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Anisotropic conductive film and semiconductor device bonded by the same

An anisotropic, conductive film technology, applied in semiconductor devices, conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as not suitable for anisotropic conductive films, and prevent warping Effect

Active Publication Date: 2013-06-19
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is considered that thermosetting epoxy resin is not suitable as an anisotropic conductive film that can be rapidly cured at low temperature

Method used

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  • Anisotropic conductive film and semiconductor device bonded by the same
  • Anisotropic conductive film and semiconductor device bonded by the same
  • Anisotropic conductive film and semiconductor device bonded by the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] 1. Preparation of anisotropic conductive film composition

[0092] Based on 100 parts by weight of the anisotropic conductive film composition, 5 parts by weight of epoxy reactive monomer (epoxy equivalent: 145g / eq, EX-711, Nagase ChemteX); 30 parts by weight of hydrogenated epoxy resin ( Epoxy equivalent: 225g / eq, ST-3000, Kukdo Chemical Co., Ltd.); and 45 parts by weight of binder resin (phenoxy resin, YP-50, Tohto Kasei Co., Ltd.) with solvent After mixing, 5 parts by weight of a sulfonium-based curing accelerator represented by the following Formula 1-1 was added to the mixture to prepare an insulating adhesive.

[0093] [Formula 1-1]

[0094]

[0095] Then, 10 parts by weight of conductive particles were added to the prepared insulating adhesive, and 5 parts by weight of toluene was added thereto and stirred for 40 minutes to uniformly disperse the conductive particles, thereby preparing an anisotropic conductive film composition.

[0096] After removing air b...

Embodiment 2

[0103] An anisotropic conductive film was prepared in the same manner as in Example 1 except that the content of the epoxy-reactive monomer was increased from 5 parts by weight to 7 parts by weight and the content of the binder resin was decreased from 45 parts by weight to 43 parts by weight.

[0104] The composition of the anisotropic conductive film is listed in Table 1.

Embodiment 3

[0106] An anisotropic conductive film was prepared in the same manner as in Example 1, except that the content of the hydrogenated epoxy resin was increased from 30 parts by weight to 45 parts by weight and the content of the binder resin was decreased from 45 parts by weight to 30 parts by weight.

[0107] The composition of the anisotropic conductive film is listed in Table 1.

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Abstract

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g / eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst. The anisotropic conductive film according to an embodiment may be rapidly cured at low temperature, and serious warpage thereof during heat curing may be reduced and / or prevented. The embodiments provide an anisotropic conductive film that employs a reactive monomer having a particular epoxy equivalent weight to achieve rapid low-temperature curing. The embodiments provide an anisotropic conductive film that uses, e.g., sulfonium borate, as a sulfonium cation curing catalyst to help reduce and / or prevent emission of large amounts of fluorine ions in polymerization of cations. The embodiments provide an anisotropic conductive film that further includes a hydrogenated epoxy resin to help enhance reaction efficiency with a sulfonium cation curing catalyst, thereby exhibiting excellent rapid low-temperature curing properties.

Description

technical field [0001] The present invention relates to an anisotropic conductive film comprising a reactive monomer having an epoxy equivalent of 120 g / eq to 180 g / eq and a sulfonium cationic curing accelerator. More particularly, the present invention relates to a fast low-temperature curable anisotropic conductive film that can be cured quickly at low temperature and can prevent severe warpage during heat curing. Background technique [0002] Generally, an anisotropic conductive film (ACF) refers to a film-like adhesive in which conductive particles, such as metal particles including nickel or gold particles, or metal-coated polymer particles, are dispersed in a resin such as epoxy resin . The anisotropic conductive film means a polymer layer having electrical anisotropy and adhesive properties, which exhibits conductive properties in the thickness direction of the film and insulating properties in the surface direction of the film. When the anisotropic conductive film ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J9/02C09J163/00H01L23/488
CPCC08G59/226C08G59/24C08G59/687C08L63/00C08L2205/02C09J163/00H01B1/20H01L24/29H01L2224/2929H01L2224/29298H01L2224/293H01L2924/07802H01L2924/07811H01L2924/15788H01L2924/0665H01L2924/00014H01L2924/00C08J5/18C09J9/02H01B5/16C09D5/24H01L23/29
Inventor 薛庆一鱼东善金南柱朴憬修朴永祐徐准模柳·阿伦崔贤民
Owner KUKDO ADVANCED MATERIALS CO LTD
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