Device and method for heating adhesive film used for bonding chips

Abstract

The invention discloses a device and a method for heating an adhesive film used for bonding chips. The adhesive film used for bonding semiconductor chips sucked by a chip picking and placing head on the moving path of the chip picking and placing head is subjected to non-contact heating in a fixed point mode or a synchronous moving mode through a non-contact heating unit, so that the time required for heating and softening the adhesive film and the time required for bonding the chips can be shortened, the efficiency for bonding the chips are improved and the yield of an encapsulated product within unit time is increased; the adhesive film can be prevented from being heated and softened prematurely, so that the adhesive film is prevented from sticking an adhesive film used for bonding wafers or sticking adjacent chips and adhesive films at the sucking positions of the chips unexpectedly; therefore, unexpected bonding problems are effectively solved and the reliability of production line operation is improved.

Description

【Technical field】 [0001] The present invention relates to a heating device and method for an adhesive film for chip bonding, in particular to a device for non-contact heating of the adhesive film for chip bonding between the chip suction step and the chip bonding step Heating device and method thereof. 【Background technique】 [0002] In the manufacturing process of the semiconductor package structure, wire bonding technology has been widely used in the electrical connection between the semiconductor chip and the package substrate (substrate) or leadframe (leadframe). Please refer to figure 1 As shown, it outlines the main processing steps included in the existing semiconductor chip bonding process, which generally includes: a wafer test (wafer test) step S01, wherein a semiconductor wafer is tested by using several probes of a test machine Whether the circuit block on the round surface is good, and obtain the information of the good product block and the defective product ...

AI Technical Summary

Problems solved by technology

As a result, it was necessary to stop the production line to rule out accidental sticking problems

Furthermore, the vacuum pick-and-place head 13 needs to make its suction head with metal material because it needs to conduct heat energy, but when the metal suction head contacts the active surface of the semiconductor chip 101, it may accidentally damage the active surface due to the impact force. Surface, thereby reducing the subsequent packaging yield (yield)

Images