1220results about "Incadescent cooling arrangements" patented technology

Provided is a display apparatus including a display panel for displaying an image, a heat source arranged at a side surface of at least one side of the display panel, a heat absorbing section for absorbing heat generated by the heat source, a back surface plate arranged at a back surface side of the display panel and made of a metal, a portion of the back surface plate being in close contact with the heat absorbing section, a front surface plate arranged at a front surface side of the display panel and made of a metal, and a middle chassis arranged between the front surface plate and the heat absorbing section.

A luminous lamp having an ultraviolet filtering and explosion-proof thin film is disclosed. An outside of a lamp is coated by a transparent layer which comprises phosphor powder. Energy generated by the lamp is absorbed by the phosphor powder while the lamp is shining. The phosphor powder would release energy to shot brilliance, so as to provide auxiliary lighting after turning off the lamp. Additionally, the phosphor powder can absorb harmful ultraviolet and other harmful radiations with shorter wavelengths to be one part of the thin film for filtering harmful radiations. The harmful ultraviolet can be transformed by the phosphor powder into visible light to red shift radiations with short wavelengths; hence the harmful radiations with shorter wavelengths can be eliminated. The illumination of visible light can be further increased. The transparent layer can catch broken fragments of the outside of the lamp to decrease accidents when the lamp is broken.

An LED lighting device for use in place of a commercial-standard light bulb. For example, a commercial-standard light bulb typically has an outer surface profile, generally defining its shape and the LED lighting device has its own surface profile which substantially mimics the surface profile of the commercial-standard light bulb. Additionally, LED lighting device may further comprise a heat sink for dissipating energy generated by the LED lighting device. In accordance with various embodiments, the heat sink creates the LED lighting device's outer surface profile and is configured to substantially mimic the outer surface profile of the commercial-standard light bulb.

An LED light tube for replacement for fluorescent light tubes includes an elongated cylindrical transparent envelope, a base cap at each end of the envelope, and at least one LED device in electrical communication with the base cap. The LED light tube is adapted for use in troffer light fixtures.

An LED lighting device comprises: a thermally conducting body having an at least one opening that connects with a cavity within the body and a plurality of LEDs mounted in thermal communication with a face of the body and positioned around the opening. One or more passages pass through the body from the cavity to an outer surface of the body and are configured such that in operation air moves through the cavity by thermal convection thereby to provide cooling of the body. Each passage is configured in a direction that extends in a direction at an angle of about 45° to a line that is parallel with the axis of the body toward the outer surface of the body away from the face. The body can be configured such that its outer surface has a form factor resembling an incandescent light bulb or halogen reflector lamp.

The invention discloses a three dimensional LED arrangement and heat management method using a heat transfer or conduction pipe to enable rapid heat transfer from a three dimensional cluster of LEDs to a heatsink with or without active cooling, the light emitted from the three dimensional cluster not being obstructed by a heat sink arrangement such that the light beam profile generated by the light appears similar to that generated by traditional incandescent bulbs.

A lamp comprising a solid state light emitter, the lamp being an A lamp and providing a wall plug efficiency of at least 90 lumens per watt. Also, a lamp comprising a solid state light emitter and a power supply, the emitter being mounted on a heat dissipation element, the dissipation element being spaced from the power supply. Also, a lamp, comprising a solid state light emitter and a heat dissipation element that has a heat dissipation chamber, whereby an ambient medium can enter the chamber, pass through the chamber, and exit. Also, a lamp, comprising a light emissive housing at least one solid state lighting emitter and a first heat dissipation element. Also, a lamp comprising a heat sink comprising a heat dissipation chamber. Also, a lamp comprising first and second heat dissipation elements. Also, a lamp comprising means for creating flow of ambient fluid.

An LED light bulb has a hollow LED support / heat sink (222, 602, 702, 900, 802, 1002, 1102, 1216, 1404, 1502, 1606, 1906) with fins (234, 406, 604, 706, 804, 904, 906,1008, 1106, 1620) extending internally and openings at two ends (230, 232, 1522). Heat generated by the LEDs (238, 908, 1242, 1624, 2504) is conducted through the heat sink fins and is removed by a convectively driven air flow that flows through the LED support / heat sink. LEDs are mounted on multiple external faces (236, 404, 910, 1524, 1622) of the LED support / heat sink thereby providing illumination in all directions. Lenses (1246, 2102, 2104) are provided for the LEDs to make the illumination highly uniform.

A light emitting device package and a back light unit for liquid crystal display using the same wherein a fan is used to forcibly cool an LED package and a back light unit for LCD to increase the heat radiation efficiency and to prevent the degradation of the device.

A light-emitting diode (LED) assembly and a method for fabrication thereof are disclosed. The LED assembly includes a heat-absorbing member in which a working fluid is provided, an LED die (60) directly attached to the heat-absorbing member, and a heat-dissipating member thermally attached to the heat-absorbing member. The heat-absorbing member absorbs heat via the working fluid from the LED die and transfers the heat to the heat-dissipating member for dissipation. The method involves directly attaching the LED die to the heat-absorbing member.

An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.

An LED lamp includes a hollow lamp housing, a front optical part, a rear electrical part provided with a circuit board, and a middle heat dissipation part. The heat dissipation part includes a heat sink, and a mounting seat located in front of and thermally connected to the heat sink. The lamp housing defines a plurality of air exchanging holes therein. The mounting seat is in the form of a polyhedron, and has a polyhedral rear end surface and a plurality of heat absorbing surface. The optical part includes a plurality of light sources respectively arranged on the heat absorbing surfaces, a light reflector located between the heat sink and the light sources, and an optical lens located in front of the light reflector. The heat absorbing surfaces extend forwardly from a peripheral edge of the rear end surface towards the optical lens and facing the optical lens.

A bending LED bulb has a transparent bending tube and a flexible LED strip. The flexible LED strip has a flexible printed circuit board (PCB) and a plurality of LEDs mounted on the flexible PCB and is inserted and fixed in the transparent bending tube. As the LEDs are sequentially mounted on the flexible PCB, the LEDs are adjacent to a wall of the transparent bending tube, and are equally spaced. Accordingly, a lumen value of the bending LED bulb can be raised, and heat generated by the LEDs can be dissipated out through the wall of the transparent bending tube to avoid high temperature arising from accumulation of the waste heat.

A lamp structure includes a lamp housing. A plurality of air intake holes is respectively opened on two opposite sides of the lamp housing, and a plurality of vent holes is opened between the plurality of air intake holes on the two sides. A heat sink and a light-emitting element disposed on the heat sink are disposed inside the lamp housing. The heat sink is surrounded by a plurality of heat dissipation fins to form an accommodation chamber for accommodating a fan. When activated, the fan intakes an airflow respectively through the plurality of air intake holes on two sides of the lamp housing, blows the airflow to the plurality of heat dissipation fins, and ventilates the hot air through the vent holes, thereby realizing a double circulatory heat convection exchange effect.

The present invention relates to an LED illumination apparatus. The apparatus includes a body having a lower portion adapted for coupling to a power socket and an upper portion provided with a power source module accommodating chamber. A heat-dissipating module includes a funnel-shaped hollow case disposed at a top end of the upper portion and filled with a coolant fluid, wherein the hollow case has a small diameter open end adjacent to the body and a large diameter open end remote from the body. A light source module includes amounting substrate disposed at the small diameter open end, an LED mounted on the mounting substrate, and a power source module disposed within the power source module accommodating chamber in a manner electrically connected to and supplying working power to the LED.

LED based lamps and bulbs are disclosed that comprise a pedestal having a plurality of LEDs, wherein the pedestal at least partially comprises a thermally conductive material. A heat sink structure is included with the pedestal thermally coupled to the heat sink structure. A remote phosphor is arranged in relation to the LEDs so that at least some light from the LEDs passes through the remote phosphor and is converted to a different wavelength of light. Some lamp or bulb embodiments can emit a white light combination of light from the LEDs and the remote phosphor. These can include LEDs emitting blue light with the remote phosphor having a material that absorbs blue light and emits yellow or green light. A diffuser can be included to diffuse the emitting light into the desired pattern, such as omnidirectional.

The plasma display device including a plasma display panel, a chassis base disposed substantially parallel to the plasma display panel, and a thermally conductive medium which is disposed between the plasma display panel and the chassis base, and closely adhered to both the plasma display panel and the chassis base. The thermally conductive medium is formed out of gel-like adhesive materials.

The present invention relates to an LED lamp in which, because the lamp has therein a heat dissipation transfer member and the power source base thereof is made of materials including polycarbonate, etc. with a high emission rate of radiation so as to enhance its surface heat dissipation constant, the power source base has sufficient heat dissipation performance and, thus, a separate insulation circuit is not necessary, thereby improving reliability and productivity of the lamp as well as reducing the cost of manufacturing.To this end, the present invention provides an LED lamp comprising one or more LEDs mounted on a PCB, a floodlight cover that transmits light from the LEDs, and a power source base coupled to the floodlight cover and having a terminal at one end thereof, wherein the power source base is made of an insulation material; and the LED lamp also comprises a heat dissipation transfer member that has a heat sink in contact with the PCB on which the LEDs are mounted, and is formed and installed so as to overlap with and be in tight contact with the inner face of either the power source base or the floodlight cover or both.

The invention discloses a three dimensional LED arrangement and heat management method using a heat transfer or conduction pipe to enable rapid heat transfer from a three dimensional cluster of LEDs to a heatsink with or without active cooling, the light emitted from the three dimensional cluster not being obstructed by a heat sink arrangement such that the light beam profile generated by the light appears similar to that generated by traditional incandescent bulbs.

A light emitting apparatus comprising an at least substantially omnidirectional light assembly including an LED-based light source within a light-transmissive envelope. Electronics configured to drive the LED-based light source, the electronics being disposed within a base having a blocking angle no larger than 45°. A plurality of heat dissipation elements (such as fins) in thermal communication with the base and extending adjacent the envelope.

In accordance with the invention, an illumination device comprises a highly thermally conductive substrate having a surface, a plurality of light emitting diodes (LEDs) supported by the surface and arranged in an array to provide illumination. At least one reflective barrier at least partially surrounds each LED. The reflective barrier is shaped to reflect away from the LED light emitted by other LEDs in the array. Advantageously the substrate and reflective barrier are thermally coupled to a heat spreader to dissipate heat generated by the LEDs. The substrate preferably comprises an LTTC-M heat spreader, and the reflective thermal barriers preferably comprise metal ridges or cups.

A light emitting assembly includes a metal substrate for dissipating heat from the assembly. The metal substrate includes an electrically insulating layer or coating on at least one side. Circuit traces are applied to the electrically insulating layer using either thick or thin film techniques. At least the ends of the circuit traces include a metallic section to which leads of light emitting elements are soldered or wire-bonded. A metallic section is provided adjacent the light emitting element to transfer heat to the underlying substrate and / or to reflect light from the element away from the substrate. A clear finish retards tarnishing of the reflecting metallic section.

An apparatus for heat dissipation for a luminaire comprises an active heat transfer device and a thermally-conductive housing. The active heat transfer device causes turbulence in an ambient fluid. The thermally-conductive housing includes a cavity and a first end. The cavity is structured for an electronic ballast of the luminaire to be housed therein and thermally attached to an interior surface of the housing to allow the housing to absorb at least a portion of heat generated by the electronic ballast. The first end is structured for the active heat transfer device to be mountable to the first end of the housing. The housing further includes at least one thermally-conductive protrusion extending from an exterior surface of the housing and exposed to the turbulence in the ambient fluid to transfer at least a portion of the heat absorbed by the housing to the ambient fluid.

A light emitting array including at least a plurality of light emitting elements, each of which is provided thereon with a microlens in one-to-one correspondence. Light emitting portions of the light emitting element are provided having the shape of a rectangle and formed so as to satisfy the relational expression, Lmin≦D≦P, where Lmin is the length of the shorter side of the rectangle, P an alignment pitch of the light emitting elements, and D the diameter of microlens. In addition, light emitting elements are formed in line on a transparent thin film layer to satisfy the relationship, T1≦2·D2, where T1 is the thickness of the transparent thin film layer and D2 the diameter of each microlens. The light emitting array may suitably be included in the light source unit which is then incorporated into image forming apparatuses for forming mono-color or multiple-color images.

An example of this light bulb has a light emitting element (which may be an LED array) mounted on a circuit board. The circuit board is mounted on one end of a heat-conducting frame. An Edison screw or other suitable connector, for attaching the light bulb electrically and mechanically to a receptacle, is mounted on the other end of the frame. A transparent phosphor-coated ball has a flat chord face optically bonded to said array. A light-permeable globular enclosure is mounted on the frame, surrounding the ball and both homogenizing the white light output of the bulb but also concealing the yellowing unlit appearance of the remote phosphor ball centrally located within it.

A light-emitting device (1), comprising an LED-module (3) comprising at least one LED mounted on a carrier and at least one connection pad (10a-b) for electrical connection of the LED module (3), a heat dissipator (2) for dissipating heat generated by the LED when in operation, a connection board (4) comprising a substrate having a conductor pattern for enabling provision of external power to the LED module (3), an interconnecting arrangement (7a-d) comprising at least one connection spring (7a-d) attached to the connection board (4) electrically interconnecting the at least one connection pad (10a-b) of the LED module (3) with the conductor pattern of the connection board (4), and an LED-holder comprising at least one holding spring (7a-d) attached to the connection board (4) exerting a spring force there by pressing the LED-module (3) against the heat dissipator (2) to provide a thermal connection between the LED-module (3) and the heat dissipator (2). The interconnecting arrangement (7a-d) is configured to allow movement between the conductor pattern of the connection board (4) and the at least one connection pad (10a-b). The at least one connection spring (7a-d) constitutes the at least one holding spring (7a-d), to simultaneously electrically interconnect the at least one connection pad (10a-b) of the LED-module (3) with the conductor pattern of the connection board (4) and press the LED-module (3) against the heat dissipator (2).

An illumination device comprises a solid-state lighting device and a heat sink. The heat sink is configured to be attachable to a fixture for a gas-discharge lamp to retrofit existing gas-discharge fixtures. The heat sink is conductively thermally coupled to the solid-state lighting device to dissipate heat generated by the solid-state lighting device.

The invention relates to treatment of solid cancers. More particularly, the invention relates to a combined rotation / raster method, referred to as multi-field charged particle cancer therapy. The system uses a fixed orientation proton source relative to a rotating patient to yield tumor irradiation from multiple directions. The system combines layer-wise tumor irradiation from many directions with controlled energy proton irradiation to deliver peak proton beam energy within a selected tumor volume or irradiated slice. Optionally, the selected tumor volume for irradiation from a given angle is a distal portion of the tumor. In this manner ingress Bragg peak energy is circumferentially spread about the tumor minimizing damage to healthy tissue and peak proton energy is efficiently, accurately, and precisely delivered to the tumor.

A removable LED light module for use in a lighting assembly includes an LED lighting element and one or more resilient members to maintain a compression force between the LED light module and a socket and / or heat dissipating member or thermally conductive housing to provide effective heat transfer from the LED to the heat dissipating member or thermally conductive housing. One or more electrical contact members of the LED light module is configured to releasably contact one or more electrical contact elements of a socket of the lighting assembly when the LED light module is coupled to the socket to establish an electrical connection between the LED light module and the socket, said electrical contact elements positioned behind openings in a surface of the socket to partially obstruct access to said electrical contact elements.