Method and device for precisely machining deep groove and deep hole by varifocal lasers

Abstract

The invention provides a method for precisely machining a deep groove and a deep hole by varifocal lasers. The method comprises the steps that a plurality of focusing lenses with different focal lengths and workpieces are clamped; if deep groove machining is carried out, a laser beam is continuously output; laser etching machining is completed once; if deep hole machining is carried out, N laser pulses are output; the lasers are closed, and a working table moves to the original position; whether machining meets the requirements or not is detected; if machining meets the requirements, machining is finished; if machining does not meet the requirements, a focusing lens base is rotated, the next focusing lens is moved to the position of the current focusing lens, and laser machining is carried out again until machining meets the requirements. The pulse laser beam sequentially penetrates through the focusing lenses with the different focal lengths by rotating the focusing lens base, the focal lengths are progressively changed, the lasers are focused on the new exposed surface in the laser etching or punching process all the time, energy is more concentrated, the punching deep is larger, and the efficiency is higher. The invention provides a device for precisely machining the deep groove and the deep hole by the varifocal lasers at the same time.

Description

Technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a method and device for precision processing of deep grooves and deep holes by zoom laser. Background technique [0002] Laser etching processing belongs to the laser removal category in laser processing. It can also be called evaporation processing. It is based on the thermophysical effect formed by the interaction between the laser and the processed material to cause the change of the physical state to achieve the processing effect of groove or perforation. The main factors affecting the processing quality depend on the laser wavelength, laser power density, beam quality, focus state and the physical characteristics of the processed material itself. [0003] The principle of laser groove or perforation is to use pulsed laser10 6 ~10 9 W / cm 2 The high power density and excellent spatial coherence of the workpiece melt and evaporate the material in the irradiated part of the ...

AI Technical Summary

Problems solved by technology

In terms of processing quality, as the groove depth or hole depth increases, that is, the laser beam defocus increases, the spot size increases synchronously, so that the laser power density received by the processing area decreases. The evaporation effect is reduced, the melting ratio is increased, and the splashing force is not enough, which will lead to more adhered slag at the edge or outlet of deep grooves or deep holes, which is the so-called "burr" phenomenon, which cannot be eliminated

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