48results about How to "Good curing properties" patented technology

An epoxy resin composition for encapsulating a semiconductor chip having an improved flowability, an improved sequential moldability and the like, and additionally having improved characteristics of a cured product thereof, such as an improved mold-releaseability, an improved resistance to reflow soldering heat and the like, and a semiconductor device that is formed by encapsulating a semiconductor chip with the epoxy resin composition. An epoxy resin composition for encapsulating a semiconductor chip containing essential components of: (A) an epoxy resin, (B) a phenolic resin, (C) a cure accelerator, (D)an inorganic filler, (E) a mold releasing agent, (F) a silane coupling agent and (G) a chemical compound having aromatic ring that has hydroxyl groups, each of which is bound to respective two or more adjacent carbon atoms that composes the aromatic ring. At least one of said (A) epoxy resin and said (B) phenolic resin contains resin of novolac structure, in which biphenylene skeleton is included in its main chain, and said (E) mold releasing agent includes one or more chemical compound(s) selected from a group consisting of (E1) oxidized polyethylene wax, (E2) glycerin tri-fatty acid ester and (E3) oxidized paraffin wax, and further, said (E) mold releasing agent is contained in the amount of 0.01 wt % to 1 wt % both inclusive, and said (G)chemical compound is contained in the amount of 0.01 wt % to 1 wt % both inclusive, in the total epoxy resin composition.

The present invention provides coating compositions with excellent curing performance. Curing can occur very rapidly for excellent cycle time, yet with minimal (if any) foaming. A preferred catalyst system helps to provide excellent initial and follow through cure through the entirety of the coating thickness, even with respect to in-mold coating (IMC) applications. Preferred aspects of the invention provide a composition having zero, or nearly zero, emissions of volatile organic compounds (VOC) when applied and cured.

The invention discloses a synthesis method for beta-naphthol modified phenolic resin. The synthesis method comprises the following steps: adding beta naphthol and phenol in an batch reactor according to the ratio of (1:2)-(1:6), adding hydrochloric acid, wherein the mole dosage of hydrogen chloride or sulfuric acid accounts for 6-20% of that of the phenol and water is used as a solvent, heating to 80-90 DEG C, adding paraformaldehyde or a formaldehyde aqueous solution, wherein the mole dosage of formaldehyde is two times of that of the phenol. According to the invention, since beta-naphthol is used as modified material of phenolic resin, compared with common melamine, lignin or cardanol modification, the following advantages are achieved: the final bonding density of the phenolic resin is enhanced, the curing characteristic of phenolic resin is improved, and for the curing condition, high temperature curing is changed into room temperature curing; in addition, compared with original resorcinol modified phenolic resin, the beta-naphthol modified phenolic resin has the advantages that application time is obviously prolonged, and fire-proof coating construction of high-rise buildings is facilitated.