43results about How to "Avoid circuit breaker problems" patented technology

The invention discloses a power supply device. The power supply device comprises a cuboid cover and a power supply unit arranged on the inner sides of the cover, supports are arranged on the two opposite inner side walls of the cover respectively, the middles of the supports are attached to the inner walls of the cover, the two ends of the supports are bent inwards to form U-shaped structures, and the power supply unit is clamped on the inner sides of the U-shaped structures of the two supports; baffles are arranged on the lower end faces of the two sides of the power supply unit, a rotating shaft is arranged between the baffles, the two ends of the rotating shaft are rotationally connected to the baffles respectively, supporting strips are arranged on the inner sides of the supports, and the rotating shaft is attached to the supporting strips and relatively rotates. According to the power supply device, as the cover structure is adopted, the power supply unit is centrally installed on the inner sides of the cover, and a power source can be conveniently inserted and connected; meanwhile, as the supports provided with vibration-reducing mechanisms are adopted, the vibration resistance of the overall structure can be improved, and better stability can be achieved.

The invention discloses a method for packaging a cadmium zinc telluride pixel detector module. The method is used for solving the technical problem that according to an existing method for packaging the cadmium zinc telluride pixel detector module, the relative position accuracy of connecting adhesive points is poor. According to the technical scheme, a silver conductive adhesive is adopted as an inversion connecting medium, a three-dimensional automatic adhesive dispenser is utilized for accurately controlling the size and the relative position of the adhesive points in a matrix adhesive dispensing mode, an inversion welding instrument is also utilized for controlling accurate walking of a transmission system in a two-CCD framing and focusing working mode, the problem that pixel electrodes on a cadmium zinc telluride pixel electrode detector element are correspondingly connected with metal electrodes on a substrate in a one-to-one mode is solved, and the short-circuit or breaking phenomenon of the pixel electrodes is avoided. Due to the adoption of the program-controlled matrix adhesive dispensing mode, the relative position between the adhesive points is effectively controlled, the precision reaches 10 micrometers, meanwhile, due to the adoption of a flow controller, the size of the obtained minimum adhesive point is 150 micrometers, and the short-circuit problem of the pixel electrodes is effectively solved.

A parallel array-type small refrigerator and a production thereof are provided. The refrigerator is a technic for enhancing temperature control on a laser device and a computer CPU, improving heat sink in a chip, thereby increasing a work efficiency of the chip, prolonging a life time, a layer structure and position array of the refrigerator are: a silicon substrate (6) of P-type semiconductors, a buffer layer (7) of the P-type semiconductors, a first adulteration layer (8) of the P-type semiconductors, a superlattice layer (9) of the P-type semiconductors, a second adulteration layer (10) of the P-type semiconductors, a light adulteration layer (11) of the P-type semiconductors, and a metal layer (13) in order; a silicon dioxide isolation layer (12) is positioned between the P-type semiconductors and between the metal layer and the first adulteration layer of the P-type semiconductors. A production process uses an oxide isolation process to form the parallel array-type small refrigerator, thus, a yield of device manufacturing is increased, and a contact area is reduced at the same time, thereby an interface contact resistance is largely reduced, refrigeration efficiency is largely increased.

The embodiment of the invention provides an OLED (Organic Light Emitting Diode) substrate, a preparation method thereof and an OLED display device, relates to the technical field of display, and can solve the problem of disconnection or poor electric conduction evenness caused by the breakage of a second electrode layer on the junction position of the side surface and the first surface, which arepositioned in one opening area, of a pixel definition layer. The OLED substrate comprises a plurality of first electrodes arranged on a bottom plate, a pixel definition layer, a light emitting layer,a second electrode layer and an auxiliary electrode, wherein the pixel definition layer comprises a plurality of opening areas, and one first electrode is exposed out of each opening area; the light emitting layer is arranged in each opening area; the second electrode layer is arranged on the light emitting layer and covers the pixel definition layer; the auxiliary electrode extends to the first surface from the side surface, which is positioned in the opening area, of the pixel definition layer to the first surface and is in contact with the second electrode layer; and the first surface is the surface, which is far away from the bottom plate, of the pixel definition layer.

The invention discloses a cathode emission testing apparatus and system for microwave vacuum electronic devices. In the apparatus, an anode and an electrode are mounted on the same flange; a cathode is connected to the electrode; the flange is fixed at an end of a tube; and both ends of the tube are sealed with seal rings. The apparatus and the system in the invention have the advantages of being simple and easy to implement and being capable of very easily and conveniently controlling the distance and depth of parallelism between the anode and the cathode.

The invention discloses an elastic connection device for battery cells and is mainly applied to elastic connection in series of the battery cells. The elastic connection device comprises a conductive elastic piece used for being connected with another battery cell and an insulating clamping seat for fixing a battery cell. The another battery cell inserted into the left side of the conductive elastic piece is fixed by elastic claws in the elastic connection device for the battery cells, the conductive elastic piece is not required to be inserted into the another battery cell for welding connection, and the problem of an open circuit of the battery cells due to welding spot falling caused by vibration is solved. Lugs are arranged on two sides of an inwards bending position of each elastic claw in the elastic connection device for the battery cells, so that the contact area between the conductive elastic piece and the inserted another battery cell is increased, and pressure drop and energy loss caused by connection with the another battery cell are reduced; the conductive elastic piece produces elastic support for the another battery cell inserted into the conductive elastic piece through secondary deformation, and the elastic connection device is convenient to mount and firm in fixing.

A laboratory thermostat features a heating and / or cooling device for temperature control of a liquid bath medium located in a bath tank. The laboratory thermostat has an early-warning system with a control device for a low liquid level in the bath tank and an evaluation device that can realize at least an acoustic and / or visual warning message for maintaining the temperature control process. Due to the integrated early-warning system, when the liquid level decreases, the user of the laboratory thermostat is made aware in due time before undesired shutdown by a low-liquid-level protection device, so that lost temperature control fluid can be immediately refilled before the safety shutdown is triggered by the low-liquid-level protection device.

The office table comprises: a table body, wherein a first threading hole is formed in a table plate of the table body so that a connecting wire of electronic equipment can be arranged below the tableplate from the upper portion of the table plate in a penetrating mode; a lower cabinet, whrein the lower cabinet is arranged below the table plate, the lower cabinet is provided with a containing space, a socket capable of being connected with a connecting wire is arranged on the lower cabinet, a jack panel of the socket faces the exterior of the lower cabinet, a power connection panel of the socket faces the containing space of the lower cabinet, and a second threading hole is formed in a bottom plate of the lower cabinet so that a power connection wire of the socket can penetrate out of thelower cabinet. Through the arrangement, the socket is fixedly arranged on the lower cabinet to replace a power strip in the prior art, and a connecting wire of the socket is accommodated in the lowercabinet, so that a circuit is prevented from being exposed, the space below a desktop is clean and tidy, the problem of open circuit of electronic equipment caused by kicking of the connecting wire byoffice staff can be avoided, and potential safety hazards are reduced; and the influence on the office efficiency caused by the open circuit of the electronic equipment is reduced.

The invention discloses an Internet of Things router. The Internet-of-things router comprises an Internet-of-things router body, Router mounting base, Arc-shaped protective cover, Telescopic connecting rod, First clamping buckle, Second clamping buckle, a third clamping buckle and a fourth clamping buckle, the Internet of Things router body is mounted on the upper surface of the router mounting base; a buffer pad is arranged between the bottom of the Internet of Things router body and the router mounting base; According to the invention, the arc-shaped protective cover and the protective net are additionally arranged on a traditional router; the waterproof and dustproof effects are provided for the waterproof and dustproof effects; meanwhile, the protective net is installed on the upper surface of the Internet of Things router body, stubborn dust accumulation can be prevented from influencing the heat dissipation function of the router, damage to the router due to too high temperatureis avoided, meanwhile, outdoor installation is achieved, and baffles at the bottoms of the two sides of the arc-shaped protective cover can guide rainwater to prevent the router from being splashed wet to cause the problem of open circuit.

The invention provides a touch panel. The touch panel comprises a first shielding layer arranged on one region on the surface of a substrate, a second shielding layer arranged on the first shielding layer and provided with a communication hole, an induction electrode layer arranged on the other region on the surface of the substrate, further arranged between the first shielding layer and the second shielding layer in an extending mode and partially exposed through the communication hole, and a conductive filling layer arranged in the communication hole and electrically connected with the induction electrode layer. The invention further provides a manufacturing method of the touch panel. Thus, the short circuit condition is prevented from occurring when the induction electrode layer on the touch panel extends to the shielding layers and the yield of the touch panel is effectively increased.

The invention discloses a break-resistant and wear-resistant household wire and relates to the technical field of household wires. The break-resistant and wear-resistant household wire comprises a lead frame, wherein three wire sheaths are arranged on the surface of the lead frame in a surrounding manner at equal distances; wires are inserted into the three wire sheaths separately; connecting seats are fixedly arranged on an inner wall of each wire sheath; a connecting rod is arranged at one end, far away from the inner wall of the corresponding wire sheath, of each connecting seat; and one end, close to the corresponding connecting seat, of each connecting rod passes through the connecting seat and extends into the connecting seat. According to the break-resistant and wear-resistant household wire, through the arrangement of elastic sheets, a first reinforcing layer, second reinforcing layer and elastic rubber filaments, the stability of the household wire is effectively improved; fracture of the wire due to distortion of the wire in the using process is avoided; the transmission quality of the wire is effectively improved; meanwhile, the problem of an open circuit of the wire isalso solved; the household wire is convenient for people to use; and the life of the household wire is prolonged.

The invention discloses an anti-cracking plastic frame circuit manufacturing method, and relates to the technical field of circuit printing. The anti-cracking plastic frame circuit manufacturing method comprises the following steps: (1) nano-scale silver paste ink is printed on a film by a silk screen to form a film circuit; part edge of the film is inwards recessed; the inwards recessed part of the edge of the film forms an embedded part; the other part forms a limiting part; the limiting part is as high as a molding cavity of an injection mold; and the embedded part is lower than the molding cavity of the injection mold; (2) the film circuit is set up in the molding cavity of the injection mold; and the lower edge of the limiting part is butted against the bottom of the molding cavity; and (3) molten plastic is injected into the mold to manufacture an integrated injection part. Film and plastic bonding processes are once finished in the injection mold; and the film circuit and the main plastic part are firmly combined as a whole body, so that the effects of no falloff, no oxidization and no escape of solvent micromolecules are achieved. The anti-cracking plastic frame circuit manufacturing method optimizes the structure of the film circuit, and greatly improves the heat shock resistance and the salt fog resistance of products.

The invention discloses a PCB type TVS diode package and a preparation process thereof, comprising a BT resin PCB board and an epoxy resin, wherein the outer surface of the BT resin PCB board is provided with a TVS tube, and the epoxy resin is arranged on the upper surface of the TVS tube. A BT resin (bismaleimide (BMI) and triazine-based resin) is use as a substrate for that PCB positive and negative sides of the package and the preparation proces of the PCB-type TVS diode, and an etching line is used as a conduction, the substrate replaces a metal frame, and then the process flow is taken asa solid crystal, a bonding line, a stamping die, a cutting, a testing, a braiding and a warehousing; BT resin has a very high adhesion to the external sealant (epoxy resin) when molding, It is much higher than the combination with the metal frame, so that the product has higher air tightness, meanwhile, the expansion coefficient is close when the metal frame is heated and expanded, and the internal stress is smaller, so as to avoid the breakage problem of the metal frame when the metal frame is welded at the client end, and the product has higher reliability and quality.

The invention discloses a method for packaging a cadmium zinc telluride pixel detector module. The method is used for solving the technical problem that according to an existing method for packaging the cadmium zinc telluride pixel detector module, the relative position accuracy of connecting adhesive points is poor. According to the technical scheme, a silver conductive adhesive is adopted as an inversion connecting medium, a three-dimensional automatic adhesive dispenser is utilized for accurately controlling the size and the relative position of the adhesive points in a matrix adhesive dispensing mode, an inversion welding instrument is also utilized for controlling accurate walking of a transmission system in a two-CCD framing and focusing working mode, the problem that pixel electrodes on a cadmium zinc telluride pixel electrode detector element are correspondingly connected with metal electrodes on a substrate in a one-to-one mode is solved, and the short-circuit or breaking phenomenon of the pixel electrodes is avoided. Due to the adoption of the program-controlled matrix adhesive dispensing mode, the relative position between the adhesive points is effectively controlled, the precision reaches 10 micrometers, meanwhile, due to the adoption of a flow controller, the size of the obtained minimum adhesive point is 150 micrometers, and the short-circuit problem of the pixel electrodes is effectively solved.

The invention relates to an electric cooker provided with a waterproofing interface and convenient for plug fixing. The electric cooker comprises a main body, a pot cover, an assisting mechanism, an inner cover, a protective mechanism, a control panel, a lifting handle, a base, a connecting structure, a liner, a clamping groove and a fixing mechanism, wherein the pot cover is arranged on the uppersurface of the main body; the assisting mechanism is arranged in the pot cover; the inner cover is inserted into the outer side, close to the pot cover, of the assisting mechanism, and the protectivemechanism is arranged on the body wall of the side, away from the pot cover, of the main body; and the control panel is embedded in the body wall of one side of the protective mechanism. According tothe electric cooker provided by the invention, the assisting mechanism, which can conduct assisting cleaning on the liner of the electric cooker, is arranged, and the assisting mechanism is driven byvirtue of a motor; after the liner is filled with cleaning liquid, the electric cooker is covered by the pot cover and an hairbrush extends and makes into contact with the liner by virtue of an electric telescopic rod, and the electric telescopic rod can be driven to rotate after the motor is started, so that the hairbrush and a supporting frame, under the action of the motor, are rotated, and the supporting frame can drive a cleaning block to wipe the body wall of the liner; and therefore, an effect of conducting automatic cleaning can be achieved.

Parallel array micro-cooler and its preparation method are a technology used to improve the temperature control of laser devices and computer CPUs, improve the heat dissipation inside the chip, thereby improving the working efficiency of the device chip and prolonging the service life. Its layered structure , and its positions are arranged in order: the silicon substrate (6) of the P-type semiconductor, the buffer layer (7) of the P-type semiconductor, the first heavily doped layer (8) of the P-type semiconductor, and the superlattice layer ( 9), the second heavily doped layer (10) of the P-type semiconductor, the third heavily doped layer (11) of the P-type semiconductor, and the metal layer (13); the silicon dioxide isolation layer (12) is located between the P-type semiconductor between the metal layer and the first heavily doped P-type semiconductor. The manufacturing process adopts the oxide isolation process to form a parallel array micro-cooler, which can improve the yield of device manufacturing and reduce the contact area, thereby greatly reducing the interface contact resistance and greatly improving the cooling efficiency.

The invention discloses a novel instrument insulation can. The insulation can comprises an inner casing and an outer glass casing, the inner casing is hung in the outer glass casing via connecting assemblies, a hollow interlayer is formed between the inner casing and the outer glass casing, the top wall of the inner casing is connected with the top wall of the outer glass casing via connecting assemblies, the bottom wall of the inner casing is connected with the bottom wall of the outer glass casing via connecting assemblies, each connecting assembly comprises a stud, a holddown spring and internal and external fastening nuts, the inner walls in the left and right sides of the inner casing are provided with conductors respectively, and the outer walls in the left and right sides of the outer casing are provided with induction coil discs at positions corresponding to the conductors respectively. Electromagnetic induction heating and the heat insulated hollow interlayer are used to greatly reduce heat loss of the insulation can, the heat insulating ability is improved, and a heating line is avoided for circuit break due to heat fatigue in both cold and hot environments simultaneously.

A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.

The invention discloses a novel biogas fermentation device of separation floating cover type, which comprises a first fermentation room (1), a second fermentation room (2) and a third fermentation room (3) which are sequentially connected from top to bottom. A fermentation room (1) is provided with a steam input pipe (80), a valve is provided between two adjacent fermentation rooms, and a valve is provided in the second fermentation room (2) and the third fermentation room (3). There is a diffusion device; the three fermentation rooms are equipped with annular air pipes, and each of the annular air pipes passes through the corresponding fermentation room, and the annular air pipes between two adjacent fermentation rooms protrude The ends are connected to each other, and the corresponding steam pipes are externally connected to the connected positions. The present invention is provided with three fermentation rooms connected from top to bottom, and is equipped with a diffusion device, and an annular air pipe connected to a steam conduit, while controlling the temperature, it can also discharge materials in a timely manner without affecting the continuity of fermentation. The fermentation efficiency is improved, and the output of biogas is increased.

The invention discloses an anti-cracking plastic frame circuit manufacturing method, and relates to the technical field of circuit printing. The anti-cracking plastic frame circuit manufacturing method comprises the following steps: (1) nano-scale silver paste ink is printed on a film by a silk screen to form a film circuit; part edge of the film is inwards recessed; the inwards recessed part of the edge of the film forms an embedded part; the other part forms a limiting part; the limiting part is as high as a molding cavity of an injection mold; and the embedded part is lower than the molding cavity of the injection mold; (2) the film circuit is set up in the molding cavity of the injection mold; and the lower edge of the limiting part is butted against the bottom of the molding cavity; and (3) molten plastic is injected into the mold to manufacture an integrated injection part. Film and plastic bonding processes are once finished in the injection mold; and the film circuit and the main plastic part are firmly combined as a whole body, so that the effects of no falloff, no oxidization and no escape of solvent micromolecules are achieved. The anti-cracking plastic frame circuit manufacturing method optimizes the structure of the film circuit, and greatly improves the heat shock resistance and the salt fog resistance of products.

The invention discloses a Coriolis mass flowmeter sensor and a coil former of the Coriolis mass flowmeter sensor. The coil former comprises a coil winding portion and a supporting portion connected with the coil winding portion. The supporting portion is fixedly provided with a leading-in terminal and a leading-out terminal. In this way, the coil former of the Coriolis mass flowmeter sensor can avoid disorder of leads and disconnection of outgoing lines.

The invention provides a display panel, a preparation method of the display panel and a display device, and solves the problem that when a touch circuit is prepared at a hollow climbing position of a camera, the wiring size is easy to thin or the wire is easy to break. The display panel comprises an array substrate, a plurality of first wires and at least one second wire, wherein a display area of the array substrate comprises a special-shaped area, a main display area located on the periphery of the special-shaped area and a transition area located between the special-shaped area and the main display area; the plurality of first wires are arranged above the main display area; the at least one second wire is arranged above the transition area; and the second wire is connected with at least one first wire, and the wire width of the second wire is greater than that of the first wire.

The invention discloses a touch structure which comprises a substrate provided with at least one curved surface; a touch circuit layer at least partially covering the curved surface, wherein the touchcircuit layer is used for sensing touch pressing operation; a carbon nano tube layer arranged on the surface, far away from the substrate, of the touch circuit layer, wherein the carbon nano tube layer is used for filling and electrically connecting the crack part of the touch circuit layer after the touch circuit layer has cracks. The invention further provides a preparation method of the touchstructure and a touch device applying the touch structure.

The invention relates to a spray pipe mounting assembly and an etching device. The spray pipe mounting assembly comprises a telescopic frame, sliding rails used for installing spraying pipes, the number of the sliding rails is larger than one, the sliding rails are arranged on the telescopic frame at intervals, and the telescopic frame can drive the sliding rails to move when stretching out and drawing back so as to adjust the distance between every two adjacent sliding rails, and then the distance between the spraying pipes installed on the sliding rails can be adjusted. When the spray pipe mounting assembly provided by the invention is used by the etching device, the distance between the spray pipes can be adjusted according to the actual condition of a circuit board, so that the problemof excessive or insufficient etching is avoided.

The invention relates to the technical field of power capacitors, and especially relates to an anti-harmonic power capacitor with a connector convenient to replace according to the model of a connecting piece. The capacitor comprises a shell, a heat insulation plate is arranged in an inner cavity of the shell, a reactor is arranged on the left side of the heat insulation plate, and a mounting plate is arranged on the right side of the lower surface of the inner cavity of the shell. Three first sliding grooves are formed in the upper surface of the mounting plate, capacitor fixing devices are installed in the first sliding grooves, a capacitor body is arranged on the upper surface of the mounting plate, the capacitor body is located between the capacitor fixing devices, an adjusting deviceis installed on the upper surface of the mounting plate, three threaded pipes are installed on the upper surface of shell, and the outer side of each threaded pipe is in threaded connection with a threaded cylinder. Through mutual cooperation of the structures, the anti-harmonic capacitor has an anti-harmonic function, the terminals can be conveniently replaced, the service life of the capacitor is prolonged, the capacitor body can be conveniently disassembled and assembled when needing to be maintained, and the working efficiency of capacitor maintenance is effectively improved.