537results about How to "Achieve solidification" patented technology

The invention relates to the technical field of intelligent home equipment, and discloses a bundling treating method for cooking raw materials, the cooking raw materials and an intelligent cooking machine. The bundling treating method includes the steps that liquid-state or powdery or fine-granular or pasty or dispersed cooking raw materials are subjected to solidifying or large-granular or blocking treatment, or small-sheet cooking raw materials are packaged / bundled so that the cooking raw materials cannot be easily stuck on a feeding box of the intelligent cooking machine, or the cooking rawmaterials with fluffy size are dense, and the cooking raw materials are matched with the feeding device, and are fed into a pot body of the cooking machine. According to the bundling treating methodfor the cooking raw materials, the cooking raw materials and the intelligent cooking machine, the liquid-state or powdery or granular or pasty or sheet-shape or disperse or fluffy cooking raw materials are solidified or made into large-granular materials or blocky materials or buckled / packaged, and the food materials are not easily stuck on the feeding box when being used in the intelligent cooking machine accordingly.

The invention discloses an LED straight-tube lamp comprising a lamp tube, a lamp cap, a power source and a lamp panel, wherein the lamp cap is arranged at one end of the lamp tube; the power source is arranged in the lamp cap; the lamp panel is arranged in the lamp tube and is provided with a light source; the light source is electrically communicated with the power source through the lamp panel; and the lamp panel is a flexible circuit board of which the end part is provided with a light source pad, and holes are formed in the light source pad. The flexible circuit board is directly welded at the power output end of the lamp cap, so that the quality problem caused by conducting wire migration breakage generated by a wire bonding way in the production, transportation and use processes can be avoided.

The invention relates to a latent microcapsule curing agent initiating thermosetting epoxy resin curing at medium temperature and a preparation method of an adhesive thereof. The latent microcapsule curing agent is technically characterized in that the high-activity medium temperature curing agent is taken as a core material, thermoplastic high polymer microspheres are taken as a wall material, the solvent evaporation technology is adopted for preparing the latent microcapsule curing agent with better curing performance and latent performance, and the latent microcapsule curing agent can be applied to an epoxy resin system for preparing the single-component medium temperature curing epoxy resin adhesive. Microcapsules prepared by the method are high in capsule core content, smooth in surfaces, narrow in particle size distribution and good in compatibility with matrix epoxy resin and can be better dispersed in the epoxy resin; and the prepared single component adhesive can realize curing at the medium temperature, the storage period at room temperature is longer and the tensile shear strength performance can be further improved.

A filter unit for sewage treatment and drinking water provision and components which are suitable for the production and the use of such filter units are described. The filter unit has at least one ceramic filter(3) and at least one holder for liquid-tight fixing of the filter in the holder(2), the filter being fixed in the holder by adhesive bonding with the aid of an adhesive. At the same time, the holder is adjusted to the design of the filter, especially to its design as a flat filter. A separate filtrate collecting channel (21)and a holding device (18)for the filter units or other components allow the provision of a finished filter system which is also suitable for retrofitting of already existing plants.

The invention relates to a no-solvent ultraviolet curing glass printing ink and a preparation method thereof; the ink takes high-tractility photochemical active polyester acrylic ester as main ingredient, takes initiator and assistant initiator as curing agents and takes defoamer and flatting agents as auxiliary materials, and then inorganic or organic pigment is mixed, and a functional acrylic ester activated monomer is used as a viscosity regulator; the proportion of the ingredients of the no-solvent ultraviolet curing glass printing ink is as follows: 20-60 parts of multi-functional polyester acrylic ester, 3-8 parts of initiators, 2-5 parts of assistant initiator, 1-3 parts of defoamers, 0-1 part of flatting agent, 8-50 parts of inorganic pigments, 8-15 parts of organic pigments and 10-30 parts of functional acrylic ester activated monomers; the preparation method comprises batching, rolling dispersion and tempering steps; the no-solvent ultraviolet curing glass printing ink has the advantages that: 1. the ink is a 100-percent curing system, has no solvent volatilization and is harm to human body. 2. the curing performance is good, two mercury high pressure lamps with 80-120w / cm are adopted, and complete curing can be realized within 3-6 seconds. 3. the activated monomer is used to regulate the system viscosity, the ink is applied to pad transferring or silk-screen printing, and the universality is strong.

The invention relates to a special ultralow temperature cured laser etching conductive silver paste for a mobile phone touch screen. The conductive silver paste mainly comprises the following components: 40%-75% of a conductive function phase, 6-15% of macromolecule resin, 15-35% of a solvent and 3-15% of an additive. The preparation of the silver paste comprises the steps of macromolecule regioncarrier preparation, conductive silver paste preparation and conductive silver paste post-processing. The conductive silver paste can be completely cured under the condition of an ultralow temperatureof 80-110 DEG C, the temperature is reduced by 20-50 DEG C compared with a curing condition of 130 DEG C of the existing conductive silver paste, and shrinkage, folding and deformation of a substratemembrane material during high-temperature curing are reduced. The paste has excellent laser etching performance, and a clear pattern with the line width / line spacing being 30 microns / 30 microns can be etched; the paste has good adhesion on PET, an ITO film, a silver nanowire conductive film, TIO glass and ordinary glass, the pencil hardness is above 2H, and the square resistance can reach up to 20m[Omega] / square@1mil. In addition, the conductive silver paste is sintered and molded at an ultralow temperature, low in production cost, energy-saving and free of halogen, thereby being an environment-friendly product.

The invention relates to a microsecond pulse generator, particularly relates to an all-solid-state high-voltage microsecond pulse generator based on a FRSPT (Fractional-turn Ratio Saturable Pulse Transformer) and an anti-resonance network, and belongs to the field of pulse power. The pulse generator consists of a charging module, a pulse boosting module, a pulse forming module and a load. The charging module is mainly used for charging the pulse generator, and charges the pulse forming module by the pulse boosting module; the pulse boosting module is the FRSPT; in one aspect, the FRSPT is used as a transformer of the pulse boosting module, and in the other aspect, the FRSPT is used as a switch of the pulse forming module; and the pulse forming module is used for forming a quasi-square wave pulse which is reasonable in leading and lagging edge time and good in flat top degree. The pulse generator is long in service life and stable to operate; all-solid-state compact integration of the pulse generator is implemented; an output square wave is high in quality; and the all-solid-state high-voltage microsecond pulse generator can be used for the fields of a high-power microwave source, foods, sterilization and disinfection, wastewater treatment and the like.

The invention discloses a novel mucky soil composite curing agent, which is formed by mixing cement as gelatinous materials and alkaline stimulation component, expansion component and surface active agent as ingredients. The alkaline stimulation component adopts sodium silicate and sodium hydroxide; the expansion component adopts gypsum, and the surface active agent adopts triethanolamine and high efficiency slushing agent. The novel mucky soil composite curing agent is characterized by also comprising an anti-crack component which adopts glass fiber. The mass percentage of the components are as followed:12-16 percent of cement, 2-5 percent of gypsum, 4-8 percent of sodium silicate, 0.4-0.8 percent of sodium hydroxide, 0.02-0.1 percent of triethanolamine, 1.5-2.5 percent of high efficiency slushing agent, and 0.4-2 percent of glass fiber. The novel mucky soil composite curing agent has the advantages of good tensile strength and fracture resistance, high shearing strength, stable long-term strength, good water stability and the like, and can be used for generating a composite foundation on a mucky soil field through a deep mixing method.

The invention provides high-phenyl-group polysiloxane, a polysiloxane composition containing the high-phenyl-group polysiloxane, and a packaging material or an optical thin film, comprising the composition, and preparation methods and applications thereof. In the high-phenyl-group polysiloxane, molar percentage of phenyl group in organic groups, connected to silicon, in a main chain can reach morethan 50 mol%. The high-phenyl-group polysiloxane can be used for preparing a polysiloxane composition used for the packaging material or optical thin film, especially ultraviolet curing. The preparation method of the polysiloxane composition is simple and can achieve ultraviolet curing. The packaging material or optical thin film can be cured under ultraviolet light, wherein the obtained materialhas excellent optical property, can reach up to 1.64 in refractive index, is equal to or larger than 90% in transmittance within wavelength range of visible light, and has excellent heat resistance.According to thermogravimetic analysis, in a nitrogen atmosphere, temperature can optimally reach up to 480 DEG C when weightlessness is 5%.

The invention discloses a non-cement-based inorganic anchoring bonded bar adhesive and a preparation method thereof. The preparation method of the non-cement-based inorganic anchoring bonded bar adhesive disclosed by the invention comprises the following steps of: uniformly mixing one or several kinds of powder of slag powder, metakaolin powder, coal ash, coarse calcium powder, quartz sand, a swelling agent and the like; mixing a sodium silicate solution, a sodium phosphate solution, a sodium hydroxide solution, water and the like into emulsion; and weighing threes parts of bonded bar adhesive powder and one part of the emulsion in terms of weight part, and uniformly mixing to prepare the non-cement-based inorganic anchoring bonded bar adhesive. The non-cement-based inorganic anchoring bonded bar adhesive disclosed by the invention has the advantages of early strength, high strength, stable volume, good durability, high-temperature resistance, large bond stress to reinforcing steel bars, high anchoring strength, seismic resistance, impact resistance and favorable fatigue resistance, and can be widely applied to surrounding rock anchoring for engineering, equipment foundation bar bonding, building structure bar bonding, reinforcing steel bar anchoring for water conservancy, hydropower, roads, bridges, tunnels and other projects, and the like.