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A kind of conductive silver glue applied to electronic resonator and its preparation method

A technology of electronic resonator and conductive silver glue, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of low packaging quality, poor rheological properties, and high temperature resistance of conductive silver glue. Achieve the effect of improving conductivity and bonding strength, fast curing speed at low temperature, and improving commercial value

Active Publication Date: 2022-03-08
常州烯奇新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the high-quality conductive silver pastes currently used are imported from Japan, resulting in high production costs for devices and equipment
At present, the quality of conductive silver glue used for resonators in China is low, and there are mainly problems in the following aspects: poor rheological properties during application, which are specifically reflected in extrusion characteristics and dispensing performance; electrical properties during application ( Such as resistance, frequency response, etc.), mechanical properties (such as adhesion, thermal shock resistance, etc.) and environmental resistance (such as anti-aging, high and low temperature resistance, reflow soldering, etc.) are not very good
[0004] Chinese patent CN105602504B discloses a conductive silver glue suitable for bonding quartz crystal resonators and other electronic components and its preparation method. The budget cost also improves the mechanical properties in use, but the conductive silver glue prepared by it cannot withstand high temperature
[0005] Chinese patent CN104726035A discloses a conductive silver glue, which is made of the following weight percentages: epoxy resin 12-25, curing agent 0.08-1.0, graphene 1-1.5, conductive filler 75-90, wherein, The epoxy resin is bisphenol A epoxy resin, the curing agent is dicyandiamide, and the conductive filler is a mixture of micron-scale flake silver and spherical silver; although the conductive silver glue disclosed in this patent has the highest service temperature, its conductive The maximum use temperature of silver glue still has certain limitations in use, and its use is limited when relatively high temperatures are required, and its conductive silver glue also has problems with poor fluidity and solvents, resulting in low packaging quality and packaged microelectronics. Product performance is unstable

Method used

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  • A kind of conductive silver glue applied to electronic resonator and its preparation method
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Effect test

Embodiment 1

[0027] Embodiment 1: a kind of conductive silver paste applied to electronic resonators, including the following components by weight: 60 parts of silver powder, 0.1 part of graphene airgel, 16 parts of epoxy resin E516 parts, 2 parts of phenolic resin, poly 2 parts of amide resin, 6 parts of acetone, part of dicyandiamide, 0.5 part of 4,6-(dimethylaminomethyl) triphenol, 1 part of silane coupling agent, 5 parts of antioxidant, silver powder with a particle size of 10 μm Flake silver powder, polyamide resin is a mixture of amino polyamide resin (molecular weight 1000-1500) and dimer acid type polyamide resin.

[0028] By adding graphene gel to reduce the use of silver powder, the reduction of silver powder is 15-23%, which greatly reduces the cost of conductive silver glue, and at the same time improves the conductivity and bonding strength of conductive silver glue, compared with the same conductivity And under the condition of bonding strength, improve the commercial value. ...

Embodiment 2

[0034] Embodiment 2: a kind of conductive silver paste applied to electronic resonators, including the following components by weight: silver powder: 70 parts, 1 part of graphene gel, 8 parts of Dow der331, 4 parts of phenolic resin, poly 2 parts of amide resin, 6 parts of N-methylpyrrolidone, 3 parts of alicyclic amine, 1 part of 4,6-(dimethylaminomethyl) triphenol, 3 parts of silane coupling agent, 5 parts of BYK leveling agent, The silver powder is cubic silver powder with a particle size of 15 μm, and the polyamide resin is a mixture of amino polyamide resin (molecular weight 1000-1500) and dimer acid polyamide resin.

[0035] The preparation method of the conductive silver paste of the present embodiment comprises the following steps:

[0036] 1) A mixture of graphene gel, Dow der331, phenolic resin, amino polyamide resin (molecular weight 1000-1500) and dimer acid polyamide resin, N-methylpyrrolidone, alicyclic amine, 4,6- (Dimethylaminomethyl) triphenol, silane couplin...

Embodiment 3

[0040] Embodiment 3: a kind of conductive silver paste applied to electronic resonators, including the following components by weight: silver powder: 78 parts, 1.9 parts of graphene gel, 10 parts of modified epoxy tough resin Y-128R, 5 parts of phenolic resin, 3 parts of polyamide resin, 10 parts of diglycidyl ether, 2 parts of vinylamine, 2 parts of 4,6-(dimethylaminomethyl) triphenol, 2 parts of aluminate coupling agent, disinfectant Foaming agent 4 parts, the silver powder adopts spherical silver powder with a particle size of 15 μm, and the polyamide resin is a mixture of amino polyamide resin (molecular weight 1000-1500) and dimer acid type polyamide resin.

[0041] The preparation method described in the conductive silver paste of the present embodiment comprises the following steps:

[0042] 1) The mixture of graphene gel, modified epoxy tough resin Y-128R, phenolic resin, amino polyamide resin (molecular weight 1000-1500) and dimer acid type polyamide resin, diglycidyl...

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Abstract

The invention belongs to the technical field of conductive silver glue, in particular to a conductive silver glue applied to an electronic resonator, comprising the following components by weight: 60-80 parts of silver powder, 0.1-2 parts of graphene gel, epoxy resin 5-10 parts of resin, 1-5 parts of phenolic resin, 1-4 parts of polyamide resin, 5-10 parts of thinner, 1-3 parts of curing agent, 0.1-2 parts of accelerator, 1-3 parts of coupling agent, Additive 1-5 parts, with strong tensile shear force, very low volume resistivity, very low viscosity, can withstand high temperature above 250 ℃, suitable for reflow soldering process.

Description

technical field [0001] The invention belongs to the technical field of conductive silver glue, and in particular relates to a conductive silver glue applied to an electronic resonator and a preparation method thereof. Background technique [0002] Conductive silver glue is an adhesive with certain conductivity after curing or drying. Through the bonding effect of the matrix resin, the conductive particles are combined together and a conductive path is formed to realize the conductive connection of the adhered materials. Conductive silver glue has the advantages of environmental friendliness, non-toxic metals, no need for pre-cleaning and post-soldering cleaning in the process, and mild curing temperature. It adapts to the development trend of miniaturization, lightness, and integration of electronic devices today, and is widely used in IC. , LED, electronic resonator and other microelectronic packaging fields. [0003] my country is a big country in the production and use o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J161/06C09J177/00C09J9/02C09J11/04
CPCC09J163/00C09J9/02C09J11/04C08L2201/08C08L2205/035C08K2003/0806C08L61/06C08L77/00C08L77/08C08K13/04C08K7/24C08K3/042C08K7/00C08K3/08C08K7/18
Inventor 汪永彬李红元喻金星刘记林杨军徐晓翔
Owner 常州烯奇新材料有限公司
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