The invention relates to a conductive silver
adhesive preparation facility, and in particular relates to a conductive silver
adhesive preparation facility for electronic product built-in
chip production. The technical problem to be solved by the invention is to provide a conductive silver
adhesive preparation facility for electronic product built-in
chip production, which is excellent in preparation effect, high in working efficiency and simple in operation. For solving the technical problem, the invention provides the conductive silver adhesive preparation facility for electronic product built-in
chip production, which comprises a bottom board, a left frame, a sliding rail, a sliding block, a stirring tank, a
discharge pipe, a valve, a first bearing seat, a first stirring rod, a first
bevel gear, an L-form connecting rod, a motor and the like; and the left frame is welded at the left end of the top of the bottom board, the top of the bottom board is connected with the sliding rail in a bolt connecting way. The effects of
excellent preparation effect, high working efficiency and simple operation are achieved. The conductive silver adhesive preparation facility is novel in structure, strong in practicability, and capable of rapidly stirring
epoxy resin and silver
powder which are mixed as the conductive silver adhesive.