The invention relates to a
heterojunction high-electronic-mobility spin
field effect transistor and a fabrication method thereof. The
transistor comprises a 6H-SiC drain region, a 6H-SiC source region, a 6H-SiC channel region, a Schottky contact grid
electrode, a 4H-
SiC substrate, a drain, a source, and SiN isolation
layers, wherein the 6H-SiC drain region, the 6H-SiC source region and the 6H-SiC channel are arranged on the 4H-
SiC substrate, the source is arranged on the 6H-SiC source region, the Schottky contact grid
electrode is arranged on the 6H-SiC channel region, the drain is arranged on the 6H-SiC drain region, and the SiN isolation
layers are arranged between the source and the Schottky contact grid and between the Schottky contact grid and the drain. In the
heterojunction high-electronic-mobility spin
field effect transistor and the fabrication method thereof, disclosed by the invention, the
doping concentration and the defect density of a source-drain material can be changed by adjusting
ion implantation amount and annealing time, and thus, the spin
polarizability of the drain region and the source region at a normal temperature is optimized.