with different thicknesses are arranged on the corresponding positions of the symmetric mirror plane, the prepregs generate stress, the direction of the stress generated by the prepregs is opposite to the direction of the warping of the core board, and therefore the stress generated by the core boards is counteracted. Therefore, the effect of restraining the warping is achieved, the production qualified rate of the printed circuit board is improved, the production cost is reduced, and the production cycle is shortened.

The invention relates to a frame baffle for fixing an electromagnetic casting magnetic field-aided generator. Upper and lower sides of the frame baffle are provided with symmetrical fabrication holes or unsymmetrical fabrication holes, wherein the aim that the upper side is provided with the fabrication holes is for an incoming cable, a cooling water pipe and a fixing bolt to pass through; and the aim that the lower side is provided with the fabrication holes is to counteract nonuniform warp and deformation caused by a thermal stress, namely symmetrical sides of a slot and a hole of the frame baffle are provided with the corresponding fabrication holes for counteracting expansion and distortion caused by the thermal stress to eliminate the great-degree warp and deformation caused by opening the fabrication holes only on the single side. The nonuniform thermal stress deformation and warp of the frame baffle caused by heating are avoided by regulating and optimizing the positions and the number of the fabrication holes of the frame baffle so as to prolong the service life of the baffle from a plurality of weeks to more than one year and greatly reduce the consumption of auxiliary materials; and because the serious thermal stress warp is eliminated, the service life of a packing frame of a casting mold is greatly improved.

The invention discloses a manufacturing process of a high-performance substrate. The manufacturing process of the high-performance substrate comprises the following steps of line cutting, first coarsegrinding, first annealing, second coarse grinding, fine grinding, chamfering, cleaning, second annealing, copper polishing and polishing, wherein a superfine grinding machine is adopted, double-sidedfine grinding and thinning are carried out on a sapphire substrate. Warp is controlled to be 15 micrometres after the fine grinding is carried out, and Bow is controlled to be 4 micrometres or within; and after the scheme is adopted, the manufacturing process of the high-performance substrate reduces maximally the deformation influence of stress on the fine grinding, so that the substrate can obtain higher flatness and lower stress reaction in the fine grinding.

The invention relates to a burner comprising a central fuel supply arrangement (27), an annular air channel (18) surrounding said central fuel supply arrangement (27), for supplying combustion air and swirl blades which are arranged in the annular air channel (17), comprising first fuel nozzles (21) for introducing an essentially gaseous fuel into the combustion air, and second fuel nozzles (23) for introducing an essentially gaseous fuel into the combustion air. The first fuel nozzles (21) are supplied by a fuel distributor supply in the fuel supply arrangement (27), and the second fuel nozzles (23) are supplied by a fuel distributor channel (31) in the fuel supply arrangement (27). The fuel distributor supply comprises a supply pipe (55) which is connected downstream of the swirl blade (19), and an annular attachment (60). The supply pipe (55) is connected downstream of the annular attachment (60) and said annular attachment (60) is mounted upstream of the fuel distributor channel (31) when seen in the direction of flow. The invention also relates to a gas turbine comprising said type of burner.

The invention provides a laminated battery cell and a lithium ion battery. The laminated battery cell comprises positive plates and negative plates, the positive plates and the negative plates are alternately laminated, and a diaphragm is arranged between every two adjacent pole pieces; each pole piece positioned on the outermost side comprises a current collector, an active layer and a coating, the active layer is positioned on one side, close to the interior of the battery cell, of the current collector, the coating is positioned on one side, far away from the interior of the battery cell, of the current collector, and a heat conduction material and / or a flame-retardant material are / is arranged in the coating. According to the invention, the problems of consumption of active lithium on the outermost layer of the laminated structure and reduction of the first effect and the capacity are solved, the problem of rolling damage caused by rolling stress of a single-sided coating pole pieceis also solved, more importantly, the heat conduction material and / or the flame retardant material can improve the safety performance of the laminated core, such as heat dissipation and flame retardance, and the safety and the practicability of the battery cell are greatly improved.

The present invention provides a flexible display device including: a display module; an accommodating casing defined with a hollow cavity, an open channel defined in the accommodating casing, a chain lock disposed in the open channel, a resilient member, a first roller, and a second roller disposed in the hollow cavity, the resilient member forming a pre-pulling on the display module; the chain lock disassembling the display module into a first assembly and a second assembly to be rolled up on the first roller and the second roller respectively, and configured to combine the first assembly and the second assembly into the display module.

The invention discloses a manufacture method for an insulated gate bipolar transistor (IGBT) device. Before a metal layer of an IGBT separation device deposits, a film with positive stress is formed at the back of a silicone wafer of a formed device structure. The manufacture method can effectively offset stress of the metal layer, improves warping degree of the silicon wafer and enables follow-up photoetching and etching on the metal layer to be constructed normally.

A pressure sensor includes: a pressure conversion unit and a signal processing circuit installed in a semiconductor substrate. The pressure conversion unit includes: a diaphragm formed by partially thinning the semiconductor substrate; and a plurality of piezo resistive elements formed on a surface of the diaphragm. The signal processing circuit is constituted by a complementary metal-oxide semiconductor (CMOS) integrated circuit formed in a p-type conductive region disposed around the diaphragm on the surface of the semiconductor substrate, and the piezo resistive elements are provided by forming an n-type conductive region in the p-type conductive region on the surface of the diaphragm by diffusion of n-type impurities and diffusing p-type impurities in the n-type conductive region.

The invention relates to a ceramic substrate and a manufacturing method thereof. The manufacturing method comprises the steps of printing a first metal layer on a first surface of the ceramic substrate having a conduction hole, and printing a second metal layer on a second surface opposite to the first surface, so that a conductive circuit is formed, a pad area is formed on the first surface, anda thickness of the second metal layer is greater than a thickness of the first metal layer; printing a welding flux layer on the first surface; attaching an encapsulation frame on the welding flux layer; and sintering, under a vacuum condition, a ceramic metal lining plate attached with the encapsulation frame. According to the ceramic substrate and the manufacturing method thereof, the residual stress caused by an asymmetric structure of a full plate is effectively reduced, and thus the warping degree of the ceramic substrate is effectively improved, and a rear-end client is convenient to perform work such as chip full-plate encapsulation and finished product cutting; and therefore, the product yield and efficiency are improved.

The invention provides a home decoration toilet pipe-side floor drain treatment process. The treatment process comprises the steps of S1, digging out a groove in the concrete floor around the root of a pipeline, removing residue in the groove and cleaning the groove by use of water, S2, coating the groove with an interface waterproof agent once or twice under the condition of moist, S3, evenly mixing a multifunctional emulsion with quick-setting cement in the weight ratio of (0.3-0.5): 1 into a paste, applying the paste into the groove, and compacting and trowelling, S4, after the filler in the groove is solidified, coating the root and the four sides of the pipeline with a secondary pipe fixation waterproof glue. According to the home decoration toilet pipe-side floor drain treatment process, at least three waterproof layers, namely the interface waterproof agent layer, the mixed layer of the multifunctional emulsion and the quick-setting cement, and the waterproof layer of the pipe fixation waterproof glue are provided. Due to triple waterproofing operations, the waterproof effect is excellent and the service life is long.

The invention provides a convex point structure of a semiconductor wafer. The convex point structure comprises a wafer, a regenerative passivation layer formed on the upper surface of the wafer, a polymer material layer formed on the lower surface of the wafer and back adhesive layers formed on all exposed surfaces of the polymer material layer. Compared with the prior art, the forming method for the convex point structure of the semiconductor wafer, provided by the invention, has the advantages that the wafer warppage can be reduced, and thus, the fabrication of processes such as test, printing and ball implantation before cutting is facilitated.