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Synthesis method for beta-naphthol modified phenolic resin

A technology of novolac resin and synthesis method, which is applied in the field of synthesis of B-naphthol modified phenolic resin, can solve the problems of unsatisfactory refractory effect, reduce the curing density of phenolic resin, and low fire resistance, so as to facilitate fireproof coating Application, improvement of curing characteristics, and prolonged pot life

Inactive Publication Date: 2015-09-09
江苏常州酞青新材料科技有限公司
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Problems solved by technology

But the cardanol modified phenolic resin, the molecular weight increases, the flexibility of the phenolic resin also increases, and the ability to withstand instantaneous high temperature is strengthened. However, due to the long hydrocarbon chain of the cardanol itself, the curing density of the phenolic resin is reduced, so this kind of resin is cured. Finished product Long-term refractory ability is not high, so it is obviously not ideal for refractory materials used in high-rise buildings

Method used

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Embodiment Construction

[0011] A kind of synthetic method of B-naphthol modified phenolic resin, comprises the following steps:

[0012] A, β-naphthol, phenol are added in the batch reactor with molar ratio 1: 2-1: 6 ratio, add hydrochloric acid or sulfuric acid, wherein hydrogen chloride or sulfuric acid molar dosage are 6-20% of phenol molar dosage, make with water Solvent, heat up to 80-90°C, add paraformaldehyde or formaldehyde aqueous solution, wherein the molar amount of formaldehyde is 1-2 times the molar amount of phenol;

[0013] B. After the formaldehyde is added, the temperature is raised to 120°C, the product is separated from the water, and the viscous product is separated from the water to obtain a modified novolak resin intermediate, which is added in a batch reaction at a molar ratio of 1:2-1:5. In the container, add hydrochloric acid or sulfuric acid, wherein the molar dosage of hydrogen chloride or sulfuric acid is 5-15% of the molar dosage of phenol, use water as solvent, and heat ...

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Abstract

The invention discloses a synthesis method for beta-naphthol modified phenolic resin. The synthesis method comprises the following steps: adding beta naphthol and phenol in an batch reactor according to the ratio of (1:2)-(1:6), adding hydrochloric acid, wherein the mole dosage of hydrogen chloride or sulfuric acid accounts for 6-20% of that of the phenol and water is used as a solvent, heating to 80-90 DEG C, adding paraformaldehyde or a formaldehyde aqueous solution, wherein the mole dosage of formaldehyde is two times of that of the phenol. According to the invention, since beta-naphthol is used as modified material of phenolic resin, compared with common melamine, lignin or cardanol modification, the following advantages are achieved: the final bonding density of the phenolic resin is enhanced, the curing characteristic of phenolic resin is improved, and for the curing condition, high temperature curing is changed into room temperature curing; in addition, compared with original resorcinol modified phenolic resin, the beta-naphthol modified phenolic resin has the advantages that application time is obviously prolonged, and fire-proof coating construction of high-rise buildings is facilitated.

Description

technical field [0001] The invention relates to a synthesis method of B-naphthol modified phenolic resin. Background technique [0002] Phenolic resins mainly include alkaline cured phenolic resins and acidic phenolic resins. As refractory coatings and phenolic resins for refractory materials, it is expected that phenolic resins have high adhesive density, good compactness, and less pores after curing, which is conducive to high temperature conditions. Under the condition of infiltration of flammable gas, in order to improve the fire and flame retardant properties of phenolic resin. In order to improve the flame retardancy of phenolic resin, the common practice is to manufacture high molecular weight phenolic resin or ultra-high molecular weight phenolic resin, which can effectively reduce the appearance of a large number of pores caused by the loss of small molecules such as formaldehyde and water molecules in the curing stage of phenolic resin . However, due to the assoc...

Claims

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Application Information

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IPC IPC(8): C08G8/10C08G8/08
Inventor 陈晓洲蒋明
Owner 江苏常州酞青新材料科技有限公司
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