34results about How to "Does not affect storage stability" patented technology

Zinc(II)-complex compound (I), is new. Zinc(II)-complex compound of formula (Zn(L) x(Y) 2-x) (I), is new. x : 1 or 2; Y : single negatively charged ligand; L : ligand of formula (R1-C(O ->)=C(R2)-C(=O)-N(R3)(R4)) (II); R1, R2 : H, optionally saturated 1-10C hydrocarbyl or 3-6C divalent alkylene; and R3, R4 : H, monovalent saturated hydrocarbyl (optionally containing 1-12C heteroatoms), or divalent alkylene (optionally containing 3-6C heteroatoms). Independent claims are also included for: (1) preparing (I); and (2) two-component polyurethane composition comprising at least one polyol as first component, at least one polyisocyanate as second component and zinc(II)-complex compound.

The invention relates to an H-grade wire coating enamel that has good salt water pinhole performance and can be directly welded at low temperature, containing hydroxyl component, sealed isocyanate component and solvent, where its hydroxyl component has an acid value less than 2, a hydroxyl value of 150-300, and number-average molecular weight of 1500-5000, and as synthesized, the raw materials has at least m-phthalic acid, p-phthalic acid, adilic acid, glycerin and a kind of dibasic alcohol in the weight ratio of 1 to (0.2-2) to (0.2-0.5) to (0.5-3) to (0.5-1.5); and its sealed isocyanate component is partially added of MDI by mixed polyalcohol that at least has a dibasic alcohol and a tribasic alcohol; in the paint base, the equivalent ratio of isocyanate base to OH is (0.9-1.2) : 1, and it reaches H-grade and has good salt water pinhole property of paint film, tin daubing temperature less than or equal to 375 deg.C.

The anti-fouling single-component room temperature sealing silicone sulfide glue features that silicon oil with molecular end radical Si-H and dry oil addition component as anti-fouling component in 5-30 weight portions, poly(alpha, omega-dihydroxy siloxane in 100 weight portions and active calcium carbonate in 70-130 weight portions are dewatered and mixed in a vacuum stirrer at 100-150 deg.c and vacuum degree of 0.06-0.099 MPa for 30-200 min, and cooled to obtain the base material. At room temperature, cross-linking agent in 5-15 weight portions, silane coupler in 0.5-5 weight portions and catalyst in 0.5-1.5 weight portions are then added inside a high speed dispersing stirrer or a planetary stirrer at vacuum degree 0.06-0.099 MPa and rotation speed 200-600 rpm for 30-150 min.

The invention discloses a low-temperature fast curing setting organic resin carrier for printing electronics and a preparation method and application thereof. The method comprises the steps that curing can be completed at the temperature of 120-150 DEG C for 1-9 min, the room temperature storage stability is good, continuous printing can be achieved, a curing film layer has the good electrical conductivity, solvent resistance, adhesive force, surface hardness and other comprehensive performances, the braking curing time is prolonged, and the resistance changing rate is smaller than 5%. Compared with the application performance of traditional printing electronic paste, damage caused by thermal treatment to organic materials and preparation devices is effectively lowered, the production yield is improved, the prepared rare and precious metal electronic paste is stably attached to various elastic substrate materials which are high surface energy and hard to adhere, high in reliability and suitable for a large-scale continuous production technology, and the production energy consumption cost is greatly lowered. The organic resin carrier is prepared from, by mass, 30-40% of organic resin, 45-59% of mixed solvents, 8-12% of curing agents and 3-5% of rapid curing accelerators.

The invention discloses an organic silicon electronic packaging material and a preparation method thereof. The organic silicon electronic packaging material comprises methyl-terminated polydimethylsiloxane, a plasticizer, an inorganic filler, an organic filler, a flame-retardant assistant, a functional assistant, a crosslinking agent, a catalyst and an exempt volatile organic solvent. The preparation method comprises the following steps: uniformly dispersing the polydimethylsiloxane and organic filler by high-speed stirring and mixing; previously carrying out high-temperature baking on the inorganic filler, adding, dispersing by stirring, adding the plasticizer, and uniformly dispersing by high-speed stirring; adding the flame-retardant assistant and bonding assistant, dispersing by high-speed stirring, dispersing, adding the crosslinking agent, dispersing, adding the catalyst, dispersing by low-speed stirring, adding the solvent to regulate the viscosity, continuing dispersing, vacuumizing, and discharging to obtain the product. The organic silicon electronic packaging material has favorable bonding performance for PC (polycarbonate), PTFE (polytetrafluoroethylene), stainless steel and aluminum products. By using the exempt volatile organic solvent for preparation, the organic silicon electronic packaging material is green and safe, and has the advantages of favorable storage stability, favorable temperature tolerance and excellent electric properties.

The invention discloses a lubricating thread locking and sealing anaerobic adhesive and a preparation method thereof, and relates to the field of thread locking and sealing anaerobic adhesives. In terms of mass percentage, the anaerobic adhesive includes 20% to 90% of molecular chains containing Boron acrylate self-lubricating monomer, 0-76% boron-free acrylate monomer, 0.02%-1% polymerization inhibitor, 0.1%-5% accelerator, 0.3%-5% Accelerator, 0.01%-0.1% metal ion chelating agent, 0.1%-5% organic peroxide initiator, 0-10% fumed silicon dioxide, 0-30% plasticizer. In the preparation process, the present invention adds boron-containing acrylate self-lubricating monomers in the molecular chain, which can improve the lubricity of the thread locking and sealing anaerobic adhesive, reduce the friction coefficient and torque coefficient when the fastener is tightened, and do not It affects the torque strength of the thread locking and sealing anaerobic adhesive after curing, the storage stability of the glue, and the coloring of the glue in the later stage.

The invention discloses a method for preparing high-adhesive force solid acrylic resin modified by organosilane. The method disclosed by the invention can be used for preparing the high-adhesive force solid acrylic resin by introducing an organosilane monomer into acrylic resin through a chemically bonding mode; the prepared modified solid acrylic resin as an additive is added to a powder coating system, can outstandingly enhance the adhesive force of a powder coating layer on a substrate and specific substrates, such as a galvanized plate and stainless steel, especially, cannot influence the storage stability of the powder coating due to excellent self characteristics of the solid acrylic resin and achieves certain improvement on the solvent resistance and boiling resistance of the powder coating layer.

The invention relates to a preparation method of heat curing fluorosilicone raw rubber. The preparation method comprises the following steps: adding D3F and D4Vi into a reactor and then dehydrating D3F and D4Vi, adding prepared potassium silanolate catalyst pre-polymer, heating, introducing nitrogen and stirring to carry out polymerization, wherein the temperature is 60-115 DEG C and the reaction time is 20-100min, neutralizing with a neutralizer until the reactant is neutral, and finally, removing small molecular substances from the material, reducing temperature and discharging. Due to the adoption of the potassium silanol catalyst pre-polymer with high activity, the reaction temperature is low, the accelerant is not required, an end-capping reagent is not required in the polymerization process, and the nitrogen purging manner is adopted in the stage of removing the small molecular substances from the material, the volatile matter of the heat curing fluorosilicone raw rubber is reduced; the prepared heat curing fluorosilicone raw rubber can be widely used in the fields of aerospace, petrochemical industry, automobiles, artificial organ, and the like, and has a good promotional value.

The invention discloses a rack inside a refrigerator body, and relates to the technical field of refrigerators. In order to solve the problem that materials are inconvenient to store, the rack inside the refrigerator body comprises a shelf installed inside the refrigerator body, and a bottle rack located below the shelf. A connecting portion protruding to the bottom of the refrigerator body is arranged on the shelf. The bottle rack comprises a flat plate and an arc-shaped plate, wherein the flat plate is detachably connected with the connecting portion, one end of the arc-shaped plate is tangent to the flat plate and is fixedly connected with the flat plate so as to support a wine bottle, and projections of the arc-shaped plate and the flat plate are located inside the shelf. The rack inside the refrigerator body is used for storing objects (except for the wine bottle) and the wine bottle in a separated mode, and a user can conveniently store the objects through the refrigerator.

The invention relates to the field of inks, in particular, it provides a mirror silver ink, a preparation method and a product thereof. The water-based acrylic modified polyester resin in the mirror silver ink can improve the chemical resistance of the mirror silver ink coating. Water-based baking varnish epoxy resin can improve the alkali resistance of the mirror silver ink coating. Water-based blocked isocyanate curing agent and water-based phenylamino resin can increase the crosslinking density between raw materials. The modified silane coupling agent can be directly added to the mirror silver ink without affecting the storage stability, while improving the water resistance of the ink coating and the bonding force with the substrate. The mirror silver ink is harmless to the human body and the environment, and does not require a protective layer. A single layer of coating can be cleaned with 4% NaOH at 70°C without removing silver, and does not affect adhesion and mirror effect.