A low-temperature resistant two-component solvent-free epoxy coating, which is composed of A component and B component, wherein in weight percentage, A component includes: bisphenol F type epoxy resin 30-45%, bisphenol A type Epoxy resin 5‑10%, epoxy nitrile prepolymer 5‑10%, glycidyl ether reactive diluent 3‑7%, modified silica powder 15‑25%, titanium dioxide 8‑15%, tripolyphosphoric acid Aluminum dihydrogen 3‑10%, mica powder 4‑10%, thixotropic agent 0.6‑1.4%, dispersant 0.2‑0.5%, leveling agent 0.2‑0.5%, defoamer 0.3‑0.7%, carbon black 0.1‑ 0.7%; B component includes: Mannich base 50-75%, thiourea-polyamine condensate 25-50%. Compared with ordinary epoxy coatings, the low-temperature resistant two-component solvent-free epoxy coating for pipe jointing of the present invention has fast curing speed at low temperature, no crystallization and no precipitation, excellent low-temperature bending resistance, excellent low-temperature impact resistance, and heat resistance Excellent water immersion performance, excellent thermal shock resistance and other characteristics.