Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Adhesive tape for electronic parts

A technology for electronic components and tapes, applied in electrical components, electrical solid devices, circuits, etc., can solve the problem of high operating temperature for attachment, achieve sufficient heat resistance, improve operability and yield.

Active Publication Date: 2011-02-09
TOMOEGAWA PAPER CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, in order to solve this problem, an attempt was made to increase the melting temperature of the adhesive to prevent a decrease in the viscosity of the adhesive at the die-attach curing temperature. In addition, an attempt was also made to increase the adhesive strength, but at this time the attachment operation The temperature is high, and there are problems in operability in semiconductor manufacturing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive tape for electronic parts
  • Adhesive tape for electronic parts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (Production of tapes for electronic components)

[0035] On one side of a polyimide film (manufactured by Toray Dupont (DUPONT), trade name KAPTON200EN) with a thickness of 50 μm, the following adhesive paint is coated, and the thickness of the thermosetting adhesive layer after drying is Thickness was 20 micrometers, and it dried in the hot-air circulation type oven set at 160 degreeC after that, and obtained the adhesive tape for electronic components of this invention.

[0036] (composition of adhesive paint)

[0037] 100 parts by weight of acrylonitrile-butadiene copolymer

[0038] (Mooney viscosity is 53M 1+4 100°C, acrylonitrile content 40% by weight)

[0039] 75 parts by weight of dicyclopentadiene type epoxy resin

[0040] (manufactured by Dainippon Ink Chemical Industry Co., Ltd., trade name: EPICLON HP7200)

[0041] 20 parts by weight of novolak resin

[0042] (manufactured by Qunyei Chemical Co., trade name: RESITOP PSM-4324)

[0043] 3,3',5,5'-tetraet...

Embodiment 2

[0047] Except having changed the adhesive paint into the following composition, it carried out similarly to Example 1, and obtained the adhesive tape for electronic components of this invention.

[0048] (composition of adhesive paint)

[0049] 100 parts by weight of acrylonitrile-butadiene copolymer

[0050] (Mooney viscosity is 53M 1+4 100°C, acrylonitrile content 40% by weight)

[0051] 70 parts by weight of biphenyl epoxy resin

[0052] (manufactured by Japan Epoxy Co., Ltd., trade name: EPIKOTE YX4000H)

[0053] 3,3',4,4'-benzophenone tetracarboxylic anhydride 30 parts by weight

[0054] 400 parts by weight of methyl ethyl ketone

[0055] 200 parts by weight of tetrahydrofuran

Embodiment 3

[0057] Except having changed the adhesive paint into the following composition, it carried out similarly to Example 1, and obtained the adhesive tape for electronic components of this invention.

[0058] (composition of adhesive paint)

[0059] 100 parts by weight of acrylonitrile-butadiene copolymer

[0060] (Mooney viscosity is 53M 1+4 100°C, acrylonitrile content 40% by weight)

[0061] 70 parts by weight of novolac epoxy resin

[0062] (manufactured by Nippon Kayakusha, brand name: EPPN-501H)

[0063] 25 parts by weight of 4,4'-diaminodiphenylsulfone

[0064] 5 parts by weight of zinc oxide

[0065] 400 parts by weight of methyl ethyl ketone

[0066] 200 parts by weight of tetrahydrofuran

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an adhesive tape for electronic unit which provided a thermosetting adhesive layer in at least one insulation surface, When shearing adhesive strength at the time of 160 degree heating to a copper plate of said thermosetting adhesive layer measures by a part for speed-of-testing / of 20 mm, above 20 N / cm2, and adhesive tape for electronic parts, wherein ratios (a / b) of speed-of-testing shearing adhesive strength for / of 20 mm (a) and shearing adhesive strength for 50-mm / (b) are 0.8-1.0.

Description

technical field [0001] The present invention relates to an adhesive tape for electronic components used in an assembly process of a semiconductor device for adhering components constituting a semiconductor device, such as a semiconductor chip, a chip mounting substrate, a lead frame, a heat sink, etc. . Background technique [0002] Examples of the adhesive tape used in resin-molded semiconductor devices include lead frame fixing tape, TAB tape, die attach tape, and the like. [0003] Hitherto, for the above-mentioned applications, thermosetting adhesives in which thermosetting resins represented by epoxy resins and NBR (acrylonitrile-butadiene copolymer) are mixed are widely used. It is made of a flexible thermoplastic resin. Currently, there are products in which adhesives are laminated on one or both sides of a film such as plastic as needed, or products in which an adhesive sheet is formed on a release film, etc. products. [0004] For example, the adhesive tape for f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C09J133/20
CPCH01L2924/0002
Inventor 栃平顺清水勇气岩渊达留
Owner TOMOEGAWA PAPER CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com