A kind of silicone resin, its preparation method and application

Abstract

The invention discloses organic silicon resin. The organic silicon resin comprises a component A and a component B, the mass ratio of which is 0.1:1-1:10, wherein the component A comprises vinyl phenyl polysiloxane, vinyl phenyl silicone oil, a platinum-containing polysiloxane catalyst and a tackifier, the mass ratio of which is 100: (10-55): (0.5-1): (1-1.5), and the component B comprises phenyl vinyl polysiloxane, hydrogen-containing phenyl polysiloxane and an inhibitor, the mass ratio of which is 100: (40-80): (0.05-0.1). The invention also discloses a preparation method of the organic silicon resin and an application of the organic silicon resin in LED (Light Emitting Diode) encapsulation. The organic silicon resin provided by the invention has the following advantages that 1. Ba(OH)2 can be completely removed, and the storage stability of the resin is not affected; 2. the problem of low curing rate is solved; and 3. the organic silicon resin has high thermal shock resistance, high refractive index and high hardness.

Description

Technical field [0001] The invention relates to the field of packaging material design, in particular to an organic silicon resin used in LED packaging, a preparation method and application thereof. Background technique [0002] A light emitting diode (LED) is a semiconductor light-emitting device that converts electrical energy into light energy. It saves 80% of electricity than incandescent lamps and 50% of energy-saving lamps. Because it does not use mercury that is harmful to the environment, LED light-emitting devices are small in size and long in service life. They have been applied in backlight sources, street lights, industrial and mining lights, landscape lighting, home lighting, traffic lights, etc. With the improvement of cost performance, It is gradually replacing traditional light sources as a new generation of light sources. [0003] Encapsulation materials are an indispensable part of lighting devices. The encapsulation materials determine the light efficiency and s...

AI Technical Summary

Problems solved by technology

However, due to the large difference in the hydrolysis activity of the above components, the synthesized polymer is not uniform, which seriously affects the mechanical properties and light transmittance of the cured film, and finally leads to the product being exposed to severe temperature changes and ultraviolet radiation. Cracking and yellowing occur, and the above methods will generate a large amount of waste water, seriously polluting the environment

[0006] The research team of Byeong-SooBae from Korea Advanced Institute of Science and Technology has recently published a number of research papers on organosilicon hybrid materials in high-level SCI journals, and published in Chemistry of materials in 2010, respectively. Thermally Stable Transparent Sol-Gel Based Siloxane Hybrid Material with High Refractive Index for LightEmitting Diode (LED) Encapsulation, published in Journal of Materials Chemistry in 2012 entitled High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel In the research paper on derived hydrogen siloxane hybrid, Byeong-Soo Bae's research team used diphenylsiloxane as one of the raw materials and Ba(OH) 2 A series of silicone resins have been synthesized as catalysts. The silicone resins synthesized by this method will leave a small amount of Ba(OH) in the system. 2 The storage stability of the resin is very poor, and the synthetic resin has a great influence on the curing rate after compounding. In the literature, it is required to add 200ppm of platinum catalyst to increase the curing temperature to 150°C, which often brings resin Problems with low refractive index and low hardness and low thermal shock resistance