The invention relates to an encapsulation structure for an MEMS (micro-electromechanical
system) variable
optical attenuator. The encapsulation structure comprises a focusing lens, a
tail fiber sleeve and an optical
chip, wherein the optical
chip is manufactured by adopting the MEMS, the
tail fiber sleeve is fixedly arranged in a hollow cylindrical
magnet through bonding glue for forming a magnetic
assembly 1, one end of the focusing lens is a
light signal incident surface, the other end of the focusing lens is provided with a light reflecting surface, the focusing lens is fixedly arranged in the other hollow cylindrical
magnet through bonding agents, the optical
chip is fixedly arranged on the end part, used for being sucked with the magnetic
assembly 1, on the hollow cylindrical
magnet through bonding agents, and a magnetic
assembly 2 is formed; the magnetic assembly 1 and the magnetic assembly 2 which are in a mutual magnetic suction state and are reinforced through the bonding agents form a variable
optical attenuator assembly, the
optical attenuator assembly is arranged in a hollow external protecting sleeve, in addition, two ends of the external protecting sleeve are filled and encapsulated by bonding agents, and the variable optical attenuator is formed. The invention aims at providing the encapsulation structure and an encapsulation method for the MEMS with the advantages of
miniaturization, low cost and high reliability.