Method for making anti-cracking plastic frame circuit

Abstract

The invention discloses an anti-cracking plastic frame circuit manufacturing method, and relates to the technical field of circuit printing. The anti-cracking plastic frame circuit manufacturing method comprises the following steps: (1) nano-scale silver paste ink is printed on a film by a silk screen to form a film circuit; part edge of the film is inwards recessed; the inwards recessed part of the edge of the film forms an embedded part; the other part forms a limiting part; the limiting part is as high as a molding cavity of an injection mold; and the embedded part is lower than the molding cavity of the injection mold; (2) the film circuit is set up in the molding cavity of the injection mold; and the lower edge of the limiting part is butted against the bottom of the molding cavity; and (3) molten plastic is injected into the mold to manufacture an integrated injection part. Film and plastic bonding processes are once finished in the injection mold; and the film circuit and the main plastic part are firmly combined as a whole body, so that the effects of no falloff, no oxidization and no escape of solvent micromolecules are achieved. The anti-cracking plastic frame circuit manufacturing method optimizes the structure of the film circuit, and greatly improves the heat shock resistance and the salt fog resistance of products.

Description

technical field [0001] The invention relates to the technical field of circuit printing, in particular to a method for manufacturing a plastic frame circuit. Background technique [0002] In order to facilitate injection molding processing, the plastic frame circuits currently used in the electronics industry mostly use thin film circuits that are as high as the plastic frame and are glued to the plastic frame. With this design, local gaps are prone to appear at the junction of the thin film circuit and the edge of the plastic frame, and salt spray and water vapor can easily enter through the gap, causing the thin film circuit to conduct electricity, which will not only seriously affect the service life of the product, but also make the product unable to meet the repeated heating requirements. Shock, salt spray and other harsh environment requirements. Contents of the invention [0003] The object of the present invention is to provide a method for manufacturing an anti-c...

AI Technical Summary

Problems solved by technology

With this design, local gaps are prone to appear at the junction of the thin film circuit and the edge of the plastic frame, and salt spray and water vapor can easily enter through the gap, causing the thin film circuit to conduct electricity, which will not only seriously affect the service life of the product, but also make the product unable to meet the repeated heating requirements. Shock, salt spray and other harsh environment requirements

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