40results about How to "Satisfactory adhesiveness" patented technology

The present invention provides a dicing / die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing / die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g / eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

An end-modified soluble polyfunctional vinyl aromatic copolymer, which is improved in heat resistance, thermal stability, solvent solubility, and compatibility with acrylate compounds, and a curable resin composition using the same are disclosed. The end-modified soluble polyfunctional vinyl aromatic copolymer is obtained by allowing a divinyl aromatic compound (a), a monovinyl aromatic compound (b), and an aromatic ether compound (c) to react with each other, and has, at an end, an end group derived from the aromatic ether compound and having an acrylate bond. The copolymer has a number average molecular weight Mn of 500 to 100,000, an introduction amount (c1) of the end group derived from the aromatic ether compound satisfies (c1)≧1.0 (group / molecule), a molar fraction a′ of a structural unit derived from the divinyl aromatic compound and a molar fraction b′ of a structural unit derived from the monovinyl aromatic compound in the copolymer satisfy 0.05≦a′ / (a′+b′)≦0.95. Besides, the curable resin composition includes the copolymer and an unsaturated acrylate monomer.

First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.

The present invention provides a double-sided adhesive tape for fixing a decorative sheet for speaker, which includes a nonwoven fabric substrate, an acrylic pressure-sensitive adhesive layer A disposed on one side of the nonwoven fabric substrate and an acrylic pressure-sensitive adhesive layer B disposed on the other side of the nonwoven fabric substrate, in which the adhesive tape has a tensile strength in the tape flow (MD) direction of 8 N / 10 mm or more and a tensile length in the width (TD) direction of 8 N / 10 mm or more. The double-sided adhesive tape is excellent in the adhesion performance to a housing and a decorative sheet for speaker and at the same time, has excellent releasability ensuring that when separating the decorative sheet portion, smooth separation can be attained without leaving a residue of tape or pressure-sensitive adhesive on the housing portion.

The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

A sealing member to be used for sealing a constituent member of a fuel cell is provided, the sealing member including a cross-linked product of a rubber composition, in which the rubber composition contains the following components (A) and (B). With this, rubber elasticity is maintained without being lost even under extremely low temperature conditions, and in the case where the sealing member is used in a fuel cell sealed body, an excellent sealing property is exhibited. (A) a rubber component including at least one of an ethylene-propylene rubber or ethylene-propylene-diene rubber having a ratio of ethylene-ethylene diad distribution of at most 29 mol %. (B) a cross-linking agent including an organic peroxide.

Provided is a water-dispersible acrylic pressure-sensitive adhesive composition capable of forming a removable pressure-sensitive adhesive layer which has satisfactory resistance to increase in adhesive strength and a good appearance and less causes staining on an adherend. The removable water-dispersible acrylic pressure-sensitive adhesive composition includes an acrylic emulsion polymer (A) formed from constitutive monomers essentially including 70 to 99.5 percent by weight of a (meth)acrylic alkyl ester and 0.5 to 10 percent by weight of a carboxyl-containing unsaturated monomer based on the total amount of the constitutive monomers; a water-insoluble crosslinking agent (B); an acetylenic diol compound (C); and a specific polyether defoaming agent (D). The acetylenic diol compound (C) has an HLB of less than 13, and the polyether defoaming agent (D) has a PO in a content of from 70 to 100 percent by weight and a number-average molecular weight of from 1200 to 4000.

Provided is a silicone foam sheet that expresses excellent bubble removability, that has satisfactory adhesiveness with an adherend and satisfactory sealability, that maintains the expression of these effects even when its thickness is reduced, that preferably expresses a stable modulus of elasticity over a region from a low-temperature region to a high-temperature region, and that suppresses both of its compression set in the low-temperature region and its compression set in the high-temperature region to low levels. Also provided is a method of producing such silicone foam sheet. The silicone foam sheet comprises an open-cell structure having a thickness of from 10 μm to 3,000 μm, wherein an open-cell ratio is 90% or more, an average cell diameter of the silicone foam sheet is from 1 μm to 50 μm, and 90% or more of all cells therein each has a cell diameter of 80 μm or less.

Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound having an ester group; and a semiconductor device including a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation.CH2—CH2  (1)CH═CH  (2)