Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Secondary mixing method of epoxy resin composition for semiconductor encapsulation

An epoxy resin and secondary mixing technology, which is applied to the preparation field of epoxy resin compositions, can solve the problems of poor fluidity, low mold opening hardness, and many insolubles of epoxy resin compositions, and achieves improved curing characteristics, Improved mold opening hardness and good uniformity

Active Publication Date: 2018-06-19
江苏中科科化新材料股份有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One of the objectives of the present invention is to solve the problems of poor fluidity, many insolubles and low mold opening hardness of the epoxy resin composition obtained by the current preparation method by using the secondary melting and mixing method, thereby providing a preparation method Secondary kneading method of epoxy resin composition for semiconductor encapsulation with low insoluble matter content, high fluidity, and high mold opening hardness

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Secondary mixing method of epoxy resin composition for semiconductor encapsulation
  • Secondary mixing method of epoxy resin composition for semiconductor encapsulation
  • Secondary mixing method of epoxy resin composition for semiconductor encapsulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Components and contents in the epoxy resin composition for preparing semiconductor encapsulation are:

[0031] O-cresol novolac epoxy resin A1 ("N-665" manufactured by DIC Corporation of Japan) 15wt%

[0032] Phenol novolac resin B1 ("TD-2131" manufactured by DIC Corporation of Japan) 7wt%

[0033] 2-Methylimidazole C1 0.15wt%

[0034] 1,8-diazabicyclo(5,4,0)undecene-7C2 0.45wt%

[0035] Silica powder D (d50 is 25μm) 67wt%

[0036] Flame retardant (a mixture of zinc borate, magnesium hydroxide and aluminum hydroxide, wherein the weight ratio of zinc borate: magnesium hydroxide: aluminum hydroxide is 8:2:1; the particle size d50 ranges from 0.1 to 10 μm) E 8wt%

[0037] Carnauba Wax F 0.4wt%

[0038] γ-Glycidyl propyl ether trimethoxysilane G 0.5wt%

[0039] Inorganic ion scavenger H 0.2wt% (Japan TOAGOSEI Co., Ltd system IXE500 (Bi 2 o 3 ·3H 2 O))

[0040] Carbon black I 0.5wt%

[0041] Liquid silicone oil J 0.3wt%

[0042] Silicone rubber powder K 0.5wt% (d...

Embodiment 2～10

[0050] The composition and content of the epoxy resin composition for semiconductor encapsulation are shown in Table 1, the preparation method is the same as in Example 1, the evaluation method is the same as in Example 1, and the evaluation results are shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a secondary mixing method of an epoxy resin composition for semiconductor encapsulation. The present invention is to prepare epoxy resin, phenolic resin curing agent, inorganic filler, release agent, low stress modifier, coloring agent, flame retardant, silane coupling agent and Put the inorganic ion scavenger into a high-speed mixer, after stirring evenly, melt and knead at a temperature of 70-100°C, press into tablets after kneading, cool, and pulverize into powder; then mix the obtained powder with a solidification accelerator in a high-speed mixer After stirring evenly in the medium, carry out secondary melting and kneading at a temperature of 70-100° C., after kneading, tablet, cool, and pulverize to obtain an epoxy resin composition for semiconductor encapsulation. The invention adopts the secondary mixing method to obtain the epoxy resin composition for semiconductor encapsulation with good fluidity, low insoluble matter content, excellent encapsulation moldability, reduced leak seal ratio and improved mold opening hardness.

Description

technical field [0001] The invention relates to a preparation method of an epoxy resin composition for semiconductor packaging, in particular to a secondary mixing method of an epoxy resin composition for semiconductor packaging that can improve the fluidity and packaging moldability of the epoxy resin composition, and the semiconductor Epoxy resin composition for encapsulation. Background technique [0002] With the rapid development of the semiconductor industry, the semiconductor packaging industry has also developed rapidly; in recent years, semiconductor devices have developed in the direction of miniaturization, thinning and surface mount technology, and have developed in the direction of ultra-large scale, requiring semiconductor packaging materials to have good filling performance, high fluidity, fast curing properties. However, the traditional one-time mixing processing method has not been improved on a large scale, and the mixing method of the epoxy resin composit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/06C08K3/22C08K7/18C08K3/34C08K3/28C08K3/38C08K3/24C08K5/1515C08G59/62B29B7/00
Inventor 李海亮李刚王善学卢绪奎余金光
Owner 江苏中科科化新材料股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com