45results about How to "Improve the success rate of sample preparation" patented technology

The invention discloses a method for testing the interfacial bonding strength of a ceramic fiber-reinforced resin matrix composite material and relates to ceramic fibers. The method comprises the following steps: bonding the ceramic fibers to a hard paper frame by virtue of an instant adhesive, for straightening and solidifying the ceramic fibers; preparing an embedding mold, putting the ceramic fibers and the hard paper frame into the embedding mold, and introducing resin into the embedding mold; after the resin is solidified, cutting an embedded end together with the embedding mold so as to obtain a sample, and polishing; when the embedding depth of the sample is lower than 1mm, bonding the embedded end with a primary cut part by virtue of quick-dry resin after the polishing process; burning out two sides of the paper frame at an un-embedded end by virtue of naked flame, averagely cutting the upper end of the paper frame according to the quantity of the ceramic fibers, and bonding and reinforcing the paper frame by virtue of a hard paperboard with area equal to that of the cut paper frame; firstly fixing the embedded end at a lower clamp of a testing machine, and then fixing a reinforcing section to an upper clamp of the testing machine; carrying out a single-filament draw-out experiment; recording each withdrawal force value given by a testing machine; observing the shape of an withdrawn end, and measuring the maximal withdrawing length of the single fiber; and calculating the interfacial bonding strength between the fiber and the resin.

The invention provides a method for preparing a failure analysis sample and a failure analysis sample. The preparation method includes the following steps: providing a stacked package to be analyzed, wherein a plurality of stacked bare chips are arranged in the stacked package, and each bare chip has an The front side of the pad and the back side opposite the front side, the back side of the die is in contact with the front side of its adjacent die, and the pads of the die are electrically connected to the pads of the adjacent die; remove other die until the pads of the die adjacent to the target die are exposed; the exposed pads are electrically drawn out to form a sample for failure analysis. The advantage of the present invention is that the removal operation is performed on the back of the target die, and the non-target die pad is used as an electrical connection, thereby avoiding the removal operation on the front side of the target die with circuit devices, protecting the front circuit devices, and being able to A complete and non-damaged target die is prepared, which greatly improves the success rate of sample preparation and greatly reduces the difficulty of sample preparation.

The invention discloses a lifting type sample preparation technology for a tri-axial sample of undisturbed soil. The technology comprises the steps as follows: firstly, according to characteristics ofa soil sample, the hardness of the soil sample is judged, and the cutting rotation speed of a cutting mechanism is determined; then the soil sample is placed on a lifting mechanism and can be drivenby the lifting mechanism to rise, the soil sample rising gradually is cut through rotation of a cutting blade of the cutting mechanism, and preliminary preparation of the tri-axial sample is completed; and finally, the height of the lifting mechanism is reduced, the sample is taken out and is treated according to the required height, and the sample preparation is completed. According to the technology, the problems that operation steps are tedious, the influence caused by the operation proficiency of sample preparation persons is large, the sample preparation efficiency is low, the disturbanceto the soil sample is large, the success rate of sample preparation is not high and the like in existing sample preparation processes are solved.