The invention relates to a process for manufacturing
smooth surface roughened electrolytic
copper foil, which comprises a step of
pickling, a step of primary
smooth surface roughening, a step of secondary
smooth surface roughening, a step of primary smooth surface curing, a step of secondary smooth surface curing, a step of double-size anti-oxidization treatment, a step of double side
passivation and a step of smooth surface
coupling agent treatment, which are accomplished continuously on the same
production line. Compared with the prior art, the smooth surface roughened electric
copper foil manufactured by the process for manufacturing the smooth surface roughened electrolytic
copper foil has the advantages of short copper teeth, easy
etching, and
high impedance controllability. When the
copper foil is used in production of downstream products, the needs of blackening micro
corrosion and
toughening treatment are obviated, so the manufacturing process is shortened, and the
short circuit rate and open circuit rate are lowered; meanwhile, the
copper foil manufactured by the process has the same quality as the conventional high-precision or double-side toughened electrolytic
copper foil, is produced at low cost and is more suitable for manufacturing the inner
layers of high-precision multilayer plates and high-density
fine line printed circuit boards (PCBs).