The invention provides a COB display screen packaging method based on
copper wire bonding. The COB display screen packaging method comprises the following steps of S1, carrying out
die bonding; S2, baking and curing the
die bonding glue; S3,
welding copper wires, and forming a COB display module based on
copper wire bonding; S4, carrying out a lightening test, if the product is a good product or adie bonding problem exists, carrying out the next step, if a
wire bonding problem exists, removing damaged wires or pseudo
soldering wires, and returning to the step S3 again; S5, carrying out packaging for the first time, adopting discrete glue for packaging, and manufacturing an inner protective
colloid on each pixel point, wherein the inner protective colloids are not connected with one another and n a discrete state; S6, removing the inner protective
colloid at a failure position; S7, cleaning the failed
chip and the copper wires; S8, repairing the
chip, baking and curing the die bondingglue, and repairing and
welding the copper wires; and S9, carrying out the lightening test, if the product is a defective product, returning to the step S7, and if the product is a good product, carrying out
secondary packaging. The beneficial effects are that the
copper wire welding technology is applied to production of the COB display screen, and the cost is reduced.