The present invention provides a method for forming a wiring having a minute shape on a large substrate with a small number of steps, and further a wiring substrate formed by the method. Moreover, the present invention provides a
semiconductor device in which cost reduction and
throughput improvement are possible due to the small number of steps and reduction of materials and which has a
semiconductor element with a minute structure, and further a manufacturing method thereof. According to the present invention, a composition including
metal particles and organic resin is irradiated with
laser light and a part of the
metal particles is baked to form a conductive layer typified by a wiring, an
electrode or the like over a substrate. Further, a
semiconductor device having the baked conductive layer as a wiring or an
electrode is formed.