Easy-cold-punch-molding soft packaging composite material, and preparation method and molding method thereof

Abstract

The invention provides an easy-cold-punch-molding soft packaging composite material. The composite material comprises a thermoplastic resin film layer, an aluminum foil metal core layer, and a heatproof or printing film layer; the aluminum foil metal core layer is positioned between the thermoplastic resin film layer and the heatproof or printing film layer; the thermoplastic resin film layer comprises a surface heat-sealing layer and a hot melt adhesive resin layer compounded with the aluminum foil metal core layer; and the surface of the heat-sealing layer has fine slight convex-concave lines formed through heating roll molding in the compounding process, and the convex-concave depth of the fine slight convex-concave lines is 0.5-25mum. By utilizing the fine convex-concave characteristics of the fine slight convex-concave lines, a bonding problem formed by the clinging of the surface of the composite material and a die can be avoided during stamping, and air can be residual in a slit between the die and the convex-concave lines on the surface of the composite material during the stamping, so the surface friction coefficient value of the composite material is greatly reduced, and it is in favor of demolding the composite material in the cold punch molding process. The invention also provides a preparation method of the composite material, and a molding method when used.

Description

technical field [0001] The invention relates to a soft packaging composite material which is easy to be formed by cold stamping and a corresponding manufacturing method and a molding method during use, in particular to a composite material with high formability, cleanliness and sealing which is suitable for post-cold stamping processing applications. Flexible packaging composite materials for electronic components or pharmaceuticals with high performance requirements, as well as the corresponding manufacturing methods and molding methods during use. Background technique [0002] In recent years, with the convenient development of office automation and intelligent life technology, various electronic devices such as mobile communication terminals, laptop computers, military electronic tools, handheld DVD players, power vehicles, and energy storage batteries have gradually become more advanced. Performance, miniaturization, light weight, and thinning upgrades require that elect...

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Problems solved by technology

[0007] However, for some electronic components or pharmaceuticals that have high requirements for cleanliness and sealing, packaging materials coated with lubricants on the inner surface will not be suitable. Pollution and contamination of the electrolyte in the battery or capacitor will also affect the original heat-sealing performance of the packaging material. The smoother the surface performance of the packaging material, the greater the decline in heat-sealing performance, and the more likely it is to occur after packaging due to water vapor, Failure of package contents due to oxygen infiltration

[0008] At the same time, the cold stamping of soft packaging composite materials for electronic components in the prior art, especially the packaging materials of lithium-ion secondary batteries or capacitors, still has long-term technical problems of punching shell damage and low processing yield due to improper molding.

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