723results about "Instrumental cooling apparatus" patented technology

The present invention provides arrangements for electroluminescent displays 10 comprising a packaged semiconductor light emitting element 12 that has a light emitting display side 16. A heat sink 22 is disposed in the region of a rear side of the light-emitting element 12 opposite to the display side. Electrical connections 28 from the light emitting element 12 pass through said heat sink 22. Drive circuitry 30 for the light emitting element 12 is connected thereto by the electrical connections 28 and spaced apart from the heat sink 22 in such a manner that at least one cooling channel 34 is defined between the heat sink 22 and the drive circuitry 30 for the passage in use of a cooling fluid.

A heat spreader for an emissive display device, such as a plasma display panel or a light emitting diode, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell facing the back surface of the device.

The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

A heat sink fan includes a heat sink (2) that is placed on a heat generating electrical component and a fan motor unit (4) having an axial flow fan (18) for supplying cooling air to the heat sink (2). A engaging portions (14a) of an arm portions (14) of the fan motor unit (4) is engaged with a recesses (10b) of the heat sink (2). Thus, movement of the fan motor unit (4) in the axial direction of the heat sink (2) is restricted so that the fan motor unit (4) is attached to the heat sink (2) securely.

A device having an improved heat dissipation includes: a panel assembly, a chassis base to support the panel assembly, a circuit substrate coupled to the chassis base, a flexible printed cable, respective ends of which are connected to electrode terminals of the panel assembly and a connector of the circuit substrate, the flexible printed cable transmitting electrical signals therebetween, and a heat radiator to dissipate heat generated by an IC and mounted on the chassis base on which the IC of the flexible printed cable is attached. The device can rapidly dissipate heat generated by an IC during operation since a heat radiator is disposed on one end of the chassis base corresponding to the IC of the flexible printed cable. Accordingly, an operating temperature of the IC can be maintained at an appropriate level, thereby improving the reliability of the IC.

A display apparatus having a display module, to display a picture, includes a front casing positioned adjacent to a front and side of the display module, and a rear casing positioned in a rear of the display module and with a plurality of air slits, to dissipate heat generated in the display module. The front casing includes an insulator, to prevent the heat generated in the display module from being transferred exterior of the front casing. The display apparatus prevents heat from being transferred from a display module to the exterior of a front casing. Further, debris created while a screw is inserted does not fall toward the display module, thereby preventing the display module from a malfunction due to the fallen debris.

A display apparatus having a display module, to display a picture, includes a front casing positioned adjacent to a front and side of the display module, and a rear casing positioned in a rear of the display module and with a plurality of air slits, to dissipate heat generated in the display module. The front casing includes an insulator, to prevent the heat generated in the display module from being transferred exterior of the front casing. The display apparatus prevents heat from being transferred from a display module to the exterior of a front casing. Further, debris created while a screw is inserted does not fall toward the display module, thereby preventing the display module from a malfunction due to the fallen debris.

A heat dissipating device includes a heat dissipater and a shield. The shield encloses the heat dissipater therein to form a passage passing through the heat dissipater. The passage includes an air inlet and an air outlet; a fan is arranged at the air inlet of the shield, and a window communicating the passage and outside of the shield is arranged on the shield. The heat dissipating device can satisfy heat dissipating requirement of a center processor unit and electronic elements surrounding the center processor unit accordingly and produce good heat dissipating effect.

The present invention provides a heat sink device for an electronic device. The heat sink device includes a body having an inlet and an outlet formed therein. The heat absorbing fluid flows through a plurality of channels. As the inflow guiding unit extends away from the inlet, the cross section of the inflow guiding unit narrows for guiding substantially the same amount of heat absorbing fluid into each of the channels. An outflow guide unit is formed substantially identically to the inflow guide unit for guiding the heat absorbing fluid from the channel to the outlet.