33results about How to "Full heat resistance" patented technology

Provided is a combined piston ring having an excellent gas seal characteristic and comprising a special gap effective for countermeasures against blow-by, wherein a combustion chamber-side side surface is not locally deformed nor melted even when receiving combustion gas from the combustion chamber side. To this end, a combined piston ring comprises a piston ring body which is produced from a high-strength heat-resistant resin and has a gap part having a step shape when viewed from the upper and lower surfaces and the outer peripheral surface, and a spring which is mounted to the inner peripheral part of the piston ring body and presses the piston ring body radially outward, and the combustion chamber-side side surface of at least the piston ring body is coated with a heat-resistant film.

An oil tempered steel wire, characterized in that it comprises a wire material and, formed on the surface thereof, a coating film comprising one or more inorganic salts selected from the group consisting of a sulfate, a silicate and a borate. The coating film optionally further comprises fats and oils and / or a soap exhibiting lubricity. The oil tempered steel wire has a coating film exhibiting satisfactory heat resistance and good lubricity and thus can secure good coiling workability even in the case of a high strength wire or a wire having a heteromorphic section.

A junction structure is provided with: an electrode of a substrate; an electrode of a semiconductor element; and a junction section that joins the electrode of the substrate, and the electrode of the semiconductor element. Starting from the electrode of the substrate and progressing toward the electrode of the semiconductor element, the following layers are placed in the following sequence in the junction section: a first intermetallic compound layer that contains a CuSn-based intermetallic compound; a Bi layer; a second intermetallic compound layer that contains a CuSn-based intermetallic compound; a Cu layer; and a third intermetallic compound layer that contains a CuSn-based intermetallic compound.

The present invention proposes a heat-insulation film laid so as to be molded at a high temperature, a vacuum thermal insulator having a core material with the outside coated with the heat-insulation film, and a method for fabricating the vacuum thermal insulator by coating the outside of the core material with the insulation film through a thermal-adhesion process. The heat-insulation film according to the present invention may be stably coated on the outside of the core material through the thermal-adhesion process at a high temperature.

Provided is an economical multilayered resin tube-shaped body that can be safely used in a high-temperature environment such as an engine compartment. A multilayered resin tube-shaped body (1) having excellent heat resistance is obtained by forming an outer layer (2) from a thermoplastic resin having a melting point of 190-300 C and forming an inner layer (3) from a thermoplastic resin having a melting point of 150-300 C and low liquid or gas permeability. The thermoplastic resin that forms the outer layer (2) is preferably a resin having a hoop stress of 10 MPa or greater in a 120 C atmosphere. Furthermore, the thermoplastic resin that forms the inner layer (3) is preferably a resin having a gasoline permeability of 1.0 g / m2day or less.

The object of the present invention is to provide a laminated body for element processing which does not generate volatile components and does not cause cracks due to peeling or the like during the back grinding of semiconductor circuit forming substrates and the back circuit formation process. The cracking of the substrate can be peeled under mild conditions at room temperature, and there is almost no temporary adhesive remaining on the semiconductor circuit formation substrate side after peeling. The laminated body for element processing of the present invention is a laminated body for element processing in which a substrate for element processing is laminated on a support substrate via a temporary adhesive layer, and is characterized in that the temporary adhesive layer is sequentially laminated from the support substrate side. The heat-resistant resin layer A, the heat-resistant resin layer B, the adhesive force between the heat-resistant resin layer B and the substrate for element processing is lower than the adhesive force between the heat-resistant resin layer A and the supporting substrate and the heat-resistant resin layer B and the heat-resistant resin Adhesion of Layer A.

The invention provides a porous film comprising aromatic polyamide as a constituent component that has high heat resistance, high air permeability and high affinity to electrolytes. It is a porous aromatic polyamide film comprising aromatic polyamide and a hydrophilic polymer wherein the hydrophilic polymer accounts for 12 to 50 parts by mass per 100 parts by mass of the aromatic polyamide, the thickness being 2 to 30 micrometers, the Gurley air permeability being 0.5 to 300 seconds / 100 ml, and the thermal shrinkage rate being -0.5 to 1.0% at 200°C.

The present invention provides a high-heat-resistant resin composition for display substrates which, regardless of the curing conditions, gives a substrate for flexible displays that has sufficient transparency and an adequate linear expansion coefficient. This resin composition for display substrates comprises: a poly(amic acid) comprising repeating units represented by formulae (1-1) and (1-4) (wherein Ar1 and Ar2 are different from each other and each independently represent a tetravalent aromatic group having a substituent substituted with fluorine, Ar3 represents a divalent group represented by formula (4) (wherein q is 1 or 2 and l is 1 or 2), and n1 and n4 each indicate the number of repeating units ); and an organic solvent.

A laminate comprising a heat-resistant polymer film, an inorganic substrate, and a polyamine compound layer formed using a polyamine compound, wherein the polyamine compound layer is formed between the heat-resistant polymer film and the inorganic substrate.

This invention is a thermoplastic resin composition comprising a thermoplastic resin (A) and a reactive functional group-containing resin (B), which has a specific structure in the morphology of the resin composition observed by transmission electron microscopy tomography, and the relaxation time T1C of each carbon nucleus by the solid NMR measurement of the thermoplastic resin composition containing a polyamide resin is kept in a specific range. The composition is excellent in the balance between contradictory properties such as impact resistance and heat resistance, remarkably exhibits a peculiar viscoelastic behavior not observed in the conventional polymeric materials, and is remarkably excellent in impact energy absorbing performance and vibration energy absorbing performance at the time of high-speed deformation.

The present invention pertains to a coated metal plate having a coating film on at least one surface thereof. Provided are the coated metal plate and a drawn-and-ironed can comprising the coated metal plate that have excellent can production workability without metal exposure even when exposed to harsh processing such as drawing and ironing, as a result of: the coating film containing polyester resin as a main component thereof and a beta-hydroxyalkyl amide compound as a curing agent; and the elongation of the coating film under test conditions of 90 degree being at least 200%.

The present invention addresses the problem of providing a novel ethylene / alpha-olefin / non-conjugated polyene copolymer which contains a specific non-conjugated polyene, e.g., VNB, as a comonomer ingredient and has a low long-chain branch content and which, when crosslinked with a peroxide, has excellent curability and satisfactory processability. The ethylene / alpha-olefin / non-conjugated polyene copolymer according to the present invention is characterized by comprising constituent units derived from ethylene (A), a C3-20 alpha-olefin (B), and a non-conjugated polyene (C) including two or morepartial structures in total in the molecule which are selected from the group consisting of those of general formulae (I) and (II), and by satisfying specific requirements.

The present invention relates to a thermoplastic resin composition, which is a thermoplastic resin composition comprising a thermoplastic resin (A) and a resin (B) having a reactive functional group, the composition of which is observed by transmission electron beam tomography In the form, a thermoplastic resin composition having a specific structure and containing a polyamide resin has a relaxation time T1C of the carbon core measured by solid NMR within a specific range, and the composition has an excellent balance of opposite properties such as impact resistance and heat resistance At the same time, it remarkably exhibits specific viscoelastic properties that have never been found in existing polymer materials, and is remarkably excellent in impact energy absorption performance and vibration energy absorption performance during high-speed deformation.

The present invention provides a hot-melt adhesive having a sufficiently long pot life and exhibiting good strength and heat resistance. The invention relates to a hot-melt adhesive composition containing hydrocarbon cyclic polymer, α-olefin polymer and tackifying resin.

The invention provides an adhesive tape for electronic unit which provided a thermosetting adhesive layer in at least one insulation surface, When shearing adhesive strength at the time of 160 degree heating to a copper plate of said thermosetting adhesive layer measures by a part for speed-of-testing / of 20 mm, above 20 N / cm2, and adhesive tape for electronic parts, wherein ratios (a / b) of speed-of-testing shearing adhesive strength for / of 20 mm (a) and shearing adhesive strength for 50-mm / (b) are 0.8-1.0.

[Problem] To provide a resin composition for display substrates which is capable of forming a useful polyimide film with an appropriate linear expansion coefficient and an appropriate flexibility. [Solution] This resin composition for display substrates contains a polyamic acid which includes a structural unit represented by formula (1) and a structural unit represented by formula (3), or a polyimide which includes a structural unit represented by formula (2) and a structural unit represented by formula (4). [In formulae 1 through 4, X1 represents a tetravalent organic group having an aromatic group and two carbonyl groups, Y1 represents a divalent aromatic group or aliphatic group, Y2 represents a divalent aromatic group having two or more nitrogen atoms, and n and m represent natural numbers.]

Provided are: a prepreg which makes it possible to obtain a fiber-reinforced composite material in which interlayer peeling during point impact is suppressed; a fiber-reinforced composite material having excellent resistance during point impact; and a method for producing the fiber-reinforced composite material. A cured product obtained by curing this prepreg under specific curing conditions has a projected area of a damaged part of 400 mm2 or less as measured by a specific test 1, and the maximum value of tan [delta] of the cured product as measured by a specific test 2 is observed at 100 DEG C or higher. This prepreg contains a reinforcing fiber base material, an epoxy resin composition, and a polymer (C2), the polymer (C2) being present on the outermost surface of the prepreg, and the polymer (C2) having a glass transition temperature of 10 DEG C or less as observed under specific measurement conditions. The manufacturing method of the fiber reinforced composite material comprises the step of heating and forming the prepreg.

Provided is a photosensitive resin composition which exhibits excellent photosensitivity, flexibility, adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, and plating resistance. Also provided is a cured product comprising the same. To this end, the photosensitive resin composition contains (A) an alkali aqueous solution-soluble resin, (B) a cross-linking agent, (C) a photopolymerization initiator, and (D) an epoxy resin represented by chemical formula 1. In the chemical formula 1, the value of (i) / (ii) is 1-3, and G represents a glycidyl group, whereas n is an average value of a repetition number ranging from 0 to 5.