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Laminated body for element processing, method of manufacturing laminated body for element processing, and method of manufacturing thin element using the same

A technology of laminates and components, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, chemical instruments and methods, etc., can solve the problems of decreased adhesion, increased adhesion, melting of solder bumps, etc., and achieves high productivity. Effect

Inactive Publication Date: 2018-06-08
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, temporary adhesives that are peeled off by heat treatment have the following problems: the solder bumps are melted during the heating process for peeling; to rise, to become inextricable; etc.

Method used

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  • Laminated body for element processing, method of manufacturing laminated body for element processing, and method of manufacturing thin element using the same
  • Laminated body for element processing, method of manufacturing laminated body for element processing, and method of manufacturing thin element using the same
  • Laminated body for element processing, method of manufacturing laminated body for element processing, and method of manufacturing thin element using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0083] The following examples are given to illustrate the present invention, but the present invention is not limited by these examples. Evaluation methods for glass transition temperature, weight loss rate, and adhesive force will be described.

[0084] (1) Determination of glass transition temperature

[0085] Using a bar coater, apply the heat-resistant resin solutions (B1 to B9, A1 to A6) described in Production Examples 1 to 15 below to a thickness of 20 μm on the glossy surface of an electrodeposited copper foil with a thickness of 18 μm , and then dried at 80° C. for 10 minutes, dried at 150° C. for 10 minutes, and then heat-treated at 250° C. for 10 minutes in a nitrogen atmosphere to convert to polyimide and obtain resin-laminated copper foil. Next, the entire surface of the copper foil in the obtained resin-laminated copper foil was etched with a ferric chloride solution to obtain a single film of heat-resistant resin.

[0086] A single film of about 10 mg of the o...

manufacture example 1

[0119] Production example 1 (polymerization of heat-resistant resin B solution)

[0120]In the reaction kettle that has thermometer, dry nitrogen inlet, utilizes the heating · cooling device of warm water · cooling water, and stirring device, charge 75.7g (0.7mol) PDA, 60.1g (0.3 mol) DAE, after dissolving, add 176.5g (0.6mol) BPDA, 87.2g (0.4mol) PMDA, react at room temperature for 1 hour, then react at 60°C for 5 hours to obtain a 15% by weight polyamic acid resin solution (B-1).

manufacture example 2～7

[0121] Production examples 2 to 7 (polymerization of heat-resistant resin B solution)

[0122] According to changing the kind and charging amount of acid dianhydride and diamine as shown in Table 1, except that, carry out the operation similar to Manufacturing Example 1, obtain the polyamic acid resin solution of 15% by weight (B-2~ 7).

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Abstract

The object of the present invention is to provide a laminated body for element processing which does not generate volatile components and does not cause cracks due to peeling or the like during the back grinding of semiconductor circuit forming substrates and the back circuit formation process. The cracking of the substrate can be peeled under mild conditions at room temperature, and there is almost no temporary adhesive remaining on the semiconductor circuit formation substrate side after peeling. The laminated body for element processing of the present invention is a laminated body for element processing in which a substrate for element processing is laminated on a support substrate via a temporary adhesive layer, and is characterized in that the temporary adhesive layer is sequentially laminated from the support substrate side. The heat-resistant resin layer A, the heat-resistant resin layer B, the adhesive force between the heat-resistant resin layer B and the substrate for element processing is lower than the adhesive force between the heat-resistant resin layer A and the supporting substrate and the heat-resistant resin layer B and the heat-resistant resin Adhesion of Layer A.

Description

technical field [0001] The present invention relates to an adhesive for temporary bonding, a laminate for device processing using the same for a temporary adhesive layer, a method for manufacturing a laminate for device processing, and a thin device using the laminate for device processing In the production method, the adhesive for temporary bonding has excellent heat resistance, does not change in adhesive force even through the production process of semiconductor devices, image display devices, etc., and can be peeled off under mild conditions at room temperature. Background technique [0002] In recent years, the reduction in weight and thickness of semiconductor devices and image display devices has been progressing. In particular, in semiconductor devices, in order to achieve high integration and high density of semiconductor elements, a technology of connecting and stacking semiconductor chips through silicon through electrodes (TSV: Through Silicon Via) has been devel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02B32B7/04C08G73/10H01L21/304
CPCB32B7/12B32B27/08B32B2307/306B32B2457/20C08G73/1042C08G73/105C08G73/106C08G73/1082C09J179/08H01L21/6835H01L2221/68327H01L2221/6834H01L2221/68386
Inventor 渡边拓生李忠善富川真佐夫竹田清佳
Owner TORAY IND INC
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