Thin type heat pipe, manufacturing method of thin type heat pipe and electronic equipment

Abstract

The invention provides a thin type heat pipe, a manufacturing method of the thin type heat pipe and electronic equipment. The thin type heat pipe includes a pipe body with a cavity, both ends of the pipe body include convergence parts, the cavity sectional areas the convergence parts decrease gradually in the direction away from the center of the pipe body, a closed sealing opening is formed in the tail end of the pipe body, and the cavity is internally provided with a capillary structure and a working medium. Thus, the entire pipe body of the thin type heat pipe is provided with the cavity, compared with other heat pipes with the shrinkage pipe structure, when the length of the pipe body is the same, the volume of the cavity is larger and the length is longer, more capillary structures and working mediums can be accommodated, and the cycle distance of the working medium is longer; the condensation effect of the working medium is improved advantageously, the capacity of heat transmission of the heat pipe is improved, and heat dissipation performance of the thin type heat pipe is better; and when the thin type heat pipe is applied in chip heat dissipation design of mobile phones, tablet computers and other electronic products, the chip temperature can be effectively lowered, the underclocking phenomenon of a chip at high temperature is avoided, and chip performance is fully played.

Description

technical field [0001] The present application relates to the technical field of heat pipes, in particular to a thin heat pipe, a manufacturing method of the thin heat pipe, and electronic equipment. Background technique [0002] In recent years, the chip performance of mobile consumer electronics products such as mobile phones and tablet computers has improved rapidly, and the chip computing capabilities of mobile consumer electronics products have been able to control large-scale 3D games, image processing, and even complex calculations in the field of neural networks. All kinds of chips will generate a lot of heat when processing complex calculations or continuous high-load operation. With the improvement of the computing power of the chip, the heat generated by the chip will also be more. If the heat cannot be dissipated in time, it will cause the core of the chip to If the temperature is too high, the phenomenon of frequency reduction occurs, which limits the performanc...

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Problems solved by technology

[0005] The application provides a thin heat pipe, a manufacturing method of the thin heat pipe, and an electronic device to solve the problem of poor heat dissipation performance of the phase change heat dissipation structure in the prior art

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