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Resin composition for display substrate, resin film for display substrate, and method for producing resin film for display substrate

A technology of resin composition and resin film, applied in semiconductor/solid-state device manufacturing, instruments, semiconductor devices, etc., can solve the problem of high molecular weight body that cannot obtain sufficient film toughness, and achieve the effect of high transparency

Active Publication Date: 2018-10-23
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In addition, alicyclic tetracarboxylic dianhydride inherently has the problem of being unable to obtain a high-molecular-weight body capable of exhibiting sufficient film toughness due to its polymerization reactivity.

Method used

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  • Resin composition for display substrate, resin film for display substrate, and method for producing resin film for display substrate
  • Resin composition for display substrate, resin film for display substrate, and method for producing resin film for display substrate
  • Resin composition for display substrate, resin film for display substrate, and method for producing resin film for display substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0128] Dissolve TFMB 17.8g (0.056mol), BAPB 0.4g (0.0012mol), PDA 2.5g (0.023mol) in IPMA 430g, add 6FDA 6.3g (0.014mol) and CF3-BP-TMA 42.8g (0.064mol) Thereafter, the reaction was carried out at 23° C. for 24 hours under a nitrogen atmosphere. The Mw of the obtained polymer was 40,700, and the molecular weight distribution was 2.1. The obtained reaction solution was used as the resin composition for display substrates of Example 1 as it is.

[0129] It should be noted that, for the weight average molecular weight (hereinafter abbreviated as Mw) and molecular weight distribution of the polymer, a GPC device (Shodex column SB803HQ and SB804HQ) manufactured by TOSOH Co., Ltd. was used, and dimethylformamide was used as a washing machine. The solvent was removed, and the measurement was performed at a flow rate of 0.9 mL / min and a column temperature of 40°C. In addition, Mw is the value converted into polystyrene (the same applies below).

Embodiment 2

[0131] A reaction solution containing a polymer having Mw of 38,700 and a molecular weight distribution of 2.1 was obtained in the same manner as in Example 1 except that IPMA was replaced by NMP in Example 1. The obtained reaction solution was used as the resin composition for display substrates of Example 2 as it is.

Embodiment 3～4 and comparative example 4～6

[0139] [3] Production of resin film (production of polyimide film)

[0140] The resin compositions of Examples 1 to 2 and Comparative Examples 1 to 3 were coated on a glass substrate using a bar coater, and were sequentially carried out under reduced pressure at 110° C. for 10 minutes, at 230° C. for 30 minutes, and at 300° C. for 30 minutes. minutes and 120 minutes at 350° C. to obtain resin films (respectively, the resin films of Examples 3 to 4 and Comparative Examples 4 to 6).

[0141] [4] Evaluation of resin film

[0142] The obtained resin film was evaluated by the following method. The results are shown in Table 1. In addition, the thin film was produced separately for each evaluation. The film thickness shows the value of the resin film used for flexibility evaluation.

[0143]

[0144] The film thickness of the resin film was measured using a contact film thickness meter (Dektak 3ST) manufactured by ULVAC Corporation.

[0145]

[0146] The flexibility of the ...

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Abstract

The present invention provides a high-heat-resistant resin composition for display substrates which, regardless of the curing conditions, gives a substrate for flexible displays that has sufficient transparency and an adequate linear expansion coefficient. This resin composition for display substrates comprises: a poly(amic acid) comprising repeating units represented by formulae (1-1) and (1-4) (wherein Ar1 and Ar2 are different from each other and each independently represent a tetravalent aromatic group having a substituent substituted with fluorine, Ar3 represents a divalent group represented by formula (4) (wherein q is 1 or 2 and l is 1 or 2), and n1 and n4 each indicate the number of repeating units ); and an organic solvent.

Description

technical field [0001] The present invention relates to a resin composition for a display substrate, a resin film for a display substrate, and a method for producing a resin film for a display substrate. Background technique [0002] In recent years, with the rapid progress of electronic devices (electronics) such as displays such as liquid crystals, organic ELs, and electronic papers, solar cells, and touch panels, it has been gradually required to reduce the thickness and weight of the device, and further, it is also required that the device of flexibility. In these devices, various electronic components, such as thin film transistors, transparent electrodes, etc., are formed on a glass substrate. By changing the glass material into a film material, the panel itself can be made thinner and lighter, and furthermore Flexibility. [0003] However, for film materials as glass substitutes, in addition to transparency, low linear thermal expansion on the same level as that of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08L79/08G09F9/30H01L21/312H01L21/336H01L29/786C08G73/14C08J5/18C08K5/16
CPCC08G73/1039C08G73/1042C08G73/105C08G73/1064C08G73/1067C08G73/1071C08G73/14C09D179/08H01L21/02118H01L29/78603
Inventor 江原和也
Owner NISSAN CHEM IND LTD
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