397results about How to "Improve the bonding force between layers" patented technology

A thermally sprayed member or an electrode includes a basic material, a thermally sprayed film formed on the surface of the basic material, the thermally sprayed film being made of an insulating ceramic and a metallic intermediate layer provided between the basic material and the thermally sprayed film for increasing a bonding force therebetween, wherein the thermally sprayed film side of the member is exposed to a high frequency plasma atmosphere and the electrode is intended to form a high frequency plasma on the side of the thermally sprayed film. The basic material includes a base portion made of a conductive material and a dielectric portion provided to include a part of a surface of the basic material. Further, the intermediate layer is comprised of a plurality of island-shaped parts isolated from each other.

A small and highly reliable acoustic wave device and a method for production of the same will be provided. The acoustic wave device has a piezoelectric substrate 1; a SAW element 2 on one main surface of the piezoelectric substrate 1; an outside connection-use conductor 3 formed on the one main surface of the piezoelectric substrate 1 and electrically connected to the SAW element 2; a columnar electrode 10 on the outside connection-use conductor 3; and a protective cover 6 defining inner walls of a vibration space 7 for vibration of the SAW element 2 and planarly surrounding a side surface of the columnar electrode 10.

A flexible display comprises a flexible substrate made of plastic material, a display element on a first surface of the flexible substrate, and a surface residual film containing at least one of a metal material or a metal oxide material. The surface residual film is bonded to at least a part of a second surface of the flexible substrate. The second surface is opposed to the first surface. A method for manufacturing a flexible display comprises preparing a glass substrate, forming adhesive material film on the glass substrate, the adhesive material film being made of at least one of a metal material or a metal oxide material, and forming a flexible substrate from plastic material on the adhesive material film.

Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (55a, 55b). The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (55a), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (55b). A bonded area (Sn) between the n-electrode (Ln) and the bump (55b) is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps (55a).

A system for displaying images including a display panel is provided. The display panel has a display area and a peripheral area. The display panel includes a metal layer disposed on a first substrate. A patterned planarization layer is disposed on the metal layer, having at least one opening corresponding to the peripheral area, wherein a portion of the metal layer is exposed through the opening. A second substrate is disposed opposite to the first substrate. A seal is disposed at the peripheral area and between the first and the second substrates, wherein the seal covers the metal layer through the opening of the patterned planarization layer.

There is disclosed a method for producing a single crystal silicon solar cell comprising the steps of: implanting hydrogen ions or rare gas ions into a single crystal silicon substrate through an ion implanting surface thereof to form an ion implanted layer in the single crystal silicon substrate; forming a transparent electroconductive film on a surface of a transparent insulator substrate; conducting a surface activating treatment for the ion implanting surface of the single crystal silicon substrate and/or a surface of the transparent electroconductive film on the transparent insulator substrate; bonding the ion implanting surface of the single crystal silicon substrate and the surface of the transparent electroconductive film on the transparent insulator substrate to each other; applying an impact to the ion implanted layer to mechanically delaminate the single crystal silicon substrate thereat to leave a single crystal silicon layer; and forming a p-n junction in the single crystal silicon layer. There can be provided a single crystal silicon solar cell where a light conversion layer is provided as a thin-film for effective utilization of silicon as a starting material of the silicon solar cell, which single crystal silicon solar cell is excellent in conversion characteristics and is less in degradation due to light irradiation, and which single crystal silicon solar cell is provided as a see-through type solar cell that is usable as a natural lighting window material of a house or the like.

In connection with a bump of a semiconductor device and a manufacturing method thereof, a groove is formed in a bump pad region of a semiconductor substrate. An under bump metal layer is then formed in the groove, and a lower end portion of the bump fills the groove on the under bump metal layer.

The invention discloses a production method of a high-density laminated printed circuit board of a high-frequency material. The production method comprises the following steps of: (1) drilling: drilling blind holes for interlaminar electrical connection on a layer or a plurality of layers of daughter boards; (2) screen printing solder resist: coating solder resist printing ink on the surface of outer copper foil of the layer or the plurality of layers of daughter boards with the blind holes, ensuring that the blind holes are filled with the solder resist printing ink, and exposing and developing to solidify the solder resist printing ink; (3) laminating: laminating the layer or the plurality of layers of daughter boards having the solder resist printing ink with other daughter boards into a whole by high-frequency prepregs; and (4) taking off the solder resist printing ink. The production method provided by the invention can commendably solve the problem that glue is difficult to remove when the high-density laminated printed circuit board of the high-frequency material is laminated and has the advantages of simpleness and safety of operation and low cost. In addition, the production method can play a role of glue resistance so that resin can not overflow to the board surface and is kept on interlamination, thereby effectively strengthening interlaminar bonding force and improving reliability of a product.

A conductive bump structure of a circuit board and a fabrication method thereof are proposed. The circuit board is formed with conductive circuits on a surface thereof An insulating protection layer having a plurality of openings to expose terminals of the conductive circuits is formed on the circuit board. A conductive layer is formed on the insulating protection layer and in the openings thereof. A patterned resist layer is formed on the conductive layer and has a plurality of openings corresponding in position to the terminals of the conductive circuits. Conductive bumps are formed by electroplating in the openings of the resist layer. Then, the resist layer and the conductive layer underneath the resist layer are removed. An adhesive layer is formed on the conductive bumps and completely covers exposed surfaces of the conductive bumps respectively. The circuit board can be electrically connected to electronic elements through the conductive bumps.

A slurry composition for electrode comprising a binder, an active material, and a liquid medium, characterized in that the binder comprises a polymer (X) comprising 60 to 95 mole % of repeating units derived from acrylonitrile or methacrylonitrile and 5 to 30 mole % of repeating units derived from at least one kind of a monomer selected from 1-olefins and compounds represented by the following general formula (1): CH₂═CR¹—COOR² wherein R¹ represents a hydrogen atom or a methyl group and R² represents an alkyl group; and the liquid medium is capable of dissolving the polymer (X). The slurry composition allows the manufacture of a lithium ion secondary battery having enhanced capacity and good charge-discharge cycle characteristics and good charge-discharge rate characteristics.

The present invention relates to a wear-resistant and mildewproof non-stick pan coating. The coating comprises a bottom layer and a surface layer; The bottom layer consists of the following materials in parts by weight: polyimide resin, modified polyvinylidene fluoride resin, a high-temperature-resistant pigment filler, modified polyorganosiloxane polymer, polyetheretherketone PEEK and graphite. The surface layer consists of the following materials in parts by weight: polytetrafluoroethylene resin, phenylene sulfide, acrylate rubber latex, epoxy accelerated resin, a catalyst, fumed silica, nano silver and the like. The wear-resistant and mildewproof non-stick pan coating prepared in the invention is chemically stable at the cooking temperature and does not generate hazardous substance PFOA. The coating has relatively great hardness and the damages of spatulas or spoons to the surface coating of the non-stick pan can be avoided. The non-stick pan prepared from the coating has low cost and a long service life.

The invention relates to paper technology used waste pulp to produce sheet electronic component paper characteristic carried band base paper. It includes the following steps: mixing 50-80% broadleaf pulp, 0-35% need pulp, 0-15% mechanism ground pulp and sending them into high concentration pulping machine to pump to 40-48 degree SR; adding 0.8-1wt% starch and 0.5-1wt% sizing agent to form cover pulp; de-inking, de-sanding, de-dusting for the waste pulp; sending them into the pulping machine; putting into core pulp storing pool; adding 0.8-1wt% starch and 0.5-1wt% sizing agent to form core pulp; distributing the cover and core pulp into cover net and core net by splitting box to form many paper sheet; spraying a layer of starch on them; folding them to form base paper; rolling; drying; dehydrating; surface sizing; cooling; balancing moisture; coiling up. The invention has the advantages of reasonable technology, convenient production, stable quality, practicality, and environmental protection.

A method of producing a semiconductor device according to the present invention comprises steps of:

• • (A) forming trenches (13) on the front surface (FS) of a semiconductor substrate (11) on the back surface (BS) of which a nitride film (12b) is formed;
  • (B) depositing an insulating film (15) to bury the trenches (13);
  • (C) removing the nitride film (12b) on the back surface (BS) of the semiconductor substrate (11) after the step (B); and
  • (D) annealing before the insulating film (15) is etched after the step (C).

The invention discloses a photocurable resin-based ceramic composite material and a ceramic green body degreasing method. By optimizing the design of a resin system, the method increases the penetration depth of a ceramic slurry system and reduces the molding dimensional error while maintaining the system reaction activity; furthermore, the interlayer bonding force of a ceramic green body and theadhesion between the ceramic green body and a printing platform are improved, and the detachment between the ceramic green body and the platform as well as the cracks on the surface of the ceramic green body are reduced.