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A kind of organosilicon electronic packaging material and preparation method thereof

An electronic packaging material, silicone technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of environmental protection, flame retardancy, unsatisfactory use effect, affecting the storage stability of rubber materials, corrosion failure, etc., and achieve good Storage stability, good adhesion, less corrosive gas effect

Active Publication Date: 2017-03-15
广东皓明有机硅材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of platinum compounds will limit other added components in the rubber compound. The inorganic filler will cause the components to decompose and generate gas, which will affect the storage stability of the rubber compound and the compatibility with the silicone coating liquid base material. Poor, difficult to disperse, easy to cause local bonding failure, some organic halogen compounds are limited due to environmental protection requirements, organic phosphorus compounds are easy to cause corrosion failure to some exposed metal components of integrated circuit boards, so the prior art solvent-based monolithic The environmental protection, flame retardancy and use effect of component silicone electronic packaging materials are not ideal

Method used

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  • A kind of organosilicon electronic packaging material and preparation method thereof
  • A kind of organosilicon electronic packaging material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The organosilicon electronic packaging material of this embodiment consists of the following components and proportions by weight:

[0042] Methyl-terminated polydimethylsiloxane (1000cps)····· 40

[0043] Simethicone (100cps)·············································································································································

[0044] Fumed silica················ 15

[0045] Methyl MQ silicone resin························ 20

[0046] Polyborosilane················· 1

[0047] Ring Nitrogen Compounds·················3

[0048] Isopropoxysilane coupling agent... 2

[0049] Organometallic (Al) chelate 0.5

[0050] Methyltrimethoxysilane·············· 1

[0051] Dialkyltin bis(ß-diketone ester) 0.8

[0052] Hexamethyldisiloxane 30

[0053] The preparation method of the organosilicon electronic packaging material in this embodiment is as follows:

[0054] a. Stir the methyl-terminated polydimethylsiloxane and methyl MQ silicone...

Embodiment 2

[0059] The organosilicon electronic packaging material of this embodiment consists of the following components and proportions by weight:

[0060] Methyl-terminated polydimethylsiloxane (10000cps)····· 60

[0061] Simethicone (200cps) ···································································································································································

[0062] Fumed silica························· 25

[0063] Methyl MQ silicone resin···················· 15

[0064] Polyborosilane····················· 1.5

[0065] Ring Nitrogen Compounds··················3

[0066] Isooxysilane coupling agent················1

[0067] Borate compound················· 2

[0068] Methyltriethoxysilane 1.8

[0069] Polyalkoxy titanate 2.0

[0070] Octamethyltrisiloxane 40

[0071] The preparation method of the solvent-based silicone electronic packaging material in this embodiment is as follows:

[0072] a. Mix methyl-terminated polydimethylsil...

Embodiment 3

[0077] The organosilicon electronic packaging material of this embodiment differs in composition from Embodiment 1 in that:

[0078] Polyborosilane 1.5

[0079] Ring Nitrogen Compounds·······3

[0080] Isopropoxysilane coupling agent...2

[0081] Organometallic (Fe) chelates····1

[0082] The preparation method of the solvent-based silicone electronic packaging material in this embodiment is as follows:

[0083] a. Mix methyl-terminated polydimethylsiloxane and methyl MQ silicone resin at a high speed of 140r / min and disperse evenly;

[0084] b. Fumed silica was pre-baked at 140°C for 1 hour, then added in 5 times, stirred and dispersed for 35 minutes, then added simethicone, and stirred at a high speed of 100r / min to disperse evenly;

[0085] c. Add polyborosilane and ring nitrogen compound compound, isopropoxysilane coupling agent and organometallic chelate compound, stir and disperse at medium speed at 70r / min for 20min, add methyltrimethoxysilane Disperse for 10 minut...

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Abstract

The invention discloses an organic silicon electronic packaging material and a preparation method thereof. The organic silicon electronic packaging material comprises methyl-terminated polydimethylsiloxane, a plasticizer, an inorganic filler, an organic filler, a flame-retardant assistant, a functional assistant, a crosslinking agent, a catalyst and an exempt volatile organic solvent. The preparation method comprises the following steps: uniformly dispersing the polydimethylsiloxane and organic filler by high-speed stirring and mixing; previously carrying out high-temperature baking on the inorganic filler, adding, dispersing by stirring, adding the plasticizer, and uniformly dispersing by high-speed stirring; adding the flame-retardant assistant and bonding assistant, dispersing by high-speed stirring, dispersing, adding the crosslinking agent, dispersing, adding the catalyst, dispersing by low-speed stirring, adding the solvent to regulate the viscosity, continuing dispersing, vacuumizing, and discharging to obtain the product. The organic silicon electronic packaging material has favorable bonding performance for PC (polycarbonate), PTFE (polytetrafluoroethylene), stainless steel and aluminum products. By using the exempt volatile organic solvent for preparation, the organic silicon electronic packaging material is green and safe, and has the advantages of favorable storage stability, favorable temperature tolerance and excellent electric properties.

Description

technical field [0001] The invention relates to the technical field of polymer sealing materials, in particular to an organic silicon electronic packaging material and a preparation method thereof. Background technique [0002] Solvent-based one-component silicone electronic packaging material, which can be coated ultra-thin, and is used for insulation and protection of products such as moisture-proof, mildew-proof, and salt spray (three-proof). The surface protective film can be formed by dipping, brushing and spraying. After curing, there are very few ionic impurities, high bonding strength with devices and lead frames, low water absorption and moisture permeability, and small internal stress and forming shrinkage. , small thermal expansion coefficient, short forming time, good mold release, good flame retardant properties, etc., mainly used for coating protection of integrated circuits in the field of microelectronic packaging. [0003] At present, solvent-based single-c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J11/08C09J11/06C09J11/04H01L23/29
Inventor 张利利吴向荣邱浩孟程宪涛刘建
Owner 广东皓明有机硅材料有限公司
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