Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Anisotropic conductive film and semiconductor device bonded by the same

An anisotropic, conductive film technology, used in semiconductor devices, conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as being unsuitable for anisotropic conductive films, and prevent warping Effect

Active Publication Date: 2015-04-08
KUKDO ADVANCED MATERIALS CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is considered that thermosetting epoxy resin is not suitable as an anisotropic conductive film that can be rapidly cured at low temperature

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anisotropic conductive film and semiconductor device bonded by the same
  • Anisotropic conductive film and semiconductor device bonded by the same
  • Anisotropic conductive film and semiconductor device bonded by the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] 1. Preparation of anisotropic conductive film composition

[0092] Based on 100 parts by weight of the anisotropic conductive film composition, 5 parts by weight of epoxy reactive monomer (epoxy equivalent: 145g / eq, EX-711, Nagase ChemteX); 30 parts by weight of hydrogenated epoxy resin ( Epoxy equivalent: 225g / eq, ST-3000, Kukdo Chemical Co., Ltd.); and 45 parts by weight of binder resin (phenoxy resin, YP-50, Tohto Kasei Co., Ltd.) with solvent After mixing, 5 parts by weight of a sulfonium-based curing accelerator represented by the following Formula 1-1 was added to the mixture to prepare an insulating adhesive.

[0093] [Formula 1-1]

[0094]

[0095] Then, 10 parts by weight of conductive particles were added to the prepared insulating adhesive, and 5 parts by weight of toluene was added thereto and stirred for 40 minutes to uniformly disperse the conductive particles, thereby preparing an anisotropic conductive film composition.

[0096] After removing air b...

Embodiment 2

[0103] An anisotropic conductive film was prepared in the same manner as in Example 1 except that the content of the epoxy-reactive monomer was increased from 5 parts by weight to 7 parts by weight and the content of the binder resin was decreased from 45 parts by weight to 43 parts by weight.

[0104] The composition of the anisotropic conductive film is listed in Table 1.

Embodiment 3

[0106] An anisotropic conductive film was prepared in the same manner as in Example 1, except that the content of the hydrogenated epoxy resin was increased from 30 parts by weight to 45 parts by weight and the content of the binder resin was decreased from 45 parts by weight to 30 parts by weight.

[0107] The composition of the anisotropic conductive film is listed in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy equivalentaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
Login to View More

Abstract

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g / eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

Description

technical field [0001] The present invention relates to an anisotropic conductive film comprising a reactive monomer having an epoxy equivalent of 120 g / eq to 180 g / eq and a sulfonium cationic curing accelerator. More particularly, the present invention relates to a fast low-temperature curable anisotropic conductive film that can be cured quickly at low temperature and can prevent severe warpage during heat curing. Background technique [0002] Generally, an anisotropic conductive film (ACF) refers to a film-like adhesive in which conductive particles, such as metal particles including nickel or gold particles, or metal-coated polymer particles, are dispersed in a resin such as epoxy resin . The anisotropic conductive film means a polymer layer having electrical anisotropy and adhesive properties, which exhibits conductive properties in the thickness direction of the film and insulating properties in the surface direction of the film. When the anisotropic conductive film ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J9/02C09J163/00H01L23/488
CPCH01B1/20H01L23/29H01L2224/2929C08G59/226C08G59/24C08L63/00C08G59/687H01L24/29H01L2924/07811C09J163/00H01L2224/293H01L2924/07802C08L2205/02H01L2224/29298H01L2924/15788H01L2924/0665H01L2924/00014H01L2924/00C08J5/18C09J9/02H01B5/16C09D5/24
Inventor 薛庆一鱼东善金南柱朴憬修朴永祐徐准模柳·阿伦崔贤民
Owner KUKDO ADVANCED MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com