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Synthetic resin adhesive for E0/E1 level shaving board

A synthetic resin and adhesive technology, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve water resistance, aging resistance decline, poor mechanical properties of wood-based panels, wood-based panel mechanics High strength and other problems, to achieve good bonding strength, suitable curing time and stability, and eliminate the effect of dehydration process

Inactive Publication Date: 2009-01-21
DARE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a synthetic resin adhesive for E0 / E1 grade particleboard, which overcomes the reduction of crosslinking degree of the existing synthetic resin adhesive for E0 / E1 grade particleboard, prolongation of curing time, decline in water resistance and aging resistance, and storage Compared with ordinary urea-formaldehyde resin, the urea-formaldehyde resin adhesive produced by using high-concentration formaldehyde as a raw material has low free formaldehyde content and high storage stability. Good water solubility, high mechanical strength of manufactured wood-based panels, low formaldehyde emission; and it can also eliminate the dehydration process, reduce the amount of sewage, reduce energy consumption, reduce resin synthesis time, reduce production costs, and at the same time improve reactivity and reduce free formaldehyde content

Method used

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Examples

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Embodiment 1

[0031] Example 1 is a synthetic resin adhesive for E0 / E1 grade particleboard according to the present invention, which is a melamine-modified urea-formaldehyde resin.

[0032]The mass ratio of the melamine-modified urea-formaldehyde resin reaction material is 99.8% melamine 4.7%, 98.0% urea 44.3%, 48.0% formaldehyde 49.7%, auxiliary agent 1.03%, PVA 0.21%, and the total molar ratio is 1.10. The auxiliary agents include accelerator a, compound auxiliary agent b and formaldehyde scavenger c, respectively ST45, ET45 and FC-3 produced by Yonggang Weifang (Beijing) Technology Co., Ltd. purchased from the market. The above materials are reacted to prepare a synthetic resin adhesive, which is finally prepared by mixing the glue.

[0033] The method for preparing of described modified urea-formaldehyde resin is as follows:

[0034] Feed amount of reaction materials

[0035] 1. Formaldehyde F: 17500KG

[0036] 2. Urea: U1=1550KG, U2=5250KG, U3=5000KG, U4=2500KG, U5=1300KG

[0037] ...

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Abstract

The invention discloses a synthetic resin adhesive for an E0 / E1 grade flakeboard, which is melamine modified urea-formaldehyde resin; formaldehyde with the concentration of 48 percent in mass percentage is adopted as a raw material; the adhesive comprises the following reaction materials in percentage by mass: 4.0 to 5.0 percent of melamine, 43.0 to 45.0 percent of urea, 48.0 to 51.0 percent of formaldehyde, 1.00 to 1.10 percent of addition agent, 0.20 to 0.22 percent of polyvinyl alcohol and proper acid and alkali; the total molar ratio is between 1.08 and 1.11; and the materials are reacted and synthesized, thereby preparing the adhesive. The high-concentration formaldehyde is adopted as the raw material; the adhesive has excellent bonding strength, proper curing time, good storage stability and the free formaldehyde content of between 0.06 and 0.08 percent; with the adhesive, the E1 and E0 flakeboard with excellent quality can be stably produced; and the adhesive has the advantages of low adhesive application amount, strong process adaptability, rapid curing, etc.

Description

technical field [0001] The invention relates to an adhesive for artificial boards, in particular to a synthetic resin adhesive for particle boards meeting environmental protection requirements. Background technique [0002] The conventional particleboard manufacturing process is to process wood or various residues in wood production into shavings, add a certain amount of adhesive, and then make finished products through stirring, paving and molding, hot pressing and other processes. Due to the excellent gluing performance and low cost of synthetic resin adhesives, synthetic resin adhesives are basically used in the wood industry and particle board manufacturing at present. The adhesive used in wood-based panels is mainly urea-formaldehyde resin adhesive, accounting for more than 90% of the total amount. Formaldehyde is contained in various synthetic resin adhesives currently used. [0003] Urea-formaldehyde resin adhesives have disadvantages such as poor water resistance, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/30
Inventor 林宏治
Owner DARE TECH
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