The invention provides a thin type
heat pipe, a manufacturing method of the thin type
heat pipe and
electronic equipment. The thin type
heat pipe includes a
pipe body with a cavity, both ends of the
pipe body include convergence parts, the cavity sectional areas the convergence parts decrease gradually in the direction away from the center of the
pipe body, a closed sealing opening is formed in the
tail end of the pipe body, and the cavity is internally provided with a capillary structure and a working medium. Thus, the entire pipe body of the thin type heat pipe is provided with the cavity, compared with other heat pipes with the shrinkage pipe structure, when the length of the pipe body is the same, the volume of the cavity is larger and the length is longer, more capillary structures and working mediums can be accommodated, and the cycle distance of the working medium is longer; the condensation effect of the working medium is improved advantageously, the capacity of
heat transmission of the heat pipe is improved, and heat dissipation performance of the thin type heat pipe is better; and when the thin type heat pipe is applied in
chip heat dissipation design of mobile phones, tablet computers and other electronic products, the
chip temperature can be effectively lowered, the
underclocking phenomenon of a
chip at high temperature is avoided, and chip performance is fully played.