The invention discloses a PCB type TVS
diode package and a preparation process thereof, comprising a BT resin PCB board and an
epoxy resin, wherein the outer surface of the BT resin PCB board is provided with a TVS tube, and the
epoxy resin is arranged on the upper surface of the TVS tube. A BT resin (bismaleimide (BMI) and
triazine-based resin) is use as a substrate for that PCB positive and negative sides of the
package and the preparation proces of the PCB-type TVS
diode, and an
etching line is used as a conduction, the substrate replaces a
metal frame, and then the process flow is taken asa
solid crystal, a bonding line, a
stamping die, a
cutting, a testing, a braiding and a warehousing; BT resin has a very
high adhesion to the external
sealant (
epoxy resin) when molding, It is much higher than the combination with the
metal frame, so that the product has higher
air tightness, meanwhile, the expansion coefficient is close when the
metal frame is heated and expanded, and the
internal stress is smaller, so as to avoid the breakage problem of the metal frame when the metal frame is welded at the
client end, and the product has higher reliability and quality.