A preparation method of a high-quality 6061
aluminium alloy forging for
semiconductor equipment comprises the following steps of: (1) blank making by a common semicontinuous
casting method; (2) homogenization heat treatment of 6061
aluminium alloy by two-stage homogenization technology, wherein a first-stage temperature range is 540-570 DEG C, heat preservation time is selected to be 12-24 hours, a second-stage temperature range is 570-620 DEG C, and heat preservation time is selected to be 18-24 hours; (3)
forging technology, wherein a preheating temperature of a press chopping block is 300-350 DEG C, the maximal
forging heating time is not more than 3 when multi-heating forging is employed, an upsetting forging ratio for each heating is controlled to be 4-6 when forging with 2-3 heating times is employed, the forging ratio is controlled to be 7-9 when forging with one
heating time is employed, and the final forging temperature is controlled to be 320-360 DEG C; (4)
solid solution aging technology, wherein a
solid solution temperature is 520-540 DEG C, heat preservation time is on a basis of 45 min, the heat preservation time increases by 1 min when the thickness of the forging increases by 1 mm, an aging temperature is 160-180 DEG C, and heat preservation time is between 16-25 hours. The invention provides the preparation method of a high-quality 6061
aluminium alloy forging for
semiconductor equipment, and the method has the advantages of strong
operability, high yield, stable product performance, high product added value, and the like, is applicable to production for small-lot supply, and has significant
economic benefits.