384results about How to "Reduce heat buildup" patented technology

A lamp assembly configured to inductively receive power from a primary coil. The lamp assembly includes a lamp circuit including a secondary and a lamp connected in series. In a first aspect, the lamp circuit includes a capacitor connected in series with the lamp and the secondary to tune the circuit to resonance. The capacitor is preferably selected to have a reactance that is substantially equal to or slightly less than the reactance of the secondary and the impedance of the lamp. In a second aspect, the lamp assembly includes a sealed transparent sleeve that entirely encloses the lamp circuit so that the transparent sleeve is fully closed and unpenetrated. The transparent sleeve is preferably the lamp sleeve itself, with the secondary, capacitor and any desired starter mechanism disposed within its interior.

The cabin cooling system includes a cooling duct positioned proximate and above upper edges of one or more windows of a vehicle to exhaust hot air as the air is heated by inner surfaces of the windows and forms thin boundary layers of heated air adjacent the heated windows. The cabin cooling system includes at least one fan to draw the hot air into the cooling duct at a flow rate that captures the hot air in the boundary layer without capturing a significant portion of the cooler cabin interior air and to discharge the hot air at a point outside the vehicle cabin, such as the vehicle trunk. In a preferred embodiment, the cooling duct has a cross-sectional area that gradually increases from a distal point to a proximal point to the fan inlet to develop a substantially uniform pressure drop along the length of the cooling duct. Correspondingly, this cross-sectional configuration develops a uniform suction pressure and uniform flow rate at the upper edge of the window to capture the hot air in the boundary layer adjacent each window.

Phototherapy treatment devices include a light emitter that is adapted to be placed in close proximity to a wound for applying light/heat energy to the wound to aid in the healing process. The light emitter may comprise a light guide that receives light from a light source or a light source that is affixed to a substrate used to position the light source over the wound.

The following invention relates to a drill bit that will drill a round and precisely sized hole when using a hand-held drill motor. The bit has a unique multi-angle lip relief that cuts faster than a standard drill bit and stays sharp longer as well.

A projectile structured to be discharged from a firearm comprising a body including a nose portion and a tail portion separable from one another when the projectile strikes a target. The body further includes an interface disposed intermediate opposite ends of the body of the projectile and structured to removably interconnect the nose and tail portions. Separation of the nose and tail portions such as when striking a soft tissue or like material target is caused by the tumbling of the projectile and the cooperative structuring of the interface to facilitate separation of the nose and tail portions. Further, the interface is disposed, dimensioned and structured to define the primary area of contact of the projectile body with the rifling or interior surface of the barrel of the firearm. At least one additional embodiment of the projectile comprises one of the nose or tail portions, preferably the tail portion structured to contain a supplemental payload which is carried to the target upon discharge of the firearm.

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

This invention provides buildings with a modular air conditioning system that utilizes solar energy for heating air. This invention contains a solar collector assembly, an inlet assembly and an outlet assembly. The solar collector assembly further comprises a transparent panel, a heat-absorbing set and a support base, and forms paths for heating the air, wherein the heat-absorbing set is made of several simple, light-weight modular heat-absorbing units to form several heat-absorbing channels. Such a design not only can fully utilize the heat-absorbing space on the roof and save the cost for being displayed in marketing channels, but also can be constructed by the users in accordance with their own needs, so as to save cost in modularization. The inlet and outlet assemblies communicate to the heat-absorbing channels in the solar collector assembly and are respectively connected to the pipes and paths leading into and out of the buildings. By switching and adjusting the openings of these pipes and paths, in winter, the preheated air will be introduced into buildings; and in summer, the hot indoor air will be expelled out of the buildings and fresh air will be guided into the buildings. As a result, a more economical air conditioning system is formed.

PCT No. PCT/JP97/00519 Sec. 371 Date Aug. 24, 1998 Sec. 102(e) Date Aug. 24, 1998 PCT Filed Feb. 24, 1997 PCT Pub. No. WO97/31028 PCT Pub. Date Aug. 28, 1997A diene rubber comprised of a conjugated diene homopolymer or a conjugated diene/aromatic vinyl copolymer; the homopolymer or copolymer having on at least one end of its polymer chain a quaternary ammonium group to which four carbon atoms have been bound; at least 10% of the bound conjugated diene units being a vinyl bond; and the homopolymer or copolymer further having a weight average molecular weight (Mw) of 100,000 to 2,000,000. This rubber exhibits well reduced heat build-up, which is an index of a well reduced rolling resistance, and having tensile strength and abrasion resistance.