Heat radiator

Abstract

The invention relates to a heat radiator, which comprises a base and several wings connected to the base, wherein said base has the first chamber; said wings both have one second chamber; the second chambers are through to the first chamber, to make the base and the wings form one hollow sealing chamber filled with working fluid. The invention arranges chambers in the base and wings, with better temperature uniform property, high heat adsorption amount and lower weight, to improve the heat emission efficiency.

Description

【Technical field】 [0001] The invention relates to the field of heat conduction, in particular to a heat dissipation device. 【Background technique】 [0002] The heat dissipation and cooling of electronic devices usually adopts a heat dissipation device. The traditional heat sink is an extruded aluminum heat sink. The preparation technology of the heat sink is mature, and the aluminum metal itself is relatively soft, easy to process, and low in cost. However, this traditional cooling device only uses metal heat conduction to dissipate heat. With the rapid development of electronic technology, the high frequency and high speed of electronic devices, the density and miniaturization of integrated circuits, the heat generated by electronic devices per unit area has increased sharply, making Traditional heat sinks that rely solely on metal heat conduction are becoming less and less suitable for current heat dissipation needs. [0003] In order to change the pure metal heat dissip...

AI Technical Summary

Problems solved by technology

However, the flat heat conduction area at the bottom of this heat pipe is relatively limited, which cannot improve the heat dissipation efficiency of the entire heat sink. Moreover, such a combination not only increases the complexity of the process, but also increases the weight of the heat sink, so it is difficult to adapt to current electronic products (such as notebook computers) ) focus on lightweight requirements

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