62results about How to "High heat conductivity" patented technology

A radiant heating for heating the building material in a laser sintering device and a laser sintering device having such a radiant heating are described. The radiant heating has a sheet-like heat radiating element (113, 213, 313), which is characterized in that it is made of a material, that has a low thermal inertia with a thermal diffusivity of preferably more than 1.5·10−4 m2 / s and preferably has a thickness of 2 mm or less.

A container does not need a member such as a stoke and the like that are exposed to the molten metal therein, thus the necessity to replace the parts such as the stoke and the like can be eliminated. In addition, there is no structure like the stoke in the container, the operability for the preheating is improved thus the preheating can be performed effectively. In addition, since a flow passage is formed inside the lining with high heat conductivity, inner heat of the container is easily conducted to the flow passage. Thus, the decrease in temperature of the molten metal that flows inside the flow passage can be suppressed to the utmost.

A device for heat treating (annealing) a III-V semiconductor wafer comprises at least one wafer support unit which is dimensioned such that a cover provided above the wafer surface is either spaced without any distance or with a distance of maximally about 2 mm to the wafer surface. A process for heat treating III-V semiconductor wafers having diameters larger than 100 mm and a dislocation density below 1×104 cm−2 is carried out in the device of the invention. SI GaAs wafers produced have an at least 25% increased characteristic fracture strength (Weibull distribution), an improved radial macroscopic and mesoscopic homogeneity and an improved quality of the mechano-chemically polished surface. The characteristic fracture strength is higher than 1900 MPa.

An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat conductivity is selected as the material of the upper substrate. The upper substrate is formed with multiple arrayed dents and through holes on the bottom of each dent. A material with high heat conductivity is selected as the material of the lower substrate. The surface of the lower substrate is formed with a predetermined circuit layout card. The bottom face of the upper substrate is placed on the upper face of the lower substrate with the through holes of the dents respectively corresponding to the contact electrodes of the circuit layout card of the lower substrate. Multiple light-emitting diode crystallites are respectively fixed on the bottoms of the dents. Via the through holes, the electrodes of the light-emitting diode crystallites are electrically connected with the contact electrodes. Then the dents of the upper substrate are sealed to prevent the light-emitting diode crystallites from being oxidized.

The invention relates to a method of and apparatus for providing heat to a molten metal flowing through metal-conveying apparatus. The apparatus includes a molten metal-conveying channel, an enclosure for receiving and circulating combustion gases while preventing entry of the gases into said channel, a heat-conductive body of material separating at least part of the channel from the enclosure; and a combustion device for generating combustion gases and delivering the gases to the enclosure. Heat from the combustion gases is used to heat molten metal held in the channel, while preventing contact between the combustion gases and the molten metal. The body of material may be a trough used to form the channel, a tube for conveying the molten metal, or a tube acting as the enclosure, or the like.

There are provided a heat insulating tool kit for piping, which can easily be attached to and detached from a piping in a limited space repeatedly and fixed in a stable form, can be attached so that a heating surface is in close contact with the outer peripheral surface of piping so that heat is conducted efficiently, which results in no overheating of heated portion, can be subjected to temperature control stably, and can be used in a clean room etc. because dust particles scarcely occur, and a heat insulating construction using the heat insulating tool kit. The heat insulating tool kit includes a piping; a band-shaped heat insulating unit which includes at least a heat insulating material and preferably a heating element and is wrapped with a heat-resistant resin film; a support cover consisting of a tubular element of a C-shaped cross section having a slit-shaped opening over the total length in the axial direction of the tubular element; and preferably an external cover of almost the same shape as that of the support cover. The heat insulating construction is formed as described below. The heat insulating unit is housed so that the non-heating surface of the heat insulating unit comes into contact with the tubular element inside wall of the support cover 14, and in a state in which ear portions at both ends of a heat insulating portion are pulled out of the slit-shaped opening, the butting portion at both ends of the heat insulating portion, that is, the slit-shaped opening of support cover is pressed on the piping, by which the piping is covered with the heat insulating portion and the support cover. Next, the opening portion of external cover in a widened state is pressed on the slit-shaped opening side of the support cover, by which the heat insulating unit and the support cover are collectively covered with the external cover 15.

A heat-conducting member having a three-layer structure. A heat-conducting member which comprises a substrate made from urethane foam. The entire substrate is coated by a heat-conducting coating material, which is a cloth made from copper fibers and Nylon™. Substrate coated by heat-conducting coating material is further coated by electricity-insulating coating material made from polyimide resin such that it covers over the entire heat-conducting coating material.

A semiconductor device is supplied which is able to efficiently liberate heat produced by semiconductor element toward external, prevent temperature rise, improve operation characteristic and maintain stable operation. The semiconductor device comprises a substrate and a semiconductor thin film layer which is accumulated on the substrate and contains semiconductor element, the substrate is a metal substrate, between the metal substrate and the semiconductor thin film layer, a diamond-like carbon layer with high heat conductivity and good insulativity is furnished as a surface coating layer.

This invention relates to a method of preparing a mixed manganese ferrite coated catalyst, and a method of preparing 1,3-butadiene using the same, and more particularly, to a method of preparing a catalyst by coating a support with mixed manganese ferrite obtained by co-precipitation at 10˜40° C. using a binder and to a method of preparing 1,3-butadiene using oxidative dehydrogenation of a crude C4 mixture containing n-butene and n-butane in the presence of the prepared catalyst. This mixed manganese ferrite coated catalyst has a simple synthetic process, and facilitates control of the generation of heat upon oxidative dehydrogenation and is very highly active in the dehydrogenation of n-butene.

A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.

An electronic device able to stably disperse heat generated by an electronic component is provided. By providing a heat dissipating metal plate 31 having a high heat conductivity between a TV tuner 21 and a battery 4, heat generated by the TV tuner 21 is dispersed to the battery 4 having a large heat capacity and further dissipated to the outside of a case through a battery lid 5.

A semiconductor package includes a mounting substrate having a chip-mounting region and a peripheral region, a first semiconductor chip mounted on the chip-mounting region of the mounting substrate, a first molding member on the mounting substrate to cover at least a portion of the first semiconductor chip, a plurality of first conductive connection members penetrating at least a portion of the first molding member, the first conductive connection members electrically connected to a plurality of ground connection pads provided on the peripheral region of the mounting substrate, respectively, and an electromagnetic interference (EMI) shield member covering the first semiconductor chip and including a graphite layer electrically connected to the first conductive connection members.

The present disclosure describes systems and methods for beam wavelength stabilization and output beam combining in dense wavelength multiplexing (DWM) systems. Systems and methods are described for performing beam wavelength stabilization and output beam combining in DWM systems while achieving increased wall-plug efficiency and enhanced beam quality. Interferometric external resonator configurations can be used to greatly increase the brightness of DWM system output beams by stabilizing the wavelengths of the beams emitted by the emitters of the DWM laser source. The resonant cavities described by the present disclosure provide advantages over the prior art in the form of decreased cost, increased wall plug efficiency and increased output beam quality. Particular implementations of the disclosure achieve increased wall plug efficiency and increased output beam quality through a combination of innovative cavity designs and the utilization of reflection diffraction elements for beam combining.

The present invention provides a method for manufacturing a heat transfer member which method allows peel-off and cracking possibly caused by thermal expansion to be inhibited. That is, the present invention provides a method for manufacturing a heat transfer member 10, the method at least including a step of forming metal powder into a coating film 12 on a surface of a base material 11 by spraying the metal powder in a solid state onto the surface of the base material 11 together with compressed gas. In the film forming step, a spraying pressure at which the metal powder is sprayed onto the surface of the base material 11 is set so that the coating film 12 has a porous structure.

The heat of arc plasma generated in arc welding is used to provide a welding method for a Si-based material. The method of the present invention is capable of welding a Si-based material, which is difficult to weld by conventional methods due to its brittle nature and high electric resistance. In an argon gas atmosphere, a tungsten electrode is used as a cathode. A water cooling copper sheet and plate is used as an anode. An arc is generated between this pair of electrodes. The arc length is gradually extended, and a pair of Si-based materials are near an arc column. Fusion welding of a weld zone is carried out while rotating the Si-based materials around an axis.

A carbon nano material and a resin binder are plasticized and injection molded to form a preliminarily molded member. The preliminarily molded member is degreased by a heat treatment and made to a preliminarily molded porous member composed of the carbon nano material. The preliminarily molded porous member is inserted into a cavity of a product mold. A molten low melting point metal is injected into and fills the cavity. The preliminarily molded porous member is impregnated with the low melting point metal by injection pressure, thereby a composite metal product composed of the low melting point metal material integrally composited with the carbon nano material is molded. With the above arrangement, the characteristics of the carbon nano material are applied to the composite metal product to improve the functions thereof.

A method for manufacturing a substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, having a lamination step of laminating and integrating a laminate having an insulating adhesive agent which is composed of a resin containing heat conductive fillers and has a heat conductivity of 1.0 W / mK or more and a metal layer member, with a metal layer member having a thick metal section while drawing out each member.

A polysilicon fuse includes a fusing part to be fused through voltage application, a positive terminal side joint connected to one end of the fusing part and a negative terminal side joint connected to the other end of the fusing part. The positive terminal side joint that attains a high voltage through the voltage application has lower resistance and higher heat conductivity than the negative terminal side joint. Furthermore, a write operation is performed, with a current limiting resistance serially connected to a positive terminal side joint of a polysilicon fuse, by applying a voltage pulse to the polysilicon fuse through the current limiting resistance. Thus, a current flowing to the polysilicon fuse in fusing the fusing part is limited to a given range.

A slide member provided with a base, an impregnated layer, and a resin layer. The base made of metal or ceramic. The impregnated layer is defined on a surface portion of a sliding side of the base by forming a recess on the base. The resin layer impregnates the impregnated layer so as to cover a sliding side surface of the base.

To provide a heat sink capable of enhancing heat dissipation performance.Cylindrical bodies 3 have openings 3a of which inner and outer sides are opened on front ends and are provided with through-holes 3b communicating the inner side and the outer side on side walls at the base end side. The cylindrical bodies 3 are provided in a standing manner in a state where portions at the base end side penetrate through a supporting main body 2 and project into a gap s1, the through-holes 3b are opened to the gap s1, and portions at the front end side also project from the surface of the supporting main body 2 at the opposite side to the gap s1. An atmosphere in the gap s1, which contains heat from a cooling target object 9, is capable of being made to flow into the cylindrical bodies 3 through the through-holes 3, circulate in inner spaces of the cylindrical bodies 3, and be released to the outside through the openings 3a on the front ends.

The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chip 10 to the heat radiation plate.

Disclosed herein is a heat exchange system for battery packs, which controls the temperature of a medium- or large-sized battery pack including a plurality of unit cells such that the battery pack can be operated under the optimum operating conditions. The heat exchange system includes an air inlet port and an air outlet port formed at one side of a housing surrounding the outer surface of the battery pack so as to form a predetermined flow channel, through which air flows, a driving fan mounted in the flow channel for driving the air to flow through the flow channel, and a Peltier element mounted at the air inlet port for controlling the temperature of air introduced into the air inlet port. In the heat exchange system according to the present invention, the thermoelectric element is mounted inside the air inlet port, through which air for cooling the battery pack is introduced into the heat exchange system. Consequently, the present invention has the effect of easily controlling the optimum operating temperature of the battery pack, reducing influences caused by external conditions, and decreasing noise and vibration.

There is provided a liquid crystal projector capable of enhancing heat radiation of light modulating means including a liquid crystal light valve, preventing dust or the like from being attached to the surface of the liquid crystal light valve, and making black matrixes formed between pixels in the liquid crystal light valve invisible. The liquid crystal projector includes a light source unit, colored-ray dividing means for dividing light emitted from the light source unit into three colored rays, light modulating means for serving to modulate the three colored rays on the basis of a given image signal and to emit the modulated rays which are predetermined linear polarized rays, colored-ray synthesizing means for synthesizing the modulated rays, and optical projection means for enlarging and projecting the synthesized rays synthesized by the colored-ray synthesizing means onto a screen. The light modulating means includes entrance dust-proof glasses 420R, 420G, and 420B made of crystallized quartz or sapphire having a uniaxial crystal structure and disposed on entrance sides of liquid crystal light valves 440R, 440G, and 440B of the light modulating means, respectively, and exit dust-proof glasses 460R, 460G, and 460B made of crystallized quartz or sapphire having birefringence and disposed on exit sides thereof, respectively.

A composite core nonlinear reactor comprising a first core member of high permeability material forming a continuous annular magnetic path, a second core member of high permeability material forming an annular magnetic path locally broken by an air gap, a magnetic shield plate of low permeability material exhibiting high conductivity and thermal conductivity being sandwiched by the first and second core member and integrated therewith, and a coil winding, wherein the annular magnetic paths of the first and second core members are juxtaposed while sandwiching the magnetic shield plate and the coil winding is wound to interlink with both annular magnetic paths commonly

A method, apparatus and system are disclosed for using a flexible radiating heatsink for cooling electronic components on integrated circuit chips. The heatsink elastically deforms without breaking or disconnecting in response to an external contact and then returns to its original size, shape and position, without transmitting the external force to the electronic component(s) it is cooling.

An electrical steel sheet provides: a steel strip (1) for an electrical steel sheet; and an insulating film (2) formed at a surface of the steel strip (1) and containing metal phosphate and organic resin. At least a part of the metal phosphate includes at least one kind of crystal structure selected from a group consisting of a cubic system, a tetragonal system, a hexagonal system, and an orthorhombic system. The organic resin contains at least one kind selected from a group consisting of an acryl-based resin, an epoxy-based resin, and a polyester resin having a carboxyl group or a hydroxyl group at a surface of an emulsion particle for one part by mass to 50 parts by mass relative to 100 parts by mass of the metal phosphate.

According to one embodiment, a CPP magnetoresistive head includes a magnetoresistive film comprising a free layer above a non-magnetic intermediate layer and a fixed layer below the non-magnetic intermediate layer, wherein the magnetoresistive film is between a lower magnetic shield layer and an upper magnetic shield layer. The CPP magnetoresistive head also includes a domain control film on each side of the magnetoresistive film, wherein a sense current flows through the magnetoresistive film between the upper magnetic shield layer and the lower magnetic shield layer. The CPP magnetoresistive head also includes a high heat conductivity layer, and a heat dissipation layer having a high heat conductivity and a low linear expansion coefficient, the heat dissipation layer being disposed at the back in a device height direction of the magnetoresistive film and on each side of the domain control film.

A steam generator 40′ provided in a substrate processing apparatus includes a tank 301 having a hollow cylindrical member 302 formed of a composite of PTFE and PFA and a pair of side wall plates 303 connected to the opposite ends of the cylindrical member 302. The tank 301 is surrounded by a shell 305 of an aluminum alloy to prevent deformation of the tank due to internal pressure of the tank. A heater 308 is attached to the outer surfaces of the plate members 307 of the shell 305. The shell 305 restrains the tank 301 and compresses elastic sealing members 305 to sealingly engage the cylindrical member 302 and the side wall plate 303 with each other.

The present invention is to solve the problems of heat release and a metal material corrosion due to fluorine that are arisen in the case of using a film containing fluoroplastics (Teflon®) as a protective film for a light-emitting device. In the present invention, an inorganic film is formed after forming a light-emitting device, and a film containing fluoroplastics is formed thereon for avoiding contact with a metal material for forming the light-emitting device, as a result, a metal material corrosion due to fluorine in the film containing fluoroplastics can be prevented. In addition, the inorganic insulating film has a function of preventing fluorine in the film containing fluoroplastics from reacting to the metal material (barrier property), in addition, the inorganic insulating film is formed of a material having high heat conductivity for releasing heat generated in a light-emitting device.