Low-dielectric-constant glass fibers having a glass composition comprising, by weight %, 50 to 60% of SiO2, 10 to 18% of Al2O3, 14% to less than 20% of B2O3, 1% to less than 6% of MgO, 2 to 5% of CaO, 0.5 to 5% of TiO2, 0 to 0.3% of Li2O, 0 to 0.3% of Na2O, 0 to 0.5% of K2O and 0 to 2% of F2, the content of MgO+CaO being 4 to 11% and the content of Li2O+Na2O+K2O being 0 to 0.6%. The glass fiber has a low dielectric constant and a low dielectric tangent, is excellent in productivity and workability and is also excellent in water resistance, and the glass fiber is suitable for reinforcing printed wiring boards for high-density circuits.