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Touch structure, preparation method thereof and touch device

A technology of touch control and circuit layer, which is applied in the direction of instrumentation, electrical digital data processing, and input/output process of data processing, etc. It can solve problems such as resistance rise and open circuit, achieve good flexibility and improve user experience.

Active Publication Date: 2019-08-09
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the thermoforming process, after the touch circuit layer is bent with the substrate, there are problems of significant increase in resistance and disconnection

Method used

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  • Touch structure, preparation method thereof and touch device
  • Touch structure, preparation method thereof and touch device
  • Touch structure, preparation method thereof and touch device

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Embodiment Construction

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0033] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The invention discloses a touch structure which comprises a substrate provided with at least one curved surface; a touch circuit layer at least partially covering the curved surface, wherein the touchcircuit layer is used for sensing touch pressing operation; a carbon nano tube layer arranged on the surface, far away from the substrate, of the touch circuit layer, wherein the carbon nano tube layer is used for filling and electrically connecting the crack part of the touch circuit layer after the touch circuit layer has cracks. The invention further provides a preparation method of the touchstructure and a touch device applying the touch structure.

Description

technical field [0001] The present invention relates to the field of touch technology, in particular to a touch structure, a method for preparing the touch structure, and a touch device using the touch structure. Background technique [0002] Generally, the curved touch module includes a curved cover and a touch structure attached to a surface of the curved cover. The touch structure includes a substrate and a touch circuit layer arranged on the substrate. Usually, before laminating the touch structure on the curved cover, the substrate on which the touch circuit layer is formed needs to be thermoformed into a shape matching the curved cover. [0003] However, during the thermoforming process, after the touch circuit layer is bent along with the substrate, there are problems of significant increase in resistance and disconnection. Contents of the invention [0004] An embodiment of the present invention provides a touch control structure, which includes; [0005] A subs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041G06F3/047
CPCG06F3/041G06F3/047G06F2203/04103
Inventor 陈圣哲何奕宏陈伯纶
Owner INTERFACE TECH CHENGDU CO LTD
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