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Single-phase ultrahigh heat flow micro-column heat exchanger

A heat exchanger and micro-column technology, which is applied in the field of single-phase ultra-high heat flow micro-column group heat exchangers, can solve the problems of limited heat dissipation capacity of CPU liquid-cooled heat exchangers, and achieve a reduction in decent ratio, small size and large size. Effect of heat transfer coefficient

Inactive Publication Date: 2007-08-29
ENERGY RES INST OF SHANDONG ACAD OF SCI
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Problems solved by technology

However, the heat dissipation capacity of the existing CPU liquid-cooled heat exchanger is limited. When considering the structure in the channel, the basic starting point is to increase the heat exchange area, so its heat exchange capacity is only tens of watts (generally below 50 watts) per square cm (depending on fan power and cooling area of ​​heat sink)

Method used

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Embodiment Construction

[0029] As shown in Figure 1, this mode is a common way for the existing general computer CPU to dissipate heat. Its main working principle is to install cooling fins on the heating end of the CPU, and the heat in the CPU is taken out through the fins, and then the heat is taken out by the fan. The incoming wind takes away the heat in the fins. This scheme has a simple structure and is relatively easy to realize. However, we know that when the calorific value of the heating element reaches 20W / cm 2 , air cooling is more difficult to solve. In the scheme in Figure 1, the effective heat dissipation of the CPU is realized by increasing the heat exchange area (fin processing). In Intel's Pentium 4 processor (3.06GHz), its maximum calorific value is close to 50W / cm 2 , the result of the above scheme is that the heat dissipation structure is huge and heavy. However, the rapid increase in the heat generation of heat-generating chips is inevitable for development, although chip manufac...

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Abstract

The heat exchanger includes body case with opening at up portion, and hollow trough, and upper cover plate matched to the body case. It is watertight seal between the body case and the upper cover plate. The body case and the upper cover plate are sealed together to constitute the heat exchanger with inlet and outlet of working medium. Tiny pole set composed of multiple cross spread tiny poles is setup on surface of bottom board of the trough in the body case. The invention is mainly applicable to heat exchanger.

Description

technical field [0001] The invention relates to the field of microscale heat transfer, in particular to a single-phase ultra-high heat flow microcolumn group heat exchanger. Background technique [0002] With the continuous advancement of science and technology, various cutting-edge technical fields have higher and higher requirements for their cooling systems, which require both high cooling power and small volume, which inevitably involves Micro Heat Transfer (MHT for short) Research. Regardless of academic or technical aspects, micro heat transfer is rising as an emerging main branch of thermal engineering (Thermal Engineering), which will be applied in micro-machines (MEMS), new energy, aerospace, biotechnology, microelectronics, high-power lasers , high-performance heat exchangers, high-temperature gas turbines and nuclear polymerization reactors and other fields have extremely broad application prospects. In various micro heat exchange systems, most researchers are e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/473G12B15/06
Inventor 刘志刚张承武
Owner ENERGY RES INST OF SHANDONG ACAD OF SCI
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