1220results about "Incadescent cooling arrangements" patented technology

An LED light tube for replacement for fluorescent light tubes includes an elongated cylindrical transparent envelope, a base cap at each end of the envelope, and at least one LED device in electrical communication with the base cap. The LED light tube is adapted for use in troffer light fixtures.

The invention discloses a three dimensional LED arrangement and heat management method using a heat transfer or conduction pipe to enable rapid heat transfer from a three dimensional cluster of LEDs to a heatsink with or without active cooling, the light emitted from the three dimensional cluster not being obstructed by a heat sink arrangement such that the light beam profile generated by the light appears similar to that generated by traditional incandescent bulbs.

An apparatus for heat dissipation for a luminaire comprises an active heat transfer device and a thermally-conductive housing. The active heat transfer device causes turbulence in an ambient fluid. The thermally-conductive housing includes a cavity and a first end. The cavity is structured for an electronic ballast of the luminaire to be housed therein and thermally attached to an interior surface of the housing to allow the housing to absorb at least a portion of heat generated by the electronic ballast. The first end is structured for the active heat transfer device to be mountable to the first end of the housing. The housing further includes at least one thermally-conductive protrusion extending from an exterior surface of the housing and exposed to the turbulence in the ambient fluid to transfer at least a portion of the heat absorbed by the housing to the ambient fluid.

A light-emitting device (1), comprising an LED-module (3) comprising at least one LED mounted on a carrier and at least one connection pad (10a-b) for electrical connection of the LED module (3), a heat dissipator (2) for dissipating heat generated by the LED when in operation, a connection board (4) comprising a substrate having a conductor pattern for enabling provision of external power to the LED module (3), an interconnecting arrangement (7a-d) comprising at least one connection spring (7a-d) attached to the connection board (4) electrically interconnecting the at least one connection pad (10a-b) of the LED module (3) with the conductor pattern of the connection board (4), and an LED-holder comprising at least one holding spring (7a-d) attached to the connection board (4) exerting a spring force there by pressing the LED-module (3) against the heat dissipator (2) to provide a thermal connection between the LED-module (3) and the heat dissipator (2). The interconnecting arrangement (7a-d) is configured to allow movement between the conductor pattern of the connection board (4) and the at least one connection pad (10a-b). The at least one connection spring (7a-d) constitutes the at least one holding spring (7a-d), to simultaneously electrically interconnect the at least one connection pad (10a-b) of the LED-module (3) with the conductor pattern of the connection board (4) and press the LED-module (3) against the heat dissipator (2).