The invention discloses high-dimensional stability Sn-Ag-Cu solder suitable for
electronic packaging. The main component
metal elements of the solder include Sn, Ag, Cu and Be. According to the solder, the excellent melting property, the excellent
welding performance and the excellent
mechanical property of Sn-Ag-Cu
solder alloy are maintained, the elasticity modulus of a
welding connector can also be remarkably improved, a
welding spot is made to have high
toughness, the dimensional stability is good, and the solder is particularly suitable for ultra-small interval
electronic packaging. The electric
conductivity and heat
conductivity of the prepared welding spot can also be improved, so that the welding spot still has the excellent comprehensive service performance while bearing electric, thermal and mechanical loads and accords with the
miniaturization, precision and high-performance development tendency of modern electronic components, the using reliability of the electronic products is improved, and the service life of the electronic products is prolonged. Furthermore, through one or more of Al, Ni and V, the high-temperature
oxidation resistance, wettability, fluidity and high-temperature
chemical stability of the solder can be further improved, the
solder alloy is refined, and the
mechanical property of the welding spot is improved.