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1138results about How to "Lower manufacturing requirements" patented technology

Substrate for surface light emitting device and method of manufacturing the substrate, surface light emitting device, lighting apparatus, and backlight including the same

A substrate for a surface light emitting device in which a transparent electrode, an organic thin film layer, and a cathode electrode are sequentially stacked, the substrate including: a transparent support substrate; and a highly refractive layer that is disposed between the support substrate and the transparent electrode and comprises at least one layer having a refractive index that is equal to or greater than a refractive index of the support substrate, wherein the highly refractive layer comprises a light diffusion unit that diffuses light incident from the transparent electrode and a planarized surface that contacts the transparent electrode. Accordingly, a Haze value of the highly refractive layer is set to be 5% or less, and a diameter of bubbles existing in the highly refractive layer is set to be 1 / 10th or less of a thickness of the highly refractive layer.
Owner:SAMSUNG ELECTRONICS CO LTD

Electrochemical device and method for production thereof

An electrochemical device of the present invention includes a positive electrode, a negative electrode, a non-aqueous electrolyte, and a separator. The separator includes a first porous layer composed mainly of a thermoplastic resin and a second porous layer composed mainly of insulating particles with a heat-resistant temperature of 150° C. or higher. The first porous layer is disposed to face the negative electrode.
Owner:MAXELL HLDG LTD

Fabrication method of semiconductor circuit device

InactiveUS7122447B2Prevent wrinklingEasier for the semiconductor wafer to warpSolid-state devicesSemiconductor/solid-state device manufacturingSemiconductorDicing tape
When a semiconductor wafer is formed to be thin, steps need to be taken to prevent warping of the wafer. For this purpose, a protective tape is affixed to a surface of the semiconductor wafer, and a back side of the semiconductor wafer is then ground to a predetermined thickness. A die bonding film is affixed to the back side of the semiconductor wafer, and a dicing tape is affixed on the die bonding film. The dicing tape that is affixed to the semiconductor wafer is held by a holding jig. The protective tape is peeled off from the wafer surface, and the die bonding film is heated to improve the adherence between the semiconductor wafer and the die bonding film. The semiconductor wafer is subjected to dicing for separation into individual semiconductor chips. The semiconductor chips are then die-bonded in a predetermined number onto a wiring substrate to fabricate a semiconductor device.
Owner:RENESAS ELECTRONICS CORP

Disk drive enclosure

Noise is reduced in a disk drive enclosure by using vibration damping materials on the inside surface of the enclosure. These materials and their placement on the inside surface of the enclosure reduce noise without thermally insulating the disk drive. A temperature controlled fan may be used to remove heat by convection while generating a minimum amount of noise. The connection between the disk drive and the external connector of the disk drive enclosure is made more reliable by using a printed circuit board instead of a cable. Because a printed circuit board has a fixed location and fixed layout, variability among disk drive enclosures can be minimized. Also, errors in manufacturing of the disk drive enclosure can be reduced. To facilitate the use of the disk drive in a stripe set, the disk drive enclosure has a set of mechanical interlocks that permit the enclosures to be stacked vertically. In one embodiment, the mechanical interlocks are constructed in a manner that permits stacking in unlocked and locked configurations. The locked configuration may be made permanent using an additional locking mechanism. These mechanical interlocks also may be used to support the enclosure on a desktop. The mechanical interlocks also may be constructed so that they can slide on a rail, permitting the enclosure to be used in a rack mount. The rack mount also may be provided with a quick-release mechanism that interacts with the mechanical interlocks to hold the disk drive enclosure in the rack mount.
Owner:AVID TECHNOLOGY

Thick film heater apparatus

InactiveUS7241131B1Stable and repeatable temperature profileOptimized and precise temperature profileConfectionerySweetmeatsContact padEngineering
A thick-film electric heater having thick-film layers applied directly on a thermally conductive non-flat substrate. Preferably, the substrate is cylindrically shaped. A dielectric layer is silk-screened on the substrate surface. A resistive layer is silk-screened on the dielectric layer to form a circuit for the generation of heat. The resistive layer has at least one resistive trace in a pattern that is discontinuous circumferentially. At least a pair of silk-screened contact pads are applied in electrical communication with the resistive layer for electrical connection to a power source. An insulation layer is applied over the resistive layer.
Owner:HUSKY INJECTION MOLDING SYST LTD +1
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