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Thermosetting Resin Composition

A resin composition, epoxy resin technology, applied in the direction of epoxy resin glue, adhesive type, electric solid device, etc., can solve the problem of insufficient resistance and other problems, and achieve excellent heat resistance, excellent performance, reliability excellent effect

Inactive Publication Date: 2017-10-20
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the current situation is that even in the case of using the above-mentioned high heat-resistant resin, in the thermal cycle test of repeated heating and cooling assuming the actual high-temperature operating equipment, and the power cycle test simulating the high-temperature operating state of the element , still can't get enough patience

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6 and comparative example 2-3、5-6

[0134]The raw materials of the resin composition shown in Table 1 were pulverized and mixed with a super mixer for 5 minutes, and then uniformly mixed / kneaded using a kneader to obtain sealing epoxy resin compositions of the present invention and comparison. This resin composition was pulverized with a mixer, and further formed into a flat plate with a flat plate. Quantification of the residual solvent in the composition was performed using a gas chromatograph (SHIMADZU, GC-2014).

[0135] The measurement of the modulus was performed based on the following method. The resin composition flattened so that it might become 1 cmphi and 2 mm in thickness was measured by the parallel plate method using the rheometer (TA Instruments company make, DHR-2) under the condition of pressure 20 MPa. Under the conditions of a pitch of 2000 μm, a rotating plate diameter of 8 mm, a frequency of 1.0 Hz, and a strain of 0.1%, after stabilizing the temperature of the measuring part to 23 °C, the ...

Embodiment 7、8、 comparative example 7

[0150] In Example 1, Examples 7, 8, and Comparative Example 7 shown in Table 3, a thermal cycle test at 200° C. to -50° C. was carried out instead of the power cycle test in Example 1. The same method as in Example 1 is carried out. Details of the heat cycle test are shown below.

[0151] Using the thermal shock device TSE-11 manufactured by ESPEC Corp., hold the sample at 200°C for 30 minutes and hold it at -50°C for 30 minutes as one cycle, take out the sample after 500 cycles, and check the curing visually Whether the material has cracks or peeling off (Table 4).

[0152] The results are shown in Table 3. In Examples 1, 7, and 8, no cracks were observed after the thermal cycle test, and in Comparative Example 7, cracks were observed after the thermal cycle test. Since the softening point of the epoxy resin in Comparative Example 7 was too low, it is considered that it tends to be defective after the heat cycle test.

[0153] [table 3]

[0154]

[0155] [Table 4]

...

Embodiment 9～12、 comparative example 8

[0158] Example 1, Examples 9 to 12, and Comparative Example 8 shown in Table 5 were operated under the temperature conditions of the thermal cycle test of 180°C to -50°C (Table 6), and the same method as Table 3 was used. method to operate.

[0159] The results are shown in Table 5. In Examples 1, 9-12, no cracks were observed after the thermal cycle test, and in Comparative Example 8, cracks were observed after the thermal cycle test. Since the softening point of the curing agent in Comparative Example 8 was too low, the heat resistance of the cured product was insufficient. In addition, the equivalent weight of the curing agent was too large, so the crosslinking density of the cured product was insufficient. Defects are prone to occur after the test.

[0160] [table 5]

[0161]

[0162] [Table 6]

[0163]

[0164] [Table 7]

[0165] Measurement site

Pt2-1

Pt2-2

C

37

84

Si

18

1

C / Si

2

-

[0166] The quant...

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Abstract

The present invention relates to a resin composition, and provides a curing resin composition which can obtain the full tolerance for a heat cycle test and / or a power cycle test, a sealing material using the same, a semiconductor device using the sealing material and a manufacturing method of the semiconductor device. The resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200 DEG C after temperature increase from room temperature to 200 DEG C. at 50 DEG C. / min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35 DEG C or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and(I-IV) the equivalent value of the curing agent (B) is no greater than 90 g / eq and the softening point is 105 DEG C or higher.

Description

technical field [0001] The present invention relates to a thermosetting resin composition that imparts a cured product excellent in heat resistance, a sealing material using the curable resin composition, a semiconductor device using the sealing material, and a manufacturing method for sealing the semiconductor device. Background technique [0002] Among thermosetting resin compositions, epoxy resin compositions are widely used in electrical / electronic components and structures due to their workability and excellent electrical properties, heat resistance, adhesiveness, and moisture resistance (water resistance) of their cured products. Materials, adhesives, coatings, etc. [0003] For electronic equipment products, in order to protect electronic components such as semiconductor elements from external environments such as impact, pressure, humidity, and heat, sealing materials can be used. As the sealing material, epoxy / phenol-based sealing materials in which the main ingred...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/18H01L23/29H01L21/56
CPCC08K7/18H01L21/56H01L23/295C08K2201/003C08K2201/006C08K2201/014C08L2201/08C08L2203/206C08L63/00H01L2924/181H01L23/293H01L2224/48091H01L2224/48247H01L2224/73265C08K3/013C09J163/00C08G59/20C08G59/50C08K3/36C08K2201/005C09K3/10C09K2003/1078H01L2924/00014H01L2924/00012H01L21/565
Inventor 井上阳统高田省三
Owner ASAHI KASEI KK
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